Comprehensive technical parameters, materials, and manufacturing capabilities for your high-tech needs.
| Parameter | Kupfer-Folie | Standard | Erweitert |
|---|---|---|---|
| Conductor (Trace Width) | |||
| 18 μm | 0.125 mm | 0.100 mm | 0,075 mm |
| 35 μm | 0.200 mm | 0.150 mm | 0.150 mm |
| 70 μm | 0.300 mm | 0.250 mm | 0.250 mm |
| 105 μm | 0.350 mm | 0.300 mm | 0.300 mm |
| 140 μm | 0.400 mm | 0.350 mm | 0.350 mm |
| 210 μm | 0.500 mm | 0.450 mm | 0.450 mm |
| Trace Spacing (Gap) | |||
| 18 μm | 0.125 mm | 0.100 mm | 0,075 mm |
| 35 μm | 0.200 mm | 0.150 mm | 0.150 mm |
| 70 μm | 0.300 mm | 0.250 mm | 0.250 mm |
| 105 μm | 0.350 mm | 0.300 mm | 0.300 mm |
| 140 μm | 0.400 mm | 0.350 mm | 0.350 mm |
| 210 μm | 0.500 mm | 0.450 mm | 0.450 mm |
| Ringförmiger Ring | |||
| Standard | - | 0,10 mm | 0,075 mm |
| HDI | - | 0,075 mm | 0.05 mm |
| Mechanisches Bohren | |||
| Min Diameter | - | 0,20 mm | 0,15 mm |
| Min Pitch | - | 0,30 mm | 0.25 mm |
| Seitenverhältnis | - | 8:1 | 10:1 |
| Laser-Mikrovias | |||
| Min Diameter | - | 0,10 mm | 0,075 mm |
| Min Pitch | - | 0,20 mm | 0,15 mm |
| Stacked Vias | - | Yes | Yes |
| Staggered Vias | - | Yes | Yes |
| HDI Structures | |||
| 1+N+1 | - | Yes | Yes |
| 2+N+2 | - | Yes | Yes |
| 3+N+3 | - | On Request | Yes |
| Dicke der Platte | |||
| Minimum | - | 0,2 mm | 0,15 mm |
| Standard Range | - | 0.4–3.2 mm | 0.4–4.0 mm |
| Maximum | - | 6.0 mm | 8.0 mm |
| Kupferdicke | |||
| Inner Layers | - | 0.5–3 oz | 0.5–6 oz |
| Outer Layers | - | 1–3 oz | 1–6 oz |
| Anzahl der Schichten | |||
| Standard | - | 1–16 | 1–24 |
| Maximum | - | - | 32 |
| Impedanzkontrolle | |||
| Standard | - | ±10% | ±7% |
| Präzision | - | ±7% | ±5% |
| Lötmaske | |||
| Min Clearance | - | 0,10 mm | 0,075 mm |
| Colors | - | Green/Red/Blue | Any (Pantone) |
| Siebdruck | |||
| Min Line Width | - | 0,15 mm | 0,10 mm |
| Board Dimensions & Accuracy | |||
| Min Size | - | 5×5 mm | 5×5 mm |
| Max Size | - | 500×600 mm | 600×1200 mm |
| Genauigkeit | - | ±0.1 mm | ±0.05 mm |
| Material Category | Parameter / TG | Beschreibung | Application Cases |
|---|---|---|---|
| Standard & High TG (FR-4) | |||
| Material Typ | FR-4 Standard | FR-4 High TG | FR-4 Low Loss |
| Hersteller | Shengyi / KB / NanYa | Isola / Panasonic | Rogers (Hybrid) |
| Tg (°C) | 130–140 | 170–180 | 180+ |
| DK (1GHz) | 4.2–4.5 | 4.0–4.3 | 3.5–4.0 |
| DF | 0.015–0.02 | 0.010–0.015 | 0.005–0.010 |
| Betriebstemperatur | -40 ~ 105°C | -40 ~ 130°C | -55 ~ 150°C |
| High Frequency (RF / Microwave) | |||
| Rogers-Reihe | RO4003C | RO4350B | RT5880 |
| DK | 3.38 | 3.48 | 2.20 |
| DF | 0.0027 | 0.0037 | 0.0009 |
| Anwendungen | RF / 5G Antennas | High-speed Data | Radar / Microwave |
| Specialty Substrates | |||
| Aluminum Base | 0.5–3.0 mm, Thermal conductivity 1–3 W/mK | ||
| Copper Base | High Power / LED Lighting / Automotive Power | ||
| Ceramic (Al2O3 / AlN) | Ultra-high Temperature, Power RF | ||
| Flex PCB (FPC) | PI / PET, 1–6 layers, dynamic flexing | ||
| Rigid-Flex | Hybrid construction, 2–12 layers | ||
| Oberflächenbehandlungen | |||
| HASL (SnPb) | Standard | Low cost solution | Not for fine-pitch BGA |
| HASL Lead-Free | RoHS-konform | Eco-friendly alternative | Pitch > 0.5 mm |
| ENIG | Ni 3–6 μm | Au 0.05–0.1 μm | Flat surface, most popular |
| ENEPIG | Ni/Pd/Au | Ultra-high reliability | Gold wire bonding |
| OSP | Organic Protection | Kostengünstig | Limited shelf life |
| Chemisch Silber | Ag 0.1–0.3 μm | Excellent conductivity | Environmentally sensitive |
| Hard Gold | Au 0.5–2 μm | Contact connectors | High durability & cost |
| Design Parameter | Minimum Value | Empfohlen | Technical Note |
|---|---|---|---|
| Core Routing Guidelines | |||
| Min Trace Width | 0,075 mm | ≥ 0.10 mm | HDI capable of 0.05 mm |
| Min Spacing | 0,075 mm | ≥ 0.10 mm | HDI capable of 0.05 mm |
| Min Annular Ring | 0.05 mm | ≥ 0.075 mm | Standard through-hole |
| Min Drill Size | 0,15 mm | ≥ 0.20 mm | Mechanical drilling range |
| Seitenverhältnis | ≤ 10:1 | 8:1 optimal | Affects plating reliability |
| BGA & Fine-Pitch Components | |||
| BGA Pitch 1.0 mm | Standard | Through-hole via | Traditional breakout |
| BGA Pitch 0.65 mm | HDI | Microvia-Technologie | Increased layer count |
| BGA Pitch 0.4 mm | Adv. HDI | Via-in-pad (Vip-po) | Filled & Capped Vias |
| Via-in-Pad | Supported | Resin filled | Surface planarization required |
| High-Speed & Impedance | |||
| Differential Pairs | 100Ω / 90Ω | ±10% std | Tight tolerance ±5% avail |
| Single-Ended | 50Ω | Matched length | Critical for SI analysis |
| Backdrill | Supported | Via stub removal | Improves signal integrity |
| Compliance & Quality Standards | |||
| IPC Class | Klasse 2 | Klasse 3 | Industrial / Medical / Aero |
| Zertifizierungen | UL / RoHS | ISO 9001 / 14001 | IATF 16949 (Automotive) |
From rapid prototyping to mass production – we deliver industry-leading quality, technical precision, and reliable delivery cycles.
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