HDI PCB Manufacturing Services
Topfast specializes in manufacturing high-density interconnect (HDI) PCBs with precision-engineered solutions, including blind vias, buried vias, microvias, and sequential lamination.
Leveraging cutting-edge production processes, we deliver superior performance, exceptional reliability, and compact designs tailored to meet the most demanding electronic applications.
Ultra-high density wiring
Utilizes laser microvia and blind/buried via technology
Advanced manufacturing processes
High-precision laser drilling, sequential lamination, ultra-thin dielectric materials
High reliability and stability
Strict quality control, high TG materials (Tg ≥ 170°C)
Fast delivery & cost optimization
Rapid prototyping for small to medium batches, cost reduction through large-scale production
Why Choose HDI PCBs?
High-Density Interconnect technology for advanced electronic applications
High Wiring Density
Utilizes microvia and blind/buried via technology to achieve a more refined circuit layout with increased component density.
Multi-layer Stacking
Employs any-layer HDI or sequential lamination technology to improve signal transmission efficiency and reduce interference.
Compact & Lightweight
Ideal for space-constrained devices including smartphones, tablets, and wearable technology.
High-Frequency Performance
Optimized signal integrity for demanding applications like 5G communication and high-end server infrastructure.
Advanced HDI technology enables smaller, faster, and more reliable PCBs
HDI PCB Material Selection
In high-density interconnect (HDI) PCB design, material selection directly impacts signal integrity, thermal reliability, and long-term stability. Topfast combines industry standards with customer requirements to optimize material solutions, ensuring HDI PCBs deliver exceptional performance in high-speed, high-frequency, and demanding environments.
1
Decomposition Temperature (Td)
Critical Requirement: Td ≥ 320°C
Maintains stability during reflow soldering (250-300°C)
Topfast Solutions:
- Rogers RO4000 series (Td > 350°C)
- Isola 370HR (Td = 340°C)
- Military-grade ceramic-filled materials
2
Dielectric Constant (Dk)
Critical Requirement: Dk < 3.5
Reduces signal delay for 5G/mmWave applications
Topfast Solutions:
- Rogers RO4350B (Dk 3.48 @1GHz)
- Nelco N4000-13 (Dk 3.38)
- Isola I-Tera MT40 (Dk 3.45)
3
Glass Transition Temp (Tg)
Critical Requirement: Tg ≥ 170°C
Prevents board deformation in multilayer stacks
Topfast Solutions:
- High Tg FR4 (Tg 170-180°C)
- Ultra-high performance materials (Tg > 200°C)
- Rogers RT/duroid 5880
4
Dissipation Factor (Df)
Critical Requirement: Df < 0.005 @1GHz
Minimizes signal loss in high-speed applications
Topfast Solutions:
- Rogers RO3003 (Df 0.0013)
- DuPont Pyralux AP (Df 0.002)
- Panasonic Megtron 7 (Df 0.001)
5
Thermal Expansion (CTE)
Critical Requirement: Z-axis CTE < 50 ppm/°C
Prevents solder joint failure in thermal cycles
Topfast Solutions:
- BT resin substrates (CTE ≈ 15 ppm/°C)
- Ceramic-filled PTFE
- Rogers TMM® series
6
Copper Foil & Surface Finish
Critical Requirement: ≤12μm ultra-thin copper
Enables fine-line circuitry and reduces signal loss
Topfast Solutions:
- Ultra-thin copper foil (9-12μm)
- RTF/VLP copper technology
- mSAP (modified semi-additive process)
HDI PCB Manufacturing Process
In the manufacturing process, key parameters such as trace width, copper thickness, and various electroplating stages play a crucial role in determining the final quality of the PCB.
FAQ
How reliable are HDI PCBs in the long term?
We strictly enforce every step of the process and are committed to providing our customers with the highest quality products and the best service.
We do not have HDI design experience. Can you provide DFM advice?
We have professional technical personnel to provide preliminary design consulting and technical support. Our professional engineering team provides cost optimization recommendations for customers’ bills of materials (BOM), offers optimal production plans, reduces costs, and improves efficiency.
Why are HDI PCBs more expensive than ordinary PCBs?
The manufacture of HDI PCBs requires high-precision equipment and low-loss PP and high Tg substrates, which are more expensive than FR4.
How much longer is the delivery time for HDI PCBs compared to ordinary PCBs?
Standard PCB: 2-7 days, HDI PCB: 7-10 days (due to complex processes such as laser drilling and multiple lamination, the exact time depends on the complexity of the board).
Does your factory have actual production experience with HDI PCBs?
Topfast specializes in manufacturing high-density interconnect (HDI) PCBs with precision-engineered solutions, including blind vias, buried vias, microvias, and sequential lamination.
What are the minimum line width/line spacing and hole diameter that can be achieved?
Minimum line width/line spacing: 40/40 μm, laser drilling: 50 μm. We have world-class production equipment (including laser drilling machines, VCP through-hole filling lines, blind hole AOI inspection equipment, ceramic grinding lines, vertical vacuum resin plugging machines, etc.), a top-notch technical team, a mature product line, and a complete service process.
Can you rush the production?
If the base material and raw materials are available, we can offer rush services, such as 24-hour rapid prototyping, but the corresponding fees will increase by 20-30%, depending on the specific circumstances.
What certifications do PCB factories have?
All of our products are IPC rated with ISO 14001; ISO 9001; CE; ROHS certificates, etc. Our products are widely used in communication, medical equipment, industrial control, power supply, consumer electronics and aerospace, automotive industry and other fields.
Scope of application
Our HDI PCB are widely used in communication, medical equipment, industrial control, power supply, consumer electronics and aerospace, automotive industry and other fields.