PCB Manufacturing Capabilities | Precision PCB & PCBA Technology Overview

Parámetro	Lámina de cobre	Estándar	Avanzado
Conductor (Trace Width)
18 μm	0.125 mm	0.100 mm	0,075 mm
35 μm	0.200 mm	0.150 mm	0.150 mm
70 μm	0.300 mm	0.250 mm	0.250 mm
105 μm	0.350 mm	0.300 mm	0.300 mm
140 μm	0.400 mm	0.350 mm	0.350 mm
210 μm	0.500 mm	0.450 mm	0.450 mm
Trace Spacing (Gap)
18 μm	0.125 mm	0.100 mm	0,075 mm
35 μm	0.200 mm	0.150 mm	0.150 mm
70 μm	0.300 mm	0.250 mm	0.250 mm
105 μm	0.350 mm	0.300 mm	0.300 mm
140 μm	0.400 mm	0.350 mm	0.350 mm
210 μm	0.500 mm	0.450 mm	0.450 mm
Anillo anular
Estándar	-	0,10 mm	0,075 mm
HDI	-	0,075 mm	0.05 mm
Perforación mecánica
Min Diameter	-	0,20 mm	0,15 mm
Min Pitch	-	0,30 mm	0.25 mm
Relación de aspecto	-	8:1	10:1
Microvías por láser
Min Diameter	-	0,10 mm	0,075 mm
Min Pitch	-	0,20 mm	0,15 mm
Stacked Vias	-	Yes	Yes
Staggered Vias	-	Yes	Yes
HDI Structures
1+N+1	-	Yes	Yes
2+N+2	-	Yes	Yes
3+N+3	-	On Request	Yes
Grosor del tablero
Minimum	-	0,2 mm	0,15 mm
Standard Range	-	0.4–3.2 mm	0.4–4.0 mm
Maximum	-	6.0 mm	8.0 mm
Espesor del cobre
Inner Layers	-	0.5–3 oz	0.5–6 oz
Outer Layers	-	1–3 oz	1–6 oz
Recuento de capas
Estándar	-	1–16	1–24
Maximum	-	-	32
Control de la impedancia
Estándar	-	±10%	±7%
Precisión	-	±7%	±5%
Máscara de soldadura
Min Clearance	-	0,10 mm	0,075 mm
Colors	-	Green/Red/Blue	Any (Pantone)
Serigrafía
Min Line Width	-	0,15 mm	0,10 mm
Board Dimensions & Accuracy
Min Size	-	5×5 mm	5×5 mm
Max Size	-	500×600 mm	600×1200 mm
Precisión	-	±0.1 mm	±0.05 mm

Parámetro

Lámina de cobre

Estándar

Avanzado

Conductor (Trace Width)

18 μm

0.125 mm

0.100 mm

0,075 mm

35 μm

0.200 mm

0.150 mm

70 μm

0.300 mm

0.250 mm

105 μm

0.350 mm

0.300 mm

140 μm

0.400 mm

0.350 mm

210 μm

0.500 mm

0.450 mm

Trace Spacing (Gap)

