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Focus on the latest articles that cover topics ranging from the latest technologies to best practices and industry news for PCB.
Nov 17, 2025
This article analyzes the concept of PCB aspect ratio and its impact on circuit board performance and manufacturing. It covers aspect ratio calculation formulas, typical application scenarios, and key technical challenges such as drilling precision and plating uniformity associated with high aspect ratios, providing practical guidance for engineers to achieve high-reliability PCB designs.
Nov 15, 2025
Nov 12, 2025
The 2025 Iran Electronics Exhibition will be held in Tehran this September, showcasing electronic components, PCBs, semiconductor packaging, and smart manufacturing equipment. The event features professional forums and business matching platforms to help companies expand into the Middle East market. Key exhibitor Topfast will present its innovative PCB solutions and specialized technical services.
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Sep
PCB defect detection is a critical process in electronics manufacturing. This paper systematically investigates the principles and characteristics of optical, electrical, thermal imaging, X-ray, and acoustic detection technologies. Through comparative analysis, it proposes recommendations for technology selection and explores future trends in artificial intelligence and multimodal fusion.
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The 2025 FIEE Brazil Exhibition is currently underway at the São Paulo Exhibition and Convention Center. This year's event features dedicated zones for hot topics like photovoltaic energy storage and automation robotics, showcasing products and technologies across the entire industry chain and attracting participation from global industry leaders. Topfast is also exhibiting at the show, offering high-end PCB manufacturing and electronic solutions.
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Selecting the number of PCB layers is a critical decision in electronic design, directly impacting product performance and cost. This paper systematically analyzes the theoretical limits and practical manufacturing constraints of PCB layer counts, providing a detailed comparison of the advantages, disadvantages, cost structures, and application scenarios for different layer counts (4 to 32 layers).
09
Incoming material inspection for printed circuit boards is a critical step in ensuring electronic product quality. This guide covers the conditions, items, methods, and tools for PCB inspection, encompassing the entire process from visual and dimensional checks to electrical and reliability testing. It includes solutions to common issues and references to industry standards, providing practical guidance for companies to establish an efficient incoming material inspection system.
04
The Importance, Fundamental Principles, and Key Design Methods of Wire Harness Design. This covers core technologies including material selection, cable management, connector selection, and shielding protection for wire harnesses, while providing an in-depth analysis of the core challenges and solutions in wire harness design for smart equipment. It offers engineers a comprehensive design framework and implementation plan.
02
The principles, process flows, and primary methods of PCB electroplating, including through-hole plating, brush plating, finger plating, and roll-to-roll selective plating. This analysis examines the distinctions between electroplating and electroless plating, while exploring surface treatment processes and their role in circuit protection. It provides professional insights for electronics manufacturing practitioners regarding the application and optimization of electroplating technologies.
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Aug
The 2025 FIEE International Electrical and Smart Energy Expo (Sept 9-12, São Paulo) features renewable energy innovations and Latin American market opportunities. Topfast will showcase specialized PCB solutions for solar, smart grid and industrial applications, offering 17+ years of expertise in high-quality circuit board manufacturing and custom technical support.
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The 2025 Elecomp Exhibition in Tehran, Iran, will showcase electronic components, printed circuit boards, and manufacturing equipment, highlighting the thriving growth of Iran's electronics market. Key exhibitor Topfast, with 17 years of specialized expertise, provides reliable PCB manufacturing services for the communications, medical, and automotive industries.
A comprehensive overview of 10-layer PCB stackup design, covering standard stackup structures, five configuration options, key design considerations, and best practices. Practical guidance on signal integrity management, impedance control, power distribution optimization, and thermal management to help engineers achieve high-performance and highly reliable multilayer PCB designs.
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Topfast's rapid PCB manufacturing service covers its 24-72 hour rush delivery capability, multilayer board support, material selection, quality control processes, and industry applications. With advanced equipment, strict standards, and extensive experience, we provide customers with high-speed, reliable PCB manufacturing services.
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Topfast's Frequently Asked Questions (FAQ) for manufacturing and assembly services cover all aspects from basic inquiries to advanced processes, including document requirements, technical specifications, quality control standards, and special processing capabilities. Whether you need rapid prototyping or large-scale production, you can find professional and reliable solutions here.
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Thickness 0.4mm 0.6mm 0.8mm 1.0mm 1.2mm 1.6mm 2.0mm 2.4mm
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SMT Pads
Thru-Holes
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