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Focus on the latest articles that cover topics ranging from the latest technologies to best practices and industry news for PCB.
Dec 12, 2025
This PCB assembly design guide provides solutions to five critical challenges: component spacing optimization, DFM compliance, thermal management, documentation completeness, and testability design. Implementing these professional practices can increase first-time success rates from 65% to over 90% while reducing design cycles by 20% and rework costs by 30%, with practical checklists and IPC standards for immediate implementation.
Dec 05, 2025
Nov 29, 2025
12
Dec
This guide compares Flying Probe and Bed-of-Nails PCB testing technologies, detailing their principles, advantages, and ideal applications. Learn how TOPFAST's hybrid approach delivers the right balance of flexibility and efficiency for any production stage, from prototyping to mass manufacturing.
05
This guide covers PCB signal integrity from basics to advanced implementation. Learn to solve 9 key challenges including impedance control and power integrity. Discover TOPFAST's proven methodology with real 400G case results. Get technical solutions for high-speed systems from design to manufacturing.
29
Nov
This article provides a comprehensive overview of the core importance of DFM analysis in PCB design and manufacturing. It not only defines DFM's value in controlling cost and quality at the source but also details its key checkpoints, such as design specification validation, process compatibility analysis, and assemblability assessment. Furthermore, the article presents a clear four-phase implementation framework and emphasizes the role of modern automation tools and cross-team collaboration in successful practice. Finally, through quantitative data and specific examples, it demonstrates the significant commercial benefits achievable through effective DFM analysis, offering actionable guidance for hardware teams to optimize their development processes.
25
This article systematically analyzes the structural characteristics, material selection, and process essentials of Metal Core PCBs. It details the performance differences between aluminum and copper substrates, explaining their core advantages in thermal management. Additionally, it introduces TOPFAST's technical expertise in MCPCB manufacturing, offering complete solutions for high-power electronic devices - from material selection to thermal design - ensuring stable operation in harsh environments like high temperatures and high vibration conditions.
20
This article analyzes the concept of PCB aspect ratio and its impact on circuit board performance and manufacturing. It covers aspect ratio calculation formulas, typical application scenarios, and key technical challenges such as drilling precision and plating uniformity associated with high aspect ratios, providing practical guidance for engineers to achieve high-reliability PCB designs.
17
What is PCB Panelization? PCB panelization is a manufacturing process that involves designing multiple identical or different single PCBs on the same substrate to form an integrated processing unit. Just like a cookie cutter stamps multiple cookies at once, PCB panelization allows manufacturers to complete multiple single boards simultaneously through a single process, like exposure, […]
15
Definition, characteristics, and key applications of high-frequency PCBs in modern electronics. TOPFAST's core strengths in technological innovation, quality management, and customer service provide expert guidance for selecting high-frequency board suppliers.
SMT reflow soldering is the core process of surface mount technology, achieving reliable connections between components and PCBs through precise temperature curve control. This provides practical guidance for electronics manufacturers to enhance SMT soldering yield rates.
11
The complete process of PCB multilayer prototyping focuses on overcoming four major technical challenges: layer-to-layer alignment, internal circuit fabrication, lamination, and drilling. It outlines a standardized workflow from design review to final inspection, while providing in-depth analysis of critical processes such as impedance control and surface finishing. Additionally, it offers engineers practical strategies for achieving rapid delivery and a comprehensive guide for selecting high-quality prototyping manufacturers.
08
Detailed analysis of the key process points for PCB Via-in-Pad technology, comparing the differences between resin-filled vias and electroplated vias, providing a comprehensive guide from design to manufacturing, including parameter recommendations and quality control methods.
07
With the evolution of environmental regulations and market demands, halogen-free PCBs have become the mainstream choice in electronic design. This article outlines the international standards for halogen-free PCBs, highlights their significant advantages over traditional halogen-containing PCBs in thermal stability, electrical performance, and environmental safety, and provides key selection criteria for halogen-free laminates along with practical solutions for addressing design challenges.
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