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Focus on the latest articles that cover topics ranging from the latest technologies to best practices and industry news for PCB.
Nov 20, 2025
This article systematically analyzes the structural characteristics, material selection, and process essentials of Metal Core PCBs. It details the performance differences between aluminum and copper substrates, explaining their core advantages in thermal management. Additionally, it introduces TOPFAST's technical expertise in MCPCB manufacturing, offering complete solutions for high-power electronic devices - from material selection to thermal design - ensuring stable operation in harsh environments like high temperatures and high vibration conditions.
Nov 17, 2025
Nov 15, 2025
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Nov
This article analyzes the concept of PCB aspect ratio and its impact on circuit board performance and manufacturing. It covers aspect ratio calculation formulas, typical application scenarios, and key technical challenges such as drilling precision and plating uniformity associated with high aspect ratios, providing practical guidance for engineers to achieve high-reliability PCB designs.
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What is PCB Panelization? PCB panelization is a manufacturing process that involves designing multiple identical or different single PCBs on the same substrate to form an integrated processing unit. Just like a cookie cutter stamps multiple cookies at once, PCB panelization allows manufacturers to complete multiple single boards simultaneously through a single process, like exposure, […]
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Definition, characteristics, and key applications of high-frequency PCBs in modern electronics. TOPFAST's core strengths in technological innovation, quality management, and customer service provide expert guidance for selecting high-frequency board suppliers.
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SMT reflow soldering is the core process of surface mount technology, achieving reliable connections between components and PCBs through precise temperature curve control. This provides practical guidance for electronics manufacturers to enhance SMT soldering yield rates.
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The complete process of PCB multilayer prototyping focuses on overcoming four major technical challenges: layer-to-layer alignment, internal circuit fabrication, lamination, and drilling. It outlines a standardized workflow from design review to final inspection, while providing in-depth analysis of critical processes such as impedance control and surface finishing. Additionally, it offers engineers practical strategies for achieving rapid delivery and a comprehensive guide for selecting high-quality prototyping manufacturers.
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Detailed analysis of the key process points for PCB Via-in-Pad technology, comparing the differences between resin-filled vias and electroplated vias, providing a comprehensive guide from design to manufacturing, including parameter recommendations and quality control methods.
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With the evolution of environmental regulations and market demands, halogen-free PCBs have become the mainstream choice in electronic design. This article outlines the international standards for halogen-free PCBs, highlights their significant advantages over traditional halogen-containing PCBs in thermal stability, electrical performance, and environmental safety, and provides key selection criteria for halogen-free laminates along with practical solutions for addressing design challenges.
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The Core Knowledge System of Printed Circuit Boards (PCBs) provides comprehensive coverage from fundamental concepts to advanced technologies. Content includes detailed classifications of PCBs by substrate and structure, interpretation of key technical indicators such as board Tg values and Dk/Df parameters, step-by-step analysis of multilayer board manufacturing processes, and in-depth comparative analysis of various surface treatment techniques. This resource empowers informed decisions in PCB selection, design, and quality control.
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Oct
The universal standard system for printed circuit boards (PCBs) encompasses design specifications (e.g., IPC-6010), material standards (e.g., IPC-4101), soldering processes (e.g., J-STD-001), inspection methods (e.g., IPC-TM-650), and environmental requirements (e.g., IPC-1752). Ensuring PCB reliability and compliance under high-density, high-frequency, and harsh environmental conditions.
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Aluminum-based PCBs (aluminum printed circuit boards) are specialized printed circuit boards utilizing aluminum alloy as the substrate material. Their three-layer structural design delivers exceptional thermal conductivity and electrical performance. Compared to traditional FR-4 PCBs, aluminum-based PCBs offer superior heat dissipation capabilities, high mechanical strength, and excellent dimensional stability.
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PCB: The Core Carrier and Performance Cornerstone of AI Hardware 1.1 Foundational Support Role Printed Circuit Boards (PCBs), serving as the “skeletal neural network” of electronic systems, play a key interconnection function within AI hardware architectures. In AI servers, edge computing devices, and intelligent terminals, high-performance PCBs are responsible for connecting GPU/TPU clusters, high-bandwidth memory […]
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