18 μm

0.125 mm

0.100 mm

0,075 mm

35 μm

0.200 mm

0.150 mm

70 μm

0.300 mm

0.250 mm

105 μm

0.350 mm

0.300 mm

140 μm

0.400 mm

0.350 mm

210 μm

0.500 mm

0.450 mm

Anillo anular

Estándar

0,10 mm

0,075 mm

HDI

0,075 mm

0.05 mm

Perforación mecánica

Min Diameter

0,20 mm

0,15 mm

Min Pitch

0,30 mm

0.25 mm

Relación de aspecto

8:1

10:1

Microvías por láser

Min Diameter

0,10 mm

0,075 mm

Min Pitch

0,20 mm

0,15 mm

Stacked Vias

Yes

Staggered Vias

Yes

HDI Structures

1+N+1

Yes

2+N+2

Yes

3+N+3

On Request

Yes

Grosor del tablero

Minimum

0,2 mm

0,15 mm

Standard Range

0.4–3.2 mm

0.4–4.0 mm

Maximum

6.0 mm

8.0 mm

Espesor del cobre

Inner Layers

0.5–3 oz

0.5–6 oz

Outer Layers

1–3 oz

1–6 oz

Recuento de capas

Estándar

1–16

1–24

Maximum

Control de la impedancia

Estándar

±10%

±7%

Precisión

±7%

±5%

Máscara de soldadura

Min Clearance

0,10 mm

0,075 mm

Colors

Green/Red/Blue

Any (Pantone)

Serigrafía

Min Line Width

0,15 mm

0,10 mm

Board Dimensions & Accuracy

Min Size

5×5 mm

Max Size

500×600 mm

600×1200 mm

Precisión

±0.1 mm

±0.05 mm

Material Category	Parameter / TG	Descripción	Application Cases
Standard & High TG (FR-4)
Tipo de material	FR-4 Standard	FR-4 High TG	FR-4 Low Loss
Fabricantes	Shengyi / KB / NanYa	Isola / Panasonic	Rogers (Hybrid)
Tg (°C)	130–140	170–180	180+
DK (1GHz)	4.2–4.5	4.0–4.3	3.5–4.0
DF	0.015–0.02	0.010–0.015	0.005–0.010
Temperatura de funcionamiento	-40 ~ 105°C	-40 ~ 130°C	-55 ~ 150°C
High Frequency (RF / Microwave)
Serie Rogers	RO4003C	RO4350B	RT5880
DK	3.38	3.48	2.20
DF	0.0027	0.0037	0.0009
Aplicaciones	RF / 5G Antennas	High-speed Data	Radar / Microwave
Specialty Substrates
Aluminum Base	0.5–3.0 mm, Thermal conductivity 1–3 W/mK
Copper Base	High Power / LED Lighting / Automotive Power
Ceramic (Al2O3 / AlN)	Ultra-high Temperature, Power RF
Flex PCB (FPC)	PI / PET, 1–6 layers, dynamic flexing
Rígido-flexible	Hybrid construction, 2–12 layers
Acabados superficiales
HASL (SnPb)	Estándar	Low cost solution	Not for fine-pitch BGA
HASL Lead-Free	Conforme a RoHS	Eco-friendly alternative	Pitch > 0.5 mm
ENIG	Ni 3–6 μm	Au 0.05–0.1 μm	Flat surface, most popular
ENEPIG	Ni/Pd/Au	Ultra-high reliability	Gold wire bonding
OSP	Organic Protection	Rentable	Limited shelf life
Inmersión Plata	Ag 0.1–0.3 μm	Excellent conductivity	Environmentally sensitive
Hard Gold	Au 0.5–2 μm	Contact connectors	High durability & cost

Material Category

Parameter / TG

Descripción

Application Cases

Standard & High TG (FR-4)

Tipo de material

FR-4 Standard

FR-4 High TG

FR-4 Low Loss

Fabricantes

Shengyi / KB / NanYa

Isola / Panasonic

Rogers (Hybrid)

Tg (°C)

130–140

170–180

180+

DK (1GHz)

4.2–4.5

4.0–4.3

3.5–4.0

0.015–0.02

0.010–0.015

0.005–0.010

Temperatura de funcionamiento

-40 ~ 105°C

-40 ~ 130°C

-55 ~ 150°C

High Frequency (RF / Microwave)

Serie Rogers

RO4003C

RO4350B

RT5880

3.38

3.48

2.20

0.0027

0.0037

0.0009

Aplicaciones

RF / 5G Antennas

High-speed Data

Radar / Microwave

Specialty Substrates

Aluminum Base

0.5–3.0 mm, Thermal conductivity 1–3 W/mK

Copper Base

High Power / LED Lighting / Automotive Power

Ceramic (Al2O3 / AlN)

