{"id":6766,"date":"2025-06-04T17:42:28","date_gmt":"2025-06-04T09:42:28","guid":{"rendered":"https:\/\/topfastpcba.com\/?p=6766"},"modified":"2025-06-04T17:42:33","modified_gmt":"2025-06-04T09:42:33","slug":"pcb-common-terminology","status":"publish","type":"post","link":"https:\/\/topfastpcba.com\/pt\/pcb-common-terminology\/","title":{"rendered":"Terminologia comum de PCB"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_75 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">\u00cdndice<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/topfastpcba.com\/pt\/pcb-common-terminology\/#Detailed_Explanation_of_Common_PCB_Terminology\" >Explica\u00e7\u00e3o detalhada da terminologia comum de PCBs<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/topfastpcba.com\/pt\/pcb-common-terminology\/#1_Basic_PCB_Structure_Terms\" >1. Termos b\u00e1sicos da estrutura da placa de circuito impresso<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/topfastpcba.com\/pt\/pcb-common-terminology\/#2_PCB_Design_and_Verification_Terms\" >2.Termos de projeto e verifica\u00e7\u00e3o de PCB<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/topfastpcba.com\/pt\/pcb-common-terminology\/#3_PCB_Hole-Related_Terms\" >3.Termos relacionados a furos de PCB<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/topfastpcba.com\/pt\/pcb-common-terminology\/#4_PCB_Manufacturing_Process_Terms\" >4.Termos do processo de fabrica\u00e7\u00e3o de PCBs<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/topfastpcba.com\/pt\/pcb-common-terminology\/#5_Special_PCB_Structures_and_Materials\" >5.Estruturas e materiais especiais para PCBs<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/topfastpcba.com\/pt\/pcb-common-terminology\/#6_PCB_Assembly_and_Testing_Terms\" >6.Termos de montagem e teste de PCB<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/topfastpcba.com\/pt\/pcb-common-terminology\/#7_Advanced_PCB_Design_Concepts\" >7.Conceitos avan\u00e7ados de projeto de PCB<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Detailed_Explanation_of_Common_PCB_Terminology\"><\/span>Explica\u00e7\u00e3o detalhada da terminologia comum de PCBs<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Basic_PCB_Structure_Terms\"><\/span>1. Termos b\u00e1sicos da estrutura da placa de circuito impresso<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Anel anular<\/strong> refere-se ao anel de cobre que envolve um furo passante revestido (PTH) em uma placa de circuito impresso. Essa estrutura \u00e9 essencial para a montagem de componentes e a transmiss\u00e3o de sinais, e sua largura afeta diretamente a confiabilidade da conex\u00e3o e a capacidade de condu\u00e7\u00e3o de corrente. Os projetistas devem garantir uma largura suficiente do anel anular para evitar falhas de conex\u00e3o devido ao desalinhamento da perfura\u00e7\u00e3o.<\/p>\n\n\n\n<p><strong>Almofada<\/strong> \u00e9 uma \u00e1rea de metal exposta na superf\u00edcie da placa de circuito impresso usada para soldar componentes. Dependendo do tipo de componente, os pads podem ser categorizados como pads de furo passante ou pads de montagem em superf\u00edcie. O projeto do pad deve considerar fatores como o tamanho do componente, o processo de soldagem e os requisitos de corrente.<\/p>\n\n\n\n<p><strong>Avi\u00e3o<\/strong> refere-se a grandes \u00e1reas de cobre em uma placa de circuito impresso, normalmente usadas para distribui\u00e7\u00e3o de energia ou aterramento. Diferentemente dos tra\u00e7os de sinal, os planos s\u00e3o definidos por limites em vez de caminhos, oferecendo imped\u00e2ncia mais baixa e melhor dissipa\u00e7\u00e3o de calor. O uso adequado de planos pode melhorar significativamente a compatibilidade eletromagn\u00e9tica (EMC) de uma PCB.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_PCB_Design_and_Verification_Terms\"><\/span>2. <a href=\"https:\/\/topfastpcba.com\/pt\/pcb-design-and-manufacturing\/\">Projeto de PCB<\/a> e termos de verifica\u00e7\u00e3o<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>DRC (verifica\u00e7\u00e3o de regras de projeto)<\/strong> \u00e9 um recurso de verifica\u00e7\u00e3o automatizada do software de design de PCB que garante a conformidade com os requisitos de fabrica\u00e7\u00e3o. Ele detecta problemas comuns, como espa\u00e7amento insuficiente entre tra\u00e7os, furos subdimensionados ou an\u00e9is anulares inadequados, garantindo a capacidade de fabrica\u00e7\u00e3o.