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Microvia technology for 14-layer printed circuit boards, from laser drilling specifications to solving plating defects and signal reflection problems, we offer viable solutions backed by manufacturing data.
10
Jun
What is PCB layout, and its importance? If you want to ensure the reliability of PCB products, you must first do the following three things 1. What is the PCB? PCB is the core carrier of modern electronic products, which connects various electronic components through precise copper foil alignment to realize the function of circuit […]
09
Topfast's complete production process of four-layer PCB boards from design to finished product, including precision stacked layer design, high-precision inner layer production, lamination process control and other key technology links, and provide professional solutions for common problems such as layer delamination, impedance control, drilling quality and so on.
07
An in-depth analysis of how surface mount technology (SMT) has become the industry standard for electronics manufacturing, detailing its significant advantages in terms of space utilization (up to 50% higher), production costs (up to 40% lower), product reliability and productivity.
06
The concept of halogen-free PCBs, international standards and their differences from traditional halogen-containing circuit boards. It covers the flame retardant principle of halogen-free materials, performance characteristics, manufacturing process adjustments and applications in consumer electronics, automotive electronics, medical devices and other fields.
05
PCB industry terminology covering key concepts such as board structure, design specifications, manufacturing processes, and material properties. From basic alignments and pads to complex HDI technologies, and from traditional through-hole components to modern surface mount processes, the articles provide comprehensive and in-depth explanations to help readers master the specialized language and technical points of the PCB field.
04
This article explores the key technologies, fast-turn solutions, and industry applications of PCB multilayer prototyping, along with expert answers to 5 common technical challenges. Learn how professional prototyping services reduce development risks, accelerate time-to-market, and discover critical factors in selecting a PCB supplier.
03
This in-depth guide details the complete SMT process, covering pre-production prep, solder paste printing, component placement, reflow soldering, and quality inspection. It provides actionable solutions for 5 common production issues, along with specialized component handling tips and industry trends—an indispensable resource for electronics manufacturing professionals.
02
This guide systematically explains the full process technical details of blind via technology in multilayer PCBs, including laser drilling parameter settings, key via wall treatment processes, metallization quality control, and other core content. It provides practical solutions for five typical production problems, helping engineers master implementation essentials and optimization techniques for blind via processes.
01
This comprehensive guide covers PCB drilling techniques, highlighting mechanical and laser methods, critical process controls, and solutions to six frequent production issues. It also examines future trends, offering valuable insights for PCB manufacturers.
31
May
PCB panelization design critically impacts electronics manufacturing efficiency and quality. This comprehensive guide explains fundamental principles, including size selection, connection methods, and component orientation, as well as advanced techniques such as mixed panels and thermal balancing. Featuring solutions to 6 frequent production problems, it helps engineers optimize designs, improve efficiency, and lower costs. Valuable for both beginners and experienced professionals seeking practical panelization knowledge.
30
This article delves into cutting-edge PCB manufacturing technologies, including via-in-pad, blind/buried vias, and modified semi-additive process (mSAP), which enable ultra-high-density interconnects for modern electronics. Discover their key advantages, manufacturing challenges, industry applications, and future trends in 5G, AI, automotive, and IoT devices. Learn how these innovations drive smaller, faster, and more reliable circuit boards.
29
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Thickness 0.4mm 0.6mm 0.8mm 1.0mm 1.2mm 1.6mm 2.0mm 2.4mm
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SMT Pads
Thru-Holes
