تقنية التركيب على السطح
High-Precision
تجميع SMT
Services
Zero-defect PCBA solutions · 24h turnaround · Sub-micron accuracy · Full supply chain
0
Years Experience
0
Global Clients
0
Prototype Turnaround
0
AOI Inspection Rate
What We Do
الدقة
التصنيع
Excellence
End-to-end PCBA solutions built on industrial grade equipment and a zero-defect commitment. From bare board to finished product, one trusted partner.
طلب عرض أسعار
01
Advanced SMT Assembly
01005 & fine-pitch BGA placement at ±0.03mm accuracy with Yamaha high-speed lines.
01005 Min.
±0.03mm
120K CPH
02
THT / Mixed Assembly
Heavy-duty through-hole soldering for power electronics and industrial controls.
Mixed PCB
Wave + Selective
03
3D AOI & X-Ray Inspection
100% automated coverage meeting IPC-A-610 Class 3. Every board cleared before shipment. Zero tolerance for defects.
الهيئة العربية للتصنيع 3D AOI
X-Ray AXI
IPC Class 3
04
Full Turnkey Supply Chain
Global component sourcing, PCB fabrication, PCBA, functional testing, and logistics — one partner, total visibility.
Global Sourcing
مفروش بالكامل
05
Prototype to Mass Production
Engineering prototypes in 24 hours scaling seamlessly to 1M+ units per month with no change in quality standards.
24h Proto
1M+ units/mo
How We Build
التصنيع
Workflow
Every board follows a battle-tested four-stage flow engineered for defect-free output.
01
معجون اللحام
معجون اللحام
Printing
Automated stencil printing with 3D SPI at every board — micron-level paste validation.
02
Pick & Place
Pick & Place
Mounting
High-speed Yamaha / Panasonic lines placing 01005 passives at ±0.03mm repeatability.
03
Nitrogen
Nitrogen
Reflow Oven
Multi-zone nitrogen reflow with precision thermal profiling for every board type.
04
3D AOI &
3D AOI &
X-Ray Audit
100% inline automated optical and X-ray inspection. Zero tolerance for defects.
المعلمات الفنية
Detailed
المواصفات
Every parameter engineered to meet the most demanding standards in electronics manufacturing.
01005Min. Component
±0.03mmدقة التنسيب
32LMax. Layer Count
Min. Component01005 (0.4 × 0.2mm)
دقة التنسيب±0.03mm
BGA Fine Pitch0.35mm
Max. Component Height25mm
Line Throughput120,000 CPH
الموادFR4, Aluminum, Rogers, Flex
Max. Board Size500 × 450mm
سُمك اللوح0.4 – 4.0mm
Layer Capability1 – 32 Layers
Min. Lead Time24 Hours (Prototype)
Paste Inspection3D SPI
Post-Reflowالهيئة العربية للتصنيع 3D AOI
BGA Joints3D X-Ray (AXI)
الاختبار الوظيفيتكنولوجيا المعلومات والاتصالات / FCT
قياسيIPC-A-610 الفئة 3
Common Questions
الأسئلة الشائعة
We require Gerber files (RS-274X), a BOM (Bill of Materials) in Excel format, and a CPL (Centroid / Pick & Place file).
Yes. We specialise in high-density components. Our 3D X-Ray inspection ensures all BGA solder joints are void-free.
We offer full turnkey (we source all components), partial turnkey, or fully consigned (you provide components) assembly. All options include free DFM review.
No MOQ. We support single prototype boards through to millions of units in mass production, with the same quality standards applied at every volume.
Start Your Project
Get a Free
Engineering Quote
Our engineers review every submission within 8 business hours. Upload your design files and we'll handle the rest.
- No minimum order quantity
- Engineering prototype in 24h
- IPC-A-610 Class 3 quality
- Free DFM analysis included
- Dedicated account engineer
آيزو 9001IPC CLASS
3بنفاياتUL
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