PCB Manufacturing Capabilities | Precision PCB & PCBA Technology Overview

Parâmetro	Folha de cobre	Padrão	Avançado
Conductor (Trace Width)
18 μm	0.125 mm	0.100 mm	0,075 mm
35 μm	0.200 mm	0.150 mm	0.150 mm
70 μm	0.300 mm	0.250 mm	0.250 mm
105 μm	0.350 mm	0.300 mm	0.300 mm
140 μm	0.400 mm	0.350 mm	0.350 mm
210 μm	0.500 mm	0.450 mm	0.450 mm
Trace Spacing (Gap)
18 μm	0.125 mm	0.100 mm	0,075 mm
35 μm	0.200 mm	0.150 mm	0.150 mm
70 μm	0.300 mm	0.250 mm	0.250 mm
105 μm	0.350 mm	0.300 mm	0.300 mm
140 μm	0.400 mm	0.350 mm	0.350 mm
210 μm	0.500 mm	0.450 mm	0.450 mm
Anel anular
Padrão	-	0,10 mm	0,075 mm
IDH	-	0,075 mm	0.05 mm
Perfuração mecânica
Min Diameter	-	0,20 mm	0,15 mm
Min Pitch	-	0,30 mm	0.25 mm
Proporção da imagem	-	8:1	10:1
Microvias a laser
Min Diameter	-	0,10 mm	0,075 mm
Min Pitch	-	0,20 mm	0,15 mm
Stacked Vias	-	Sim	Sim
Staggered Vias	-	Sim	Sim
HDI Structures
1+N+1	-	Sim	Sim
2+N+2	-	Sim	Sim
3+N+3	-	On Request	Sim
Espessura da placa
Minimum	-	0,2 mm	0,15 mm
Standard Range	-	0.4–3.2 mm	0.4–4.0 mm
Maximum	-	6.0 mm	8.0 mm
Espessura do cobre
Inner Layers	-	0.5–3 oz	0.5–6 oz
Outer Layers	-	1–3 oz	1–6 oz
Contagem de camadas
Padrão	-	1–16	1–24
Maximum	-	-	32
Controle de impedância
Padrão	-	±10%	±7%
Precisão	-	±7%	±5%
Máscara de solda
Min Clearance	-	0,10 mm	0,075 mm
Colors	-	Green/Red/Blue	Any (Pantone)
Serigrafia
Min Line Width	-	0,15 mm	0,10 mm
Board Dimensions & Accuracy
Min Size	-	5×5 mm	5×5 mm
Max Size	-	500×600 mm	600×1200 mm
Precisão	-	±0.1 mm	±0,05 mm

Parâmetro

Folha de cobre

Padrão

Avançado

Conductor (Trace Width)

18 μm

0.125 mm

0.100 mm

0,075 mm

35 μm

0.200 mm

0.150 mm

70 μm

0.300 mm

0.250 mm

105 μm

0.350 mm

0.300 mm

140 μm

0.400 mm

0.350 mm

210 μm

0.500 mm

0.450 mm

Trace Spacing (Gap)