<\/p>\n\n\n\n<p><strong>Arquivos Gerber<\/strong> s\u00e3o o formato de arquivo padr\u00e3o para a fabrica\u00e7\u00e3o de PCBs, contendo dados gr\u00e1ficos para cada camada. Os arquivos Gerber modernos normalmente usam o formato RS-274X, que suporta tabelas de abertura incorporadas e atributos de camada. A gera\u00e7\u00e3o precisa de arquivos Gerber \u00e9 fundamental para a transi\u00e7\u00e3o do projeto para a produ\u00e7\u00e3o.<\/p>\n\n\n\n<p><strong>Arquivos ODB++<\/strong> s\u00e3o um formato alternativo de dados de fabrica\u00e7\u00e3o que usa uma estrutura de banco de dados em vez de arquivos separados, fornecendo uma representa\u00e7\u00e3o mais completa da inten\u00e7\u00e3o do projeto. Comparado ao Gerber, o ODB++ inclui informa\u00e7\u00f5es adicionais, como netlists e especifica\u00e7\u00f5es de materiais, reduzindo os erros de comunica\u00e7\u00e3o.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_PCB_Hole-Related_Terms\"><\/span>3.Termos relacionados a furos de PCB<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Furo passante revestido (PTH)<\/strong> is a hole drilled through the entire PCB and plated with conductive metal, used for interlayer connections or mounting through-hole components. PTH reliability depends on plating quality and thickness, typically requiring an average copper thickness of at least 20\u03bcm.<\/p>\n\n\n\n<p><strong>Via<\/strong> \u00e9 um orif\u00edcio revestido especificamente para conex\u00f5es entre camadas, categorizado em tr\u00eas tipos principais:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Atrav\u00e9s da Via<\/strong>: Passa por todas as camadas, \u00e9 simples de fabricar, mas ocupa mais espa\u00e7o.<\/li>\n\n\n\n<li><strong>Via cega<\/strong>Conecta uma camada externa a uma camada interna, aumentando a densidade do roteamento.<\/li>\n\n\n\n<li><strong>Enterrado via<\/strong>Conecta apenas as camadas internas, conservando ainda mais o espa\u00e7o da superf\u00edcie.<\/li>\n<\/ul>\n\n\n\n<p><strong>Microvia<\/strong> is a small via (typically less than 150\u03bcm in diameter) created using laser drilling, widely used in HDI (High-Density Interconnect) boards. Microvias enable higher connection density, supporting modern high-pin-count components.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_PCB_Manufacturing_Process_Terms\"><\/span>4. <a href=\"https:\/\/topfastpcba.com\/pt\/pcb-manufacturing-proofing-process\/\">Processo de fabrica\u00e7\u00e3o de PCBs<\/a> Termos<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>M\u00e1scara de solda<\/strong> \u00e9 um revestimento protetor aplicado \u00e0 superf\u00edcie da placa de circuito impresso, geralmente verde (embora vermelho, azul, preto e outras cores tamb\u00e9m sejam usadas). Ele evita curtos-circuitos e oxida\u00e7\u00e3o, com aberturas que exp\u00f5em os pads para soldagem. A precis\u00e3o do alinhamento afeta diretamente a qualidade da solda.<\/p>\n\n\n\n<p><strong>Pasta de solda<\/strong> \u00e9 uma mistura de p\u00f3 de solda e fluxo usada na montagem de superf\u00edcie. Ele \u00e9 depositado com precis\u00e3o nas almofadas usando um est\u00eancil e derrete durante a soldagem por refluxo para formar conex\u00f5es el\u00e9tricas. A composi\u00e7\u00e3o do metal, o tamanho das part\u00edculas e o n\u00edvel de atividade devem ser selecionados com base nos requisitos da aplica\u00e7\u00e3o.<\/p>\n\n\n\n<p><strong>Solda por Refluxo<\/strong> \u00e9 uma etapa essencial na montagem SMT, em que o aquecimento controlado derrete a pasta de solda para formar juntas confi\u00e1veis.Um perfil t\u00edpico de refluxo inclui est\u00e1gios de pr\u00e9-aquecimento, imers\u00e3o, refluxo e resfriamento, cada um exigindo um controle preciso da temperatura.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_Special_PCB_Structures_and_Materials\"><\/span>5.Estruturas e materiais especiais para PCBs<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Dedo de ouro<\/strong> refere-se a abas de contato banhadas a ouro na borda de uma PCB, normalmente usando revestimento de ouro duro (com uma camada inferior de n\u00edquel) para resist\u00eancia ao desgaste. As considera\u00e7\u00f5es de projeto incluem for\u00e7a de inser\u00e7\u00e3o, resist\u00eancia de contato e ciclos de acoplamento. Comumente encontrado em m\u00f3dulos de mem\u00f3ria e placas de expans\u00e3o.<\/p>\n\n\n\n<p><strong>PCB r\u00edgido-flex\u00edvel<\/strong> combina os benef\u00edcios dos circuitos r\u00edgidos e flex\u00edveis, apresentando se\u00e7\u00f5es r\u00edgidas e flex\u00edveis.Esse design reduz os requisitos de conectores e aumenta a confiabilidade, mas \u00e9 mais caro e complexo de projetar.Geralmente usado em dispositivos aeroespaciais e m\u00e9dicos.