{"id":6489,"date":"2025-04-24T09:42:38","date_gmt":"2025-04-24T01:42:38","guid":{"rendered":"https:\/\/topfastpcba.com\/?p=6489"},"modified":"2025-10-22T17:17:06","modified_gmt":"2025-10-22T09:17:06","slug":"etched-fpc","status":"publish","type":"post","link":"https:\/\/topfastpcba.com\/pt\/etched-fpc\/","title":{"rendered":"FPC gravado"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_75 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">\u00cdndice<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/topfastpcba.com\/pt\/etched-fpc\/#What_is_the_meaning_of_circuit_board_etching\" >Qual \u00e9 o significado de grava\u00e7\u00e3o de placa de circuito?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/topfastpcba.com\/pt\/etched-fpc\/#What_is_circuit_board_etching\" >O que \u00e9 grava\u00e7\u00e3o de placa de circuito?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/topfastpcba.com\/pt\/etched-fpc\/#Circuit_board_etching_principle\" >Princ\u00edpio de grava\u00e7\u00e3o da placa de circuito<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/topfastpcba.com\/pt\/etched-fpc\/#1_Basic_Principle_of_Etching\" >1. Princ\u00edpio b\u00e1sico da grava\u00e7\u00e3o<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/topfastpcba.com\/pt\/etched-fpc\/#2_Classification_of_Etching_Processes\" >2.Classifica\u00e7\u00e3o dos processos de grava\u00e7\u00e3o<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/topfastpcba.com\/pt\/etched-fpc\/#3_Process_Flow\" >3.Fluxo do processo<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/topfastpcba.com\/pt\/etched-fpc\/#4_Key_Control_Factors\" >4.Principais fatores de controle<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/topfastpcba.com\/pt\/etched-fpc\/#The_influencing_factors_of_etching_are_as_follows\" >Os fatores que influenciam a grava\u00e7\u00e3o s\u00e3o os seguintes:<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/topfastpcba.com\/pt\/etched-fpc\/#Etching_Application_Scope\" >Escopo do aplicativo de grava\u00e7\u00e3o<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_is_the_meaning_of_circuit_board_etching\"><\/span>Qual \u00e9 o significado de grava\u00e7\u00e3o de placa de circuito?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>As placas de circuito da placa para mostrar o processo gr\u00e1fico do circuito s\u00e3o mais complexas, o atual <a href=\"https:\/\/topfastpcba.com\/pt\/pcba-production-process\/\">processamento de placas de circuito impresso (PCB)<\/a> of the typical process using the \u201cgraphic plating method\u201d, that is, first in the outer layer of the circuit board to be retained on the part of the copper foil, that is, the circuit of the graphic part of a layer of lead and tin pre-plated on the corrosion-resistant layer, and then chemically corroded off the rest of the copper foil, called the Etching.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_is_circuit_board_etching\"><\/span>O que \u00e9 grava\u00e7\u00e3o de placa de circuito?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>O m\u00e9todo de grava\u00e7\u00e3o usa a solu\u00e7\u00e3o de grava\u00e7\u00e3o fora das linhas condutoras do m\u00e9todo de remo\u00e7\u00e3o da folha de cobre, o m\u00e9todo de grava\u00e7\u00e3o usa a m\u00e1quina de grava\u00e7\u00e3o fora das linhas condutoras do m\u00e9todo de remo\u00e7\u00e3o da folha de cobre; o primeiro \u00e9 um m\u00e9todo qu\u00edmico, mais comum, e o \u00faltimo \u00e9 um m\u00e9todo f\u00edsico. O m\u00e9todo de grava\u00e7\u00e3o da placa de circuito \u00e9 um m\u00e9todo de corros\u00e3o qu\u00edmica que usa \u00e1cido sulf\u00farico concentrado para corroer o revestimento de cobre indesejado nas placas de circuito. O m\u00e9todo de grava\u00e7\u00e3o usa m\u00e9todos f\u00edsicos, com uma m\u00e1quina de grava\u00e7\u00e3o especializada, e a cabe\u00e7a de corte grava a placa revestida de cobre para formar um m\u00e9todo de alinhamento de circuito.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Circuit_board_etching_principle\"><\/span>Princ\u00edpio de grava\u00e7\u00e3o da placa de circuito<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>O princ\u00edpio da grava\u00e7\u00e3o de PCB \u00e9 a remo\u00e7\u00e3o seletiva da folha de cobre indesejada da camada revestida de cobre por meio de m\u00e9todos qu\u00edmicos ou f\u00edsicos, preservando o padr\u00e3o do circuito projetado.O n\u00facleo do processo est\u00e1 nas rea\u00e7\u00f5es redox.