Table of Contents
1. Core Advantages of Copper as the Preferred PCB Material
1.1 Unmatched Electrical Performance
- Second only to silver in conductivity, the resistivity of 1.68 × 10⁻⁸ Ω·m ensures efficient signal transmission.
- Excellent high-frequency response: Maintains stable impedance characteristics despite skin effects.
- Superior current-carrying capacity: 40% higher current capacity than aluminum for the same cross-sectional area.
1.2 Exceptional Process Compatibility
- Precision etching capability: Supports ultra-fine traces below 3 mil.
- Multilayer lamination: Matches FR4’s coefficient of thermal expansion (CTE).
- Versatile surface finishes: Compatible with all mainstream processes (ENIG/OSP/HASL).
1.3 Cost-Effectiveness Analysis
- Material cost: Priced at 1/50th of silver and only 1.2x aluminum.
- Processing cost: Mature processes yield >98% production success rates.
- Recyclability: Over 95% copper recovery rate from scrap boards.
2. Engineering Value of Copper Pour Techniques
2.1 Enhanced Electromagnetic Compatibility (EMC)
- Shielding effectiveness: Full copper pour reduces radiated interference by >15dB.
- Signal return paths: Provides the shortest return paths for high-speed signals.
- Impedanzkontrolle: Maintains consistent transmission line characteristics.
2.2 Improved Thermal Management
- Thermal conductivity: Outstanding 398W/(m·K) heat dissipation capability.
- Heat spreading design: Prevents localized hot spots.
- Power device cooling: Copper thickness vs. current capacity reference:
| Copper Thickness (oz) | Trace Width (mm) per 1A |
|---|---|
| 1 | 0.4 |
| 2 | 0.2 |
| 3 | 0.13 |
2.3 Mechanical Strength Optimization
- Flexural strength: Increases substrate stiffness by >30%.
- Dimensional stability: Resists warping from temperature/humidity changes.
- Vibration resistance: Mandatory for military-grade applications.
3. Practical Guide to Copper Pour Design
3.1 Comparison of Two Fundamental Pour Methods
Solid Copper Pour
- Applications: Power planes, high-current paths
- Special treatment: Requires thermal relief slots (width ≥0.5mm)
- Typical parameters: 1-3oz thickness, <30% opening ratio
Grid Copper Pour
- Best uses: High-frequency signal areas
- Grid specifications: Line width/spacing ≥5mil
- Advantages: Reduces thermal stress, 15% weight reduction
3.2 Special Zone Handling Standards
- Antenna zones: Maintain 20mm clearance
- Under BGA: Use cross-shaped pad connections
- Board edges: Implement ≥3mm copper rings
3.3 Common Design Mistakes and Corrections
- Copper islands: Eliminate via grounding vias
- Sharp corners: Replace with curved transitions (radius ≥3x trace width)
- Uneven heat dissipation: Implement gradual copper thickness gradients
- Impedance mismatch: Strictly control dielectric layer thickness tolerances
- Soldering defects: Optimize solder mask opening dimensions
4. Industry Frontier Developments
- Ultra-thin copper foils: Performance in 5G mmWave circuits (12μm thickness)
- Hybrid material solutions: Thermal test data for copper-graphene composites
- 3D-printed copper circuits: Precision breakthroughs in LDS technology
- Eco-friendly processing: Advances in cyanide-free copper plating
DE 
EN 
PT 
AR