Faster & Professional Turnkey PCB Assembly Services
Get Instant Quote →High-performance ceramic substrates with superior thermal conductivity, temperature resistance, and high-frequency characteristics.
Nano-ceramic powder & high-precision conductive paste
Laser processing & printing at 50μm line width
Selective electroplating & ENEPIG treatment
AOI, X-ray, thermal shock & conductivity inspection
High-performance substrates engineered for extreme environments and demanding electronic applications.
Withstands temperatures up to 1600°C — ideal for power electronics & automotive.
AlN: 170–230 W/mK — 100× better than standard FR4 substrates.
Resists harsh chemicals — critical for aerospace, medical, and marine use.
High breakdown voltage, no extra insulation layers needed.
Excellent Cu/Ti adhesion with matched thermal expansion coefficient.
Perfect for RF & microwave — low Dk, stable signal at high frequency.
Advanced ceramic substrates engineered for specialized performance requirements.
| Material | Dielectric Constant | Thermal Conductivity | CTE (×10⁻⁶/°C) | Best For |
|---|---|---|---|---|
| Al₂O₃ Alumina | 22–30 | 6–8 W/mK | 7.0–8.0 | LEDs, power, sensors |
| AlN Aluminum Nitride | 8.5–10 | 170–200 W/mK | 4.0–5.0 | Power LEDs, modules |
| Si₃N₄ Silicon Nitride | 7–9 | 80 W/mK | 3.0–4.0 | Automotive, aerospace |
| SiC Silicon Carbide | 40–42 | 120–150 W/mK | 4.0–5.0 | High-temp, lasers |
| BeO Beryllium Oxide | 6.5–7.5 | 200–300 W/mK | 7.0–8.0 | RF, military, space |
| LTCC Low-Temp Co-fired | 5–15 | 2–5 W/mK | 6.0–7.0 | RF, medical, sensors |
Over 10 years of expertise in ceramic PCB manufacturing and assembly, trusted by global clients.
Deep expertise in PCB manufacturing & assembly across all ceramic substrate types.
IPC, UL, ROHS, ISO 9001 & ISO 14001 certified — quality you can trust.
Multi-stage inspection at every step — AOI, X-ray, thermal & electrical testing.
Factories in Guangzhou & Shenzhen, serving clients in 80+ countries worldwide.
Flexible customization from prototype to mass production — tailored to your needs.
Competitive pricing with minimized cost — maximum value without compromising quality.
Al₂O₃ mixing & green tape casting
Screen printing & laser etching
Layer alignment & heat pressing
1500–1600°C densification
ENIG plating & metal thickening
Drilling, cutting & X-ray testing
LED headlights, radar systems, power modules
5G base stations, microwave amplifiers
IGBT modules, inverters, charging stations
Implants, sensors, space-grade systems
We offer Alumina (Al₂O₃), Aluminum Nitride (AlN), Silicon Nitride (Si₃N₄), Silicon Carbide (SiC), Beryllium Oxide (BeO), and LTCC substrates. Our engineers can help you select the best material based on your thermal, electrical, and budget requirements.
Using thick film processes we handle 2–8 layers. With LTCC and HTCC technologies, we can achieve 10–20 layers or more. The optimal layer count depends on your circuit complexity and application requirements.
We accept orders starting from 1 piece for prototyping. There is no strict MOQ — whether you need a single sample or full-scale production, we provide competitive pricing at every volume level.
Our facilities are certified to ISO 9001, ISO 14001, UL, CE, and ROHS standards. All products meet IPC specifications and are widely used in communication, medical, industrial control, aerospace, and automotive industries.
We require Gerber files for production. However, if you have physical samples, we can reverse-engineer and clone them. Simply send 3–5 samples to us, and we'll evaluate and provide a quotation for prototype production.
We support turnaround as fast as 12 hours for urgent orders — 1 hour for quotation, 4 hours for engineering review. Standard lead times depend on product complexity and quantity, and will be included in your quote.