Engineered for the future of mobility. IATF 16949 certified solutions for EV powertrains, ADAS sensors, and intelligent cockpit systems.
Demandez un devis instantanéMeeting the most stringent safety and durability standards in the global automotive supply chain.
Rigorous quality management systems guaranteed for zero-defect automotive electronic assembly.
Boards designed to survive extreme under-the-hood temperatures (-40°C to +150°C) and constant mechanical stress.
Specialized in heavy copper for high-voltage battery systems and high-frequency RF for autonomous Radar/LiDAR.
✓ IATF 16949 & AEC-Q100 Compliance
Powering electric drivetrains and intelligent safety systems with zero-defect boards.

Handling extreme current loads in battery management systems and traction inverters with heavy copper.

High-frequency materials and HDI stack-ups for 77GHz Radar modules and high-res infotainment clusters.
"Their IATF 16949 compliance and extreme durability testing are essential for our powertrain modules. Zero field failures to date."
"Consistent high-frequency performance. Their Rogers stack-up helped us achieve the 300m range required for our ADAS Radar sensors."
"Reliable partner for high-voltage BMS boards. Full traceability and professional DFM support for our complex lamination needs."
"Their technical advice on heavy copper thermal dissipation was a game changer for our new inverter design. High quality, fast turnaround."
"Excellent support for our autonomous driving computer. 24-layer HDI boards with perfect signal integrity and traceability."
"Top-tier automotive quality control. Their ESS and thermal cycling tests give us total confidence in field reliability for safety components."
| Paramètres | Norme automobile | High-Performance EV |
|---|---|---|
| Matériau de base | FR4 (Tg élevée : 150-180) | Teflon, Rogers, Metal Core |
| Épaisseur du cuivre | entre 30 et 90 grammes | Up to 12oz (Power Elec) |
| Traitement de surface | ENIG / Argent par immersion | ENEPIG / Hard Gold Pinning |
| Dissipation de la chaleur | Thermal Vias | Aluminum/Copper Base Substrates |
| Validation | AEC-Q100 | Automotive ESS / Thermal Shock |
| Contrôle de la qualité | Classe 2 de l'IPC | IATF 16949 / IPC Class 3 |
Rigorous DFM checks focused on thermal dissipation and vibration tolerance.
Sub-micron laser precision for dense ADAS sensor circuit patterns.
High-stress lamination to prevent delamination in engine/battery environments.
Environmental Stress Screening for 100% field failure prevention.