18 μm

0.125 mm

0.100 mm

0,075 mm

35 μm

0.200 mm

0.150 mm

70 μm

0.300 mm

0.250 mm

105 μm

0.350 mm

0.300 mm

140 μm

0.400 mm

0.350 mm

210 μm

0.500 mm

0.450 mm

Anel anular

Padrão

0,10 mm

0,075 mm

IDH

0,075 mm

0.05 mm

Perfuração mecânica

Min Diameter

0,20 mm

0,15 mm

Min Pitch

0,30 mm

0.25 mm

Proporção da imagem

8:1

10:1

Microvias a laser

Min Diameter

0,10 mm

0,075 mm

Min Pitch

0,20 mm

0,15 mm

Stacked Vias

Sim

Staggered Vias

Sim

HDI Structures

1+N+1

Sim

2+N+2

Sim

3+N+3

On Request

Sim

Espessura da placa

Minimum

0,2 mm

0,15 mm

Standard Range

0.4–3.2 mm

0.4–4.0 mm

Maximum

6.0 mm

8.0 mm

Espessura do cobre

Inner Layers

0.5–3 oz

0.5–6 oz

Outer Layers

1–3 oz

1–6 oz

Contagem de camadas

Padrão

1–16

1–24

Maximum

Controle de impedância

Padrão

±10%

±7%

Precisão

±7%

±5%

Máscara de solda

Min Clearance

0,10 mm

0,075 mm

Colors

Green/Red/Blue

Any (Pantone)

Serigrafia

Min Line Width

0,15 mm

0,10 mm

Board Dimensions & Accuracy

Min Size

5×5 mm

Max Size

500×600 mm

600×1200 mm

Precisão

±0.1 mm

±0,05 mm

Material Category	Parameter / TG	Descrição	Application Cases
Standard & High TG (FR-4)
Tipo de material	FR-4 Standard	FR-4 High TG	FR-4 Low Loss
Fabricantes	Shengyi / KB / NanYa	Isola / Panasonic	Rogers (Hybrid)
Tg (°C)	130–140	170–180	180+
DK (1GHz)	4.2–4.5	4.0–4.3	3.5–4.0
DF	0.015–0.02	0.010–0.015	0.005–0.010
Temperatura de operação	-40 ~ 105°C	-40 ~ 130°C	-55 ~ 150°C
High Frequency (RF / Microwave)
Série Rogers	RO4003C	RO4350B	RT5880
DK	3.38	3.48	2.20
DF	0.0027	0.0037	0.0009
Aplicativos	RF / 5G Antennas	High-speed Data	Radar / Microwave
Specialty Substrates
Aluminum Base	0.5–3.0 mm, Thermal conductivity 1–3 W/mK
Copper Base	High Power / LED Lighting / Automotive Power
Ceramic (Al2O3 / AlN)	Ultra-high Temperature, Power RF
Flex PCB (FPC)	PI / PET, 1–6 layers, dynamic flexing
Rígido-flexível	Hybrid construction, 2–12 layers
Acabamentos de superfície
HASL (SnPb)	Padrão	Low cost solution	Not for fine-pitch BGA
HASL Lead-Free	Compatível com RoHS	Eco-friendly alternative	Pitch > 0.5 mm
ENIG	Ni 3–6 μm	Au 0.05–0.1 μm	Flat surface, most popular
ENEPIG	Ni/Pd/Au	Ultra-high reliability	Gold wire bonding
OSP	Organic Protection	Custo-benefício	Limited shelf life
Prata de imersão	Ag 0.1–0.3 μm	Excellent conductivity	Environmentally sensitive
Hard Gold	Au 0.5–2 μm	Contact connectors	High durability & cost

Material Category

Parameter / TG

Descrição

Application Cases

Standard & High TG (FR-4)

Tipo de material

FR-4 Standard

FR-4 High TG

FR-4 Low Loss

Fabricantes

Shengyi / KB / NanYa

Isola / Panasonic

Rogers (Hybrid)

Tg (°C)

130–140

170–180

180+

DK (1GHz)

4.2–4.5

4.0–4.3

3.5–4.0

0.015–0.02

0.010–0.015

0.005–0.010

Temperatura de operação

-40 ~ 105°C

-40 ~ 130°C

-55 ~ 150°C

High Frequency (RF / Microwave)

Série Rogers

RO4003C

RO4350B

RT5880

3.38

3.48

2.20

0.0027

0.0037

0.0009

Aplicativos

RF / 5G Antennas

High-speed Data

Radar / Microwave

Specialty Substrates

Aluminum Base

0.5–3.0 mm, Thermal conductivity 1–3 W/mK

Copper Base

High Power / LED Lighting / Automotive Power

Ceramic (Al2O3 / AlN)

