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NOTRE BLOG
Les articles les plus récents traitent de sujets tels que les dernières technologies, les meilleures pratiques et l'actualité du secteur des PCB.
Août 21, 2025
A comprehensive overview of 10-layer PCB stackup design, covering standard stackup structures, five configuration options, key design considerations, and best practices. Practical guidance on signal integrity management, impedance control, power distribution optimization, and thermal management to help engineers achieve high-performance and highly reliable multilayer PCB designs.
Août 20, 2025
Août 19, 2025
Le concept des circuits imprimés sans halogène, les normes internationales et leurs différences par rapport aux circuits imprimés traditionnels contenant des halogènes. Il couvre le principe ignifuge des matériaux sans halogène, les caractéristiques de performance, les ajustements du processus de fabrication et les applications dans l'électronique grand public, l'électronique automobile, les appareils médicaux et d'autres domaines.
05
Juin
Terminologie de l'industrie des circuits imprimés couvrant des concepts clés tels que la structure des cartes, les spécifications de conception, les processus de fabrication et les propriétés des matériaux. Des alignements et pastilles de base aux technologies HDI complexes, et des composants traditionnels à trous traversants aux processus modernes de montage en surface, les articles fournissent des explications complètes et approfondies pour aider les lecteurs à maîtriser le langage spécialisé et les points techniques du domaine des PCB.
04
Cet article explore les technologies clés, les solutions rapides et les applications industrielles du prototypage de circuits imprimés multicouches, ainsi que les réponses d'experts à cinq défis techniques courants.Découvrez comment les services de prototypage professionnel réduisent les risques de développement et accélèrent la mise sur le marché, et découvrez les facteurs critiques dans la sélection d'un fournisseur de circuits imprimés.
03
This in-depth guide details the complete SMT process, covering pre-production prep, solder paste printing, component placement, reflow soldering, and quality inspection. It provides actionable solutions for 5 common production issues, along with specialized component handling tips and industry trends—an indispensable resource for electronics manufacturing professionals.
02
This guide systematically explains the full process technical details of blind via technology in multilayer PCBs, including laser drilling parameter settings, key via wall treatment processes, metallization quality control, and other core content. It provides practical solutions for five typical production problems, helping engineers master implementation essentials and optimization techniques for blind via processes.
01
This comprehensive guide covers PCB drilling techniques, highlighting mechanical and laser methods, critical process controls, and solutions to six frequent production issues. It also examines future trends, offering valuable insights for PCB manufacturers.
31
Mai
PCB panelization design critically impacts electronics manufacturing efficiency and quality. This comprehensive guide explains fundamental principles, including size selection, connection methods, and component orientation, as well as advanced techniques such as mixed panels and thermal balancing. Featuring solutions to 6 frequent production problems, it helps engineers optimize designs, improve efficiency, and lower costs. Valuable for both beginners and experienced professionals seeking practical panelization knowledge.
30
This article delves into cutting-edge PCB manufacturing technologies, including via-in-pad, blind/buried vias, and modified semi-additive process (mSAP), which enable ultra-high-density interconnects for modern electronics. Discover their key advantages, manufacturing challenges, industry applications, and future trends in 5G, AI, automotive, and IoT devices. Learn how these innovations drive smaller, faster, and more reliable circuit boards.
29
This comprehensive guide explains PCB manufacturing from design to finished product, covering both professional factory processes (4-layer board example) and DIY methods like heat transfer. Learn about materials selection, surface finishes, quality control, and future tech trends in the PCB industry. Perfect for engineers, hobbyists, and electronics enthusiasts.
28
Explore the evolution of printed circuit board types from single-panel to multilayer, key manufacturing processes (subtractive/additive), and advanced materials such as organic/inorganic substrates.
27
Learn everything about PCB relays - how they work, types (SPST, SPDT, DPST, DPDT), mounting techniques, and design best practices.
26
Participez au 2025 Mexico International Electronics & Power Expo (3-5 juin) ! Rencontrez plus de 360 fournisseurs, explorez les solutions PCB/SMT, les technologies de l'énergie et l'éclairage.
25
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