Table of Contents
Exhibition Overview
The 2025 Iran Electronics Components & Production Equipment Exhibition (Iran Elecomp) will be held from September 25 to 28 at the Tehran International Permanent Fairground. The event will showcase electronic components, printed circuit boards, IC packaging, and advanced manufacturing technologies, providing a professional platform for global enterprises to engage in technology and trade exchange, market expansion, and industry networking.
Key Highlights
- Cutting-Edge Technologies: Display of innovative achievements, including high-performance chips, advanced packaging, and intelligent equipment
- Global Resource Connection: Brings together international exhibitors and buyers covering the entire electronics industry chain
- Professional Forums: Multiple technical seminars and industry forums focusing on green manufacturing, semiconductor trends, and more
- Gateway to the Middle East Market: Deep integration with Iran and the broader Middle Eastern electronics market, exploring regional demand and collaboration opportunities
Topfast: Dedicated to PCB Innovation and Reliable Delivery
Established in 2008, Topfast has focused for 17 years on the R&D and manufacturing of high-speed, high-frequency, and high-density PCBs, offering one-stop solutions from design to assembly. The company’s products include HDI boards, thick copper boards, rigid-flex boards, semiconductor test boards, and more, widely used in communications, medical, automotive electronics, and industrial control applications. All products comply with IPC standards and are UL, ROHS, and ISO9001 certified.
With an experienced technical team and advanced production processes, Topfast is committed to providing small-batch rapid manufacturing and customized services, helping customers optimize designs, reduce costs, and accelerate time-to-market. Visit our booth for discussions and collaboration!

Opportunities in the Iranian Market
Iran’s electronics market continues to grow, with strong demand in semiconductors, PCBs, and smart components. Localization policies and industrial upgrading offer broad cooperation opportunities for international companies. This exhibition serves as a key bridge for entering the Middle Eastern market and establishing regional partnerships.
Exhibition Scope
- Printed Circuit Boards: High-layer boards, flexible boards, IC substrates, SMT technologies and materials
- IC Packaging: Advanced packaging equipment, materials, and inspection solutions
- Electronic Components: Sensors, connectors, thermal management, and protective devices
- Manufacturing & Services: EMS outsourcing, automation equipment, testing and measurement, cleanroom technologies, and solutions