Powering the next generation of smart devices. Precision HDI and Rigid-Flex solutions for smartphones, wearables, and IoT ecosystems.
اطلب عرض أسعار فوريDriving innovation through miniaturization, high-speed performance, and cost-effective mass production.
Industry-leading HDI technology with any-layer microvias to fit complex circuits into sleek, compact housings.
Streamlined manufacturing processes designed to deliver premium quality products at competitive market prices.
Scalable production capabilities that pivot from fast prototyping to high-volume output to meet seasonal demands.
✓ ISO 9001 & UL Certified Production
Supporting high-performance handhelds and intelligent home devices with high-density interconnects.

Specialized in any-layer HDI and thin substrates for smartphones, tablets, and gaming consoles.

Flexible and Rigid-Flex PCBs designed for curved form factors and durable 24/7 wearable integration.
"Their ability to handle any-layer HDI for our flagship smartphone was impressive. Signal integrity is excellent even at high speeds."
"The Rigid-Flex design they provided for our latest smartwatch allowed us to reduce the device thickness by 15%. Highly recommended."
"Fast prototyping helped us hit our product launch window. Their DFM feedback saved us two weeks of design revisions."
"Consistency in mass production is key for us. We've scaled from 1k to 100k units with Topfast with zero drop in quality."
"Quality finish and 100% testing. Our consumer tablets have seen a significant reduction in DOA rates since switching to Topfast."
"Professional communication and excellent technical support for halogen-free material transitions. Perfect for our eco-friendly initiatives."
| المعلمة | Standard Consumer | High-End Device (HDI) |
|---|---|---|
| المادة الأساسية | FR4 (Standard) | Halogen-Free, BT Resin, PI |
| سُمك النحاس | 0.5oz - 1oz | Up to 3oz (Power charging) |
| معالجة السطح | OSP / ENIG | ENEPIG / Immersion Tin |
| الحد الأدنى من التتبع/المساحة | 3 / 3 ميل | 1.5 / 1.5 mil (Fine Pitch) |
| التحقق من الصحة | CE / FCC / RoHS | EMI shielding / High-Speed SI |
| مراقبة الجودة | الفئة 2 من IPC | IPC Class 2 & 3 Support |
Immediate DFM analysis to optimize for high-yield, compact mass production.
Laser direct imaging and microvia drilling for state-of-the-art mobile circuits.
Advanced impedance control testing to ensure flawless 5G and Wi-Fi connectivity.
100% AOI and electrical testing to guarantee field reliability in consumer hands.