<\/p>\n\n\n\n<p><strong>Prepreg (material pr\u00e9-impregnado)<\/strong> \u00e9 um material de liga\u00e7\u00e3o em PCBs multicamadas, composto de fibra de vidro revestida de resina. Durante a lamina\u00e7\u00e3o, a resina flui e cura, unindo as camadas do n\u00facleo. Os diferentes tipos de pr\u00e9-impregnados variam em termos de conte\u00fado de resina e caracter\u00edsticas de fluxo.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"885\" height=\"596\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/aqua-pcb1\u200b.jpg\" alt=\"Terminologia comum de PCB\" class=\"wp-image-6571\" style=\"width:600px\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/aqua-pcb1\u200b.jpg 885w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/aqua-pcb1\u200b-300x202.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/aqua-pcb1\u200b-768x517.jpg 768w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/aqua-pcb1\u200b-150x101.jpg 150w\" sizes=\"auto, (max-width: 885px) 100vw, 885px\" \/><\/figure>\n<\/div>\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"6_PCB_Assembly_and_Testing_Terms\"><\/span>6.Termos de montagem e teste de PCB<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Escolha e coloque<\/strong> is an automated component placement process in SMT assembly lines. Modern machines achieve placement speeds of tens of thousands of components per hour with \u00b125\u03bcm accuracy. Programming considerations include component recognition, feeder arrangement, and placement sequence.<\/p>\n\n\n\n<p><strong>Solda por onda<\/strong> \u00e9 usado para componentes de furo passante, em que a placa de circuito impresso passa sobre uma onda de solda derretida, formando juntas por meio de a\u00e7\u00e3o capilar. Os principais controles do processo incluem a aplica\u00e7\u00e3o do fluxo, a temperatura de pr\u00e9-aquecimento e o tempo de contato da onda.<\/p>\n\n\n\n<p><strong>Teste de sonda voadora<\/strong> \u00e9 um m\u00e9todo de teste el\u00e9trico sem acess\u00f3rios em que as sondas program\u00e1veis entram em contato com os pontos de teste para verificar a continuidade e o isolamento. Em compara\u00e7\u00e3o com os testes de base de pregos, os testes de sonda voadora exigem menos tempo de configura\u00e7\u00e3o e s\u00e3o ideais para produ\u00e7\u00e3o de baixo volume.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"7_Advanced_PCB_Design_Concepts\"><\/span>7.Conceitos avan\u00e7ados de projeto de PCB<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Gravura em cobre<\/strong> removes excess copper to form circuit patterns. To reduce etching time and chemical consumption, unused copper areas are often designed as grids or hatched patterns\u2014a technique known as copper thieving or balancing.<\/p>\n\n\n\n<p><strong>Al\u00edvio t\u00e9rmico<\/strong> \u00e9 um projeto de tra\u00e7o especial que conecta os pads aos planos, usando raios finos em vez de conex\u00f5es s\u00f3lidas para controlar a dissipa\u00e7\u00e3o de calor durante a soldagem. O al\u00edvio t\u00e9rmico adequado garante o desempenho el\u00e9trico e facilita a soldagem.<\/p>\n\n\n\n<p><strong>Integridade do sinal (SI)<\/strong> estuda a qualidade da transmiss\u00e3o de sinais em PCBs, abrangendo o controle de imped\u00e2ncia, a supress\u00e3o de diafonia e a an\u00e1lise de tempo. Os projetos de alta velocidade devem levar em conta o efeito de pele, a perda diel\u00e9trica e as descontinuidades de imped\u00e2ncia de via.<\/p>\n\n\n\n<p>Ao dominar esses termos de PCB, os engenheiros podem comunicar a inten\u00e7\u00e3o do projeto com mais precis\u00e3o, solucionar problemas de fabrica\u00e7\u00e3o com mais efici\u00eancia e colaborar melhor em toda a cadeia de suprimentos.\u00c0 medida que a tecnologia eletr\u00f4nica evolui, a terminologia de PCB continua a se expandir, tornando o aprendizado cont\u00ednuo essencial para manter a experi\u00eancia profissional.<\/p>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Terminologia do setor de PCBs que abrange conceitos-chave, como estrutura da placa, especifica\u00e7\u00f5es de projeto, processos de fabrica\u00e7\u00e3o e propriedades do material.De alinhamentos e pads b\u00e1sicos a tecnologias complexas de HDI, e de componentes tradicionais de furo passante a processos modernos de montagem em superf\u00edcie, os artigos fornecem explica\u00e7\u00f5es abrangentes e detalhadas para ajudar os leitores a dominar a linguagem especializada e os pontos t\u00e9cnicos do campo de PCB.<\/p>","protected":false},"author":2,"featured_media":6767,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[],"class_list":["post-6766","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.6 - 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