High Speed PCB Manufacturing Services
Specialized in high-frequency signal transmission (≥50MHz), Topfast delivers professional PCB production and assembly solutions for demanding applications.
Up to 30+ layer designs supported
High-frequency materials (Rogers, Teflon, Isola)
10Gbps+ signal integrity solutions
Precision processes (laser drilling, blind/buried vias)
Fast delivery (24hr prototype, 5-7 day production)
Certified quality (ISO 9001, UL, RoHS)
Why choose High Speed PCB?
High-Frequency
≥50MHz signals with low lossMulti-Layer
Up to 30+ layer designsEMI Protection
Optimized interference resistanceThermal Control
Effective heat dissipation
Key Parameters of High-Speed PCB Materials
Critical specifications for optimal signal integrity
Dielectric Constant (Dk)
Target Range:
2.2 – 4.5
Stability:
<1% @10GHz
- Reduces signal delay
- Minimizes phase distortion
- Rogers materials excel
Loss Tangent (Df)
High-Speed Target:
<0.005
Example:
RO4003C: 0.0027
- Minimizes energy loss
- Critical for signal integrity
- Impacts high-frequency performance
Glass Transition (Tg)
Automotive Grade:
>170°C
Premium Example:
I-Tera MT40: 210°C
- Prevents delamination
- Essential for harsh environments
- Higher Tg = better reliability
CTE (Z-axis)
Critical Threshold:
<50ppm/°C
Copper Matching:
Essential
- Prevents via cracking
- Reduces thermal stress
- Key reliability factor
High-Speed PCB Material Comparison
Performance matrix for common high-frequency materials
Material Type
Example
Dk @10GHz
Df @10GHz
Anwendungen
Cost
Standard FR4
Isola 370HR
4.3
0.020
Digital (<1Gbps)
$
Mid-Loss FR4
Megtron 6
3.7
0.008
Mid-Speed (5Gbps)
$$
PTFE-Based
Rogers RO3003
3.0
0.0013
mmWave (77GHz)
$$$
Ceramic-Filled
Rogers RO4350B
3.48
0.0037
5G/25Gbps
$$$
LCP
DuPont Teflon LCP
2.9
0.002
Flex/100GHz+
$$$$
High-Speed PCB Process Flow
Hybrid Process Flow for High-Speed PCB Manufacturing
1
Material Preparation
- Substrate:Rogers RO4350B/Duroid
- Copper:HVLP Ultra-Low Profile
- Dk/Df:3.48±0.05/0.0037
Material Pre-check: Dk Tester Verification
2
Inner Layer Imaging
- Line Width:3/3mil (L/S)
- Process:LDI Laser Direct Imaging
- Accuracy:±15μm
Impedance Control: ±7% Tolerance
3
Lamination Process
- Pressure:≤200psi
- Temperature:180±5℃
- Layer Shift:≤50μm
Resin Flow Monitoring System
4
Laser Drilling
- Hole Size:0.1-0.3mm
- Type:CO₂/UV Laser
- Roughness:≤30μm
Hole Position Accuracy ±25μm
5
Surface Finish
- Process:ENIG/Immersion Silver
- Ni Thickness:3-5μm
- Au Thickness:0.05-0.1μm
Preferred for High-Frequency
6
Final Inspection
- Flying Probe:10μm Accuracy
- 3D X-ray:Blind Via Inspection
- Standard:IPC-6012D Class3
High-Freq Impedance Test up to 40GHz
If you are looking for professional design and manufacturing of Metal Core PCBs, please
Precision PCB Assembly Capabilities
Advanced Manufacturing Solutions for High-Performance Electronics
SMT Assembly
Placement Accuracy
±25μm @10σ
±25μm @10σ
Component Range
0201 to 150mm²
0201 to 150mm²
PCB Dimensions
50×50mm to 680×500mm
50×50mm to 680×500mm
Fine Pitch Capability
0.30mm IC Pitch
0.30mm IC Pitch
BGA Assembly
Package Size
Up to 74×74mm
Up to 74×74mm
Ball Pitch
0.2mm (8mil) Min.
0.2mm (8mil) Min.
Inspection
3D AXI with 5μm Res
3D AXI with 5μm Res
Through-Hole Technology
Wave Soldering
Selective & Conventional
Selective & Conventional
Max PCB Width
450mm
450mm
Component Height
Top:120mm/Bottom:15mm
Top:120mm/Bottom:15mm
High-Speed PCB Applications
Advanced Solutions for Next-Generation Technologies
Communication
- 5G/6G Base Stations
- Optical Modules
- Millimeter Wave Radar
Up to 77GHz
Dk 3.0-3.5
Computing
- Servers
- Network Switches
- AI Accelerator Cards
25Gbps+ Signals
HDI Designs
Unterhaltungselektronik
- Premium Routers
- VR/AR Devices
- 8K Displays
0.3mm Pitch
Ultra-Thin
Automotive
- Autonomous Sensors
- Vehicle Networks
- ADAS Systems
-40°C to 125°C
ASIL-D
Kontakt
Sprechen Sie mit unserem PCB-Experten
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