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Focus on the latest articles that cover topics ranging from the latest technologies to best practices and industry news for PCB.
Jan 22, 2026
High Mix Low Volume (HMLV) PCBA involves producing many distinct PCB designs in small quantities. It offers great flexibility and customization but faces challenges like complex logistics and setup. Ideal for R&D, prototyping, and specialized markets.
Jan 20, 2026
Jan 16, 2026
SMT reflow soldering is the core process of surface mount technology, achieving reliable connections between components and PCBs through precise temperature curve control. This provides practical guidance for electronics manufacturers to enhance SMT soldering yield rates.
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Nov
The complete process of PCB multilayer prototyping focuses on overcoming four major technical challenges: layer-to-layer alignment, internal circuit fabrication, lamination, and drilling. It outlines a standardized workflow from design review to final inspection, while providing in-depth analysis of critical processes such as impedance control and surface finishing. Additionally, it offers engineers practical strategies for achieving rapid delivery and a comprehensive guide for selecting high-quality prototyping manufacturers.
08
Detailed analysis of the key process points for PCB Via-in-Pad technology, comparing the differences between resin-filled vias and electroplated vias, providing a comprehensive guide from design to manufacturing, including parameter recommendations and quality control methods.
07
With the evolution of environmental regulations and market demands, halogen-free PCBs have become the mainstream choice in electronic design. This article outlines the international standards for halogen-free PCBs, highlights their significant advantages over traditional halogen-containing PCBs in thermal stability, electrical performance, and environmental safety, and provides key selection criteria for halogen-free laminates along with practical solutions for addressing design challenges.
06
The Core Knowledge System of Printed Circuit Boards (PCBs) provides comprehensive coverage from fundamental concepts to advanced technologies. Content includes detailed classifications of PCBs by substrate and structure, interpretation of key technical indicators such as board Tg values and Dk/Df parameters, step-by-step analysis of multilayer board manufacturing processes, and in-depth comparative analysis of various surface treatment techniques. This resource empowers informed decisions in PCB selection, design, and quality control.
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Oct
The universal standard system for printed circuit boards (PCBs) encompasses design specifications (e.g., IPC-6010), material standards (e.g., IPC-4101), soldering processes (e.g., J-STD-001), inspection methods (e.g., IPC-TM-650), and environmental requirements (e.g., IPC-1752). Ensuring PCB reliability and compliance under high-density, high-frequency, and harsh environmental conditions.
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Aluminum-based PCBs (aluminum printed circuit boards) are specialized printed circuit boards utilizing aluminum alloy as the substrate material. Their three-layer structural design delivers exceptional thermal conductivity and electrical performance. Compared to traditional FR-4 PCBs, aluminum-based PCBs offer superior heat dissipation capabilities, high mechanical strength, and excellent dimensional stability.
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PCB: The Core Carrier and Performance Cornerstone of AI Hardware 1.1 Foundational Support Role Printed Circuit Boards (PCBs), serving as the “skeletal neural network” of electronic systems, play a key interconnection function within AI hardware architectures. In AI servers, edge computing devices, and intelligent terminals, high-performance PCBs are responsible for connecting GPU/TPU clusters, high-bandwidth memory […]
23
The 3W principle is a key design guideline for minimizing crosstalk in PCB routing, requiring that the center-to-center spacing between adjacent signal traces be no less than three times the trace width. Understanding the underlying physics, applicable scenarios, effectiveness evaluation, and practical considerations when applying this principle empowers engineers to significantly enhance signal integrity in high-speed circuit design.
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Understand the technical characteristics, application scenarios, and selection considerations for flexible PCBs and rigid-flex boards. By comparing differences with rigid PCBs and incorporating real-world application cases, this guide provides engineers with comprehensive decision-making references. It covers specific application solutions and design recommendations across multiple fields, ranging from consumer electronics to aerospace.
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Analyzing the core elements of four-layer PCB design, including stackup selection, via parasitic parameter control, high-speed routing strategies, and power partitioning techniques, along with a design verification checklist to help engineers achieve high-reliability and signal-integrity circuit board designs.
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PCB characteristic inspection is a critical step in ensuring circuit boards meet design specifications and quality standards. This comprehensive checklist, covering electrical characteristic inspections and physical characteristic inspections, provides PCB design engineers with a complete quality control reference system.
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