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Focus on the latest articles that cover topics ranging from the latest technologies to best practices and industry news for PCB.
Jan 22, 2026
High Mix Low Volume (HMLV) PCBA involves producing many distinct PCB designs in small quantities. It offers great flexibility and customization but faces challenges like complex logistics and setup. Ideal for R&D, prototyping, and specialized markets.
Jan 20, 2026
Jan 16, 2026
Learn the clear distinctions between PCB manufacturing and PCB assembly. Manufacturing creates the bare board through etching and layering, while assembly (PCBA) populates it with components. They differ in processes, cost factors, and lead times. Ultimately, these sequential stages work together to transform a design into a functional printed circuit board assembly.
22
Dec
This comprehensive guide to HDI PCB stackup design covers everything from fundamental concepts to advanced applications. It details the structural characteristics, design principles, and manufacturing considerations for HDI boards of varying levels, along with common issues. By analyzing blind via design specifications, interlayer optimization strategies, material selection methods, and cost control techniques, it provides electronics engineers with a highly practical and valuable technical reference.
19
This comprehensive guide explores PCB V-Scoring technology, detailing process parameters, design standards, and manufacturing best practices. It covers material compatibility, layout optimization, component protection guidelines, and quality control measures. The article compares V-Scoring with other depaneling methods and highlights professional manufacturing advantages for achieving reliable PCB production outcomes.
15
This PCB assembly design guide provides solutions to five critical challenges: component spacing optimization, DFM compliance, thermal management, documentation completeness, and testability design. Implementing these professional practices can increase first-time success rates from 65% to over 90% while reducing design cycles by 20% and rework costs by 30%, with practical checklists and IPC standards for immediate implementation.
12
This beginner-friendly guide explains PCB assembly (PCBA), the process of mounting electronic components onto a circuit board. It introduces the two main techniques: Surface Mount Technology (SMT) and Through-Hole Technology (THT), highlighting how they work. The article also clarifies the key difference between a bare PCB (printed circuit board) and a completed PCBA (printed circuit board assembly).
08
This guide compares Flying Probe and Bed-of-Nails PCB testing technologies, detailing their principles, advantages, and ideal applications. Learn how TOPFAST's hybrid approach delivers the right balance of flexibility and efficiency for any production stage, from prototyping to mass manufacturing.
05
This guide covers PCB signal integrity from basics to advanced implementation. Learn to solve 9 key challenges including impedance control and power integrity. Discover TOPFAST's proven methodology with real 400G case results. Get technical solutions for high-speed systems from design to manufacturing.
29
Nov
This article provides a comprehensive overview of the core importance of DFM analysis in PCB design and manufacturing. It not only defines DFM's value in controlling cost and quality at the source but also details its key checkpoints, such as design specification validation, process compatibility analysis, and assemblability assessment. Furthermore, the article presents a clear four-phase implementation framework and emphasizes the role of modern automation tools and cross-team collaboration in successful practice. Finally, through quantitative data and specific examples, it demonstrates the significant commercial benefits achievable through effective DFM analysis, offering actionable guidance for hardware teams to optimize their development processes.
25
This article systematically analyzes the structural characteristics, material selection, and process essentials of Metal Core PCBs. It details the performance differences between aluminum and copper substrates, explaining their core advantages in thermal management. Additionally, it introduces TOPFAST's technical expertise in MCPCB manufacturing, offering complete solutions for high-power electronic devices - from material selection to thermal design - ensuring stable operation in harsh environments like high temperatures and high vibration conditions.
20
This article analyzes the concept of PCB aspect ratio and its impact on circuit board performance and manufacturing. It covers aspect ratio calculation formulas, typical application scenarios, and key technical challenges such as drilling precision and plating uniformity associated with high aspect ratios, providing practical guidance for engineers to achieve high-reliability PCB designs.
17
What is PCB Panelization? PCB panelization is a manufacturing process that involves designing multiple identical or different single PCBs on the same substrate to form an integrated processing unit. Just like a cookie cutter stamps multiple cookies at once, PCB panelization allows manufacturers to complete multiple single boards simultaneously through a single process, like exposure, […]
Definition, characteristics, and key applications of high-frequency PCBs in modern electronics. TOPFAST's core strengths in technological innovation, quality management, and customer service provide expert guidance for selecting high-frequency board suppliers.
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