Tecnologia de furo passante
Reliable DIP
Manual & Wave
Montagem
Precise component insertion · Lead-free wave soldering · Industrial grade durability · Full PCBA integration
0
Years Experience
0
Global Clients
0
Prototype Turnaround
0
Visual Inspection Rate
What We Do
Reliable
Furo passante
Montagem
Expert DIP assembly services combining high-speed wave soldering with precision manual insertion. Engineered for durability in power and industrial applications.
Solicite uma cotação
01
Precision Manual Insertion
Hand-placed through-hole components with high consistency for complex and heavy-duty PCBA.
Manual Expert
IPC Class 3
02
Wave & Selective Soldering
Automated wave soldering lines for high-volume THT efficiency and consistent joint quality.
Auto Soldering
Lead-Free
03
Component Prep & Lead Forming
Custom lead bending, trimming, and radial/axial component preparation to exact specifications.
Custom Bending
Lead Trimming
04
Conformal Coating & Potting
Environmental protection for through-hole boards operating in harsh, humid, or vibrating conditions.
Harsh Env
IP67 Ready
05
Mixed Technology Integration
Expertly combining SMT and DIP processes on a single board with secondary reflow or selective soldering.
SMT + DIP
Hybrid Flow
How We Build
DIP Assembly
Workflow
Our controlled assembly process ensures high-reliability solder joints for every through-hole component.
01
Prep &
Prep &
Lead Forming
Components are pre-bent and trimmed using precision fixtures for perfect fit-up.
02
Componente
Componente
Insertion
Expert manual or automated insertion into PCB holes with orientation double-check.
03
Onda
Onda
Soldagem
Controlled dual-wave soldering with precision thermal profiles for zero-void joints.
04
Audit &
Audit &
Verification
100% visual inspection and functional testing. Cleaning and final quality audit.
Parâmetros técnicos
Detailed
Especificações
Every parameter engineered to meet the most demanding standards in electronics manufacturing.
0.5mmMin. Lead Dia.
2.54mmStandard Pitch
Lead-FreeRoHS Process
Lead Thickness0.4mm – 1.2mm
Min. Hole Size0,6 mm
Max. Component Height45mm
Insertion MethodManual / Semi-Auto
Lead FormingAxial / Radial / Custom
MateriaisFR4, Aluminum, Rogers, CEM-3
Max. Board Size500 × 400mm
Espessura da placa0.8 – 4.2mm
Layer Capability1 – 24 Layers
Min. Lead Time24 Hours (Prototype)
Soldering TypeWave / Selective / Manual
Solder AlloysSAC305 / SnCu / SnPb
Bath Temp250°C - 270°C Controlled
Inspeção visual100% Eyepiece/Magnifier
PadrãoIPC-A-610 Classe 3
Common Questions
PERGUNTAS FREQUENTES
DIP (Dual In-line Package) refers to through-hole technology where component leads are inserted into holes in the PCB and soldered, providing high mechanical strength.
Yes. We have dedicated wave soldering lines for both lead-free (RoHS) and leaded processes to meet standard industrial or military requirements.
Absolutely. Most of our projects are mixed-technology. We handle SMT first followed by DIP manual insertion and wave/selective soldering.
No MOQ. We support single prototype boards through to millions of units in mass production, with the same quality standards applied at every volume.
Start Your Project
Get a Free
Engineering Quote
Our engineers review every submission within 1-2 business hours. Upload your design files and we'll handle the rest.
- No minimum order quantity
- Engineering prototype in 24h
- IPC-A-610 Class 3 quality
- Free DFM analysis included
- Dedicated account engineer
ISO 9001IPC CLASS
3ROHSUL
Entre em contato conosco
Fale com nosso especialista em PCB
PT 
EN 
AR 
DE 
FR 
ES