Ultra-high Temperature, Power RF

Flex PCB (FPC)

PI / PET, 1–6 layers, dynamic flexing

Rígido-flexible

Hybrid construction, 2–12 layers

Acabados superficiales

HASL (SnPb)

Estándar

Low cost solution

Not for fine-pitch BGA

HASL Lead-Free

Conforme a RoHS

Eco-friendly alternative

Pitch > 0.5 mm

ENIG

Ni 3–6 μm

Au 0.05–0.1 μm

Flat surface, most popular

ENEPIG

Ni/Pd/Au

Ultra-high reliability

Gold wire bonding

OSP

Organic Protection

Rentable

Limited shelf life

Inmersión Plata

Ag 0.1–0.3 μm

Excellent conductivity

Environmentally sensitive

Hard Gold

Au 0.5–2 μm

Contact connectors

High durability & cost

Design Parameter	Minimum Value	Recomendado	Technical Note
Core Routing Guidelines
Min Trace Width	0,075 mm	≥ 0.10 mm	HDI capable of 0.05 mm
Min Spacing	0,075 mm	≥ 0.10 mm	HDI capable of 0.05 mm
Min Annular Ring	0.05 mm	≥ 0.075 mm	Standard through-hole
Min Drill Size	0,15 mm	≥ 0.20 mm	Mechanical drilling range
Relación de aspecto	≤ 10:1	8:1 optimal	Affects plating reliability
BGA & Fine-Pitch Components
BGA Pitch 1.0 mm	Estándar	Through-hole via	Traditional breakout
BGA Pitch 0.65 mm	HDI	Tecnología Microvia	Increased layer count
BGA Pitch 0.4 mm	Adv. HDI	Via-in-pad (Vip-po)	Filled & Capped Vias
Vía en almohadilla	Supported	Resin filled	Surface planarization required
High-Speed & Impedance
Differential Pairs	100Ω / 90Ω	±10% std	Tight tolerance ±5% avail
Single-Ended	50Ω	Matched length	Critical for SI analysis
Backdrill	Supported	Via stub removal	Improves signal integrity
Compliance & Quality Standards
IPC Class	Clase 2	Clase 3	Industrial / Medical / Aero
Certificaciones	UL / RoHS	ISO 9001 / 14001	IATF 16949 (Automotive)

Design Parameter

Minimum Value

Recomendado

Technical Note

Core Routing Guidelines

Min Trace Width

0,075 mm

≥ 0.10 mm

HDI capable of 0.05 mm

Min Spacing

0,075 mm

≥ 0.10 mm

HDI capable of 0.05 mm

Min Annular Ring

0.05 mm

≥ 0.075 mm

Standard through-hole

Min Drill Size

0,15 mm

≥ 0.20 mm

Mechanical drilling range

Relación de aspecto

≤ 10:1

8:1 optimal

Affects plating reliability

BGA & Fine-Pitch Components

BGA Pitch 1.0 mm

Estándar

Through-hole via

Traditional breakout

BGA Pitch 0.65 mm

HDI

Tecnología Microvia

Increased layer count

BGA Pitch 0.4 mm

Adv. HDI

Via-in-pad (Vip-po)

Filled & Capped Vias

Vía en almohadilla

Supported

Resin filled

Surface planarization required

High-Speed & Impedance

Differential Pairs

100Ω / 90Ω

±10% std

Tight tolerance ±5% avail

Single-Ended

50Ω

Matched length

Critical for SI analysis

Backdrill

Supported

Via stub removal

Improves signal integrity

Compliance & Quality Standards

IPC Class

Clase 2

Clase 3

Industrial / Medical / Aero

Certificaciones

UL / RoHS

ISO 9001 / 14001

IATF 16949 (Automotive)

Capas

Dimensiones (mm)

Cantidad

Espesor

PCB Production Capabilities

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