Ultra-high Temperature, Power RF

Flex PCB (FPC)

PI / PET, 1–6 layers, dynamic flexing

Rígido-flexível

Hybrid construction, 2–12 layers

Acabamentos de superfície

HASL (SnPb)

Padrão

Low cost solution

Not for fine-pitch BGA

HASL Lead-Free

Compatível com RoHS

Eco-friendly alternative

Pitch > 0.5 mm

ENIG

Ni 3–6 μm

Au 0.05–0.1 μm

Flat surface, most popular

ENEPIG

Ni/Pd/Au

Ultra-high reliability

Gold wire bonding

OSP

Organic Protection

Custo-benefício

Limited shelf life

Prata de imersão

Ag 0.1–0.3 μm

Excellent conductivity

Environmentally sensitive

Hard Gold

Au 0.5–2 μm

Contact connectors

High durability & cost

Design Parameter	Minimum Value	Recomendado	Technical Note
Core Routing Guidelines
Min Trace Width	0,075 mm	≥ 0.10 mm	HDI capable of 0.05 mm
Min Spacing	0,075 mm	≥ 0.10 mm	HDI capable of 0.05 mm
Min Annular Ring	0.05 mm	≥ 0.075 mm	Standard through-hole
Min Drill Size	0,15 mm	≥ 0.20 mm	Mechanical drilling range
Proporção da imagem	≤ 10:1	8:1 optimal	Affects plating reliability
BGA & Fine-Pitch Components
BGA Pitch 1.0 mm	Padrão	Through-hole via	Traditional breakout
BGA Pitch 0.65 mm	IDH	Tecnologia Microvia	Increased layer count
BGA Pitch 0.4 mm	Adv. HDI	Via-in-pad (Vip-po)	Filled & Capped Vias
Via-in-Pad	Supported	Resin filled	Surface planarization required
High-Speed & Impedance
Differential Pairs	100Ω / 90Ω	±10% std	Tight tolerance ±5% avail
Single-Ended	50Ω	Matched length	Critical for SI analysis
Backdrill	Supported	Via stub removal	Improves signal integrity
Compliance & Quality Standards
IPC Class	Classe 2	3ª série	Industrial / Medical / Aero
Certificações	UL / RoHS	ISO 9001 / 14001	IATF 16949 (Automotive)

Design Parameter

Minimum Value

Recomendado

Technical Note

Core Routing Guidelines

Min Trace Width

0,075 mm

≥ 0.10 mm

HDI capable of 0.05 mm

Min Spacing

0,075 mm

≥ 0.10 mm

HDI capable of 0.05 mm

Min Annular Ring

0.05 mm

≥ 0.075 mm

Standard through-hole

Min Drill Size

0,15 mm

≥ 0.20 mm

Mechanical drilling range

Proporção da imagem

≤ 10:1

8:1 optimal

Affects plating reliability

BGA & Fine-Pitch Components

BGA Pitch 1.0 mm

Padrão

Through-hole via

Traditional breakout

BGA Pitch 0.65 mm

IDH

Tecnologia Microvia

Increased layer count

BGA Pitch 0.4 mm

Adv. HDI

Via-in-pad (Vip-po)

Filled & Capped Vias

Via-in-Pad

Supported

Resin filled

Surface planarization required

High-Speed & Impedance

Differential Pairs

100Ω / 90Ω

±10% std

Tight tolerance ±5% avail

Single-Ended

50Ω

Matched length

Critical for SI analysis

Backdrill

Supported

Via stub removal

Improves signal integrity

Compliance & Quality Standards

IPC Class

Classe 2

3ª série

Industrial / Medical / Aero

Certificações

UL / RoHS

ISO 9001 / 14001

IATF 16949 (Automotive)

Camadas

Dimensões (mm)

Quantidade

Espessura

PCB Production Capabilities

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