Engineered for extreme environments. Certified to AS9100D standards. Delivering zero-defect printed circuit boards for critical aviation and space missions globally.
Request an Instant QuotePrecision manufacturing for mission-critical applications.
AS9100D & NADCAP certified facilities, ensuring compliance with rigorous defense and aviation protocols.
Handling high-performance laminates (Polyimide, Rogers, PTFE) for severe thermal and HF environments.
100% AOI, real-time X-ray, and out-of-atmosphere reliability testing for zero-defect results.
✓ Direct engineer support
Precision manufacturing standards optimized for zero-gravity and extreme environments.
Reducing payload mass while ensuring absolute connectivity reliability under multi-directional g-forces.
Delivering high-density interconnects for complex control systems, radar modules and satellite arrays.
Driving reliability in the world's most demanding aerospace missions.
"TOPFAST has been our primary PCB vendor for satellite control modules. Their commitment to IPC Class 3/A standards is unwavering."
"The level of traceability provided is exactly what we need for military hardware. Fully documented and highly professional."
"Exceptional turnaround time on complex prototype rigid-flex designs. They are an essential part of our R&D roadmap."
"Unbeatable precision in HDI stacked microvias. Their technical consultation saved us weeks of design iterations."
"Their ceramic substrate boards handled the thermal loads of our propulsion controllers flawlessly. Truly aerospace-grade."
Precision parameters strictly tailored for aerospace and defense compliance.
| Manufacturing Parameter | Standard Capability | Advanced Capability |
|---|---|---|
| Maximum Layer Count | 2 - 32 Layers | Up to 48 Layers |
| Min. Line Width & Spacing | 3 mil / 3 mil | 2 mil / 2 mil |
| Approved Base Materials | FR4 (High Tg >170), Polyimide | Rogers, PTFE, Arlon, Ceramic |
| Minimum Drill Size | 0.15mm (Mechanical Drilling) | 0.075mm (Laser Processing) |
| Aerospace Surface Finishes | ENIG, HASL Lead-Free | ENEPIG, Hard Gold, Immersion Silver |
| Signal Impedance Control | ± 10% Tolerance | ± 5% Tolerance |
A strictly controlled, highly traceable procedure from initial engineering to final microscopic inspection.
Comprehensive analysis of Gerber files and material constraints to predict and eliminate potential failure points.
Sourcing strictly traceable, aerospace-grade laminates followed by rigorous incoming material verification.
Direct Laser Imaging (LDI) processing, specialized impedance routing, and vacuum lamination in clean-rooms.
Thermal shock testing, micro-section analysis, and comprehensive ionic contamination testing before shipment.
Powering next-generation avionics, complex propulsion controls, and secure satellite communications.
Insights into our aerospace PCB capabilities, compliance, and material strategies.