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Basic_Principle_of_Etching\"><\/span>1. <strong>Princ\u00edpio b\u00e1sico da grava\u00e7\u00e3o<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>A grava\u00e7\u00e3o envolve o uso de uma solu\u00e7\u00e3o qu\u00edmica (etchant) para dissolver as \u00e1reas desprotegidas da folha de cobre por meio de rea\u00e7\u00f5es redox, formando o padr\u00e3o de circuito desejado. As principais rea\u00e7\u00f5es incluem:<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"714\" height=\"272\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/\u516c\u5f0f.jpg\" alt=\"\" class=\"wp-image-6493\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/\u516c\u5f0f.jpg 714w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/\u516c\u5f0f-300x114.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/\u516c\u5f0f-150x57.jpg 150w\" sizes=\"auto, (max-width: 714px) 100vw, 714px\" \/><\/figure>\n<\/div>\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Classification_of_Etching_Processes\"><\/span>2. <strong>Classifica\u00e7\u00e3o dos processos de grava\u00e7\u00e3o<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Gravura \u00famida<\/strong>: Usa solu\u00e7\u00f5es qu\u00edmicas, divididas em tipos \u00e1cidos (cloreto de cobre) e alcalinos (am\u00f4nia), adequadas para circuitos de alta precis\u00e3o.<\/li>\n\n\n\n<li><strong>Gravura a seco<\/strong>: Depende do impacto f\u00edsico (por exemplo, plasma) para remover o material, usado principalmente na fabrica\u00e7\u00e3o de semicondutores.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Process_Flow\"><\/span>3. <strong>Fluxo do processo<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Transfer\u00eancia de padr\u00e3o<\/strong>O projeto do circuito \u00e9 transferido para a placa revestida de cobre por meio de exposi\u00e7\u00e3o\/desenvolvimento ou impress\u00e3o em tela, formando uma camada de resist\u00eancia para proteger o padr\u00e3o desejado.<\/li>\n\n\n\n<li><strong>Gravura<\/strong>A placa \u00e9 imersa ou pulverizada com um condicionador para remover o cobre desprotegido.<\/li>\n\n\n\n<li><strong>P\u00f3s-processamento<\/strong>A decapagem e a limpeza da resist\u00eancia produzem o padr\u00e3o final do circuito.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Key_Control_Factors\"><\/span>4. <strong>Principais fatores de controle<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Taxa de grava\u00e7\u00e3o<\/strong>: Affected by solution concentration, temperature (typically 45\u00b15\u00b0C), and flow rate.<\/li>\n\n\n\n<li><strong>Controle de rebaixamento<\/strong>: O tempo excessivo de grava\u00e7\u00e3o causa rebaixamento; os par\u00e2metros devem ser otimizados para melhorar o fator de grava\u00e7\u00e3o (rela\u00e7\u00e3o entre a profundidade da grava\u00e7\u00e3o e a largura do rebaixamento).<\/li>\n\n\n\n<li><strong>Manuten\u00e7\u00e3o de solu\u00e7\u00f5es<\/strong>: O reabastecimento regular de oxidantes (por exemplo, \u00e1cido clor\u00eddrico) garante a efici\u00eancia da rea\u00e7\u00e3o.<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"979\" height=\"641\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Etched-FPC.jpg\" alt=\"\" class=\"wp-image-6491\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Etched-FPC.jpg 979w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Etched-FPC-300x196.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Etched-FPC-768x503.jpg 768w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Etched-FPC-150x98.jpg 150w\" sizes=\"auto, (max-width: 979px) 100vw, 979px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"The_influencing_factors_of_etching_are_as_follows\"><\/span>Os fatores que influenciam a grava\u00e7\u00e3o s\u00e3o os seguintes:<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>M\u00e9todo de grava\u00e7\u00e3o<\/strong><br>A grava\u00e7\u00e3o por imers\u00e3o e por bolhas causar\u00e1 maior corros\u00e3o lateral, a corros\u00e3o lateral por respingos e por pulveriza\u00e7\u00e3o \u00e9 menor, especialmente a grava\u00e7\u00e3o por pulveriza\u00e7\u00e3o apresenta os melhores resultados.<\/li>\n\n\n\n<li><strong>O tipo de solu\u00e7\u00e3o de grava\u00e7\u00e3o<\/strong><br>Diferentes componentes qu\u00edmicos de diferentes solu\u00e7\u00f5es de corros\u00e3o, suas taxas de corros\u00e3o s\u00e3o diferentes e o coeficiente de corros\u00e3o tamb\u00e9m \u00e9 diferente. Por exemplo, o coeficiente de corros\u00e3o da solu\u00e7\u00e3o \u00e1cida de corros\u00e3o de cloreto de cobre \u00e9 geralmente 3, enquanto o coeficiente de corros\u00e3o da solu\u00e7\u00e3o alcalina de corros\u00e3o de cloreto de cobre pode chegar a 4. Estudos recentes mostraram que o sistema de corros\u00e3o \u00e0 base de \u00e1cido n\u00edtrico quase n\u00e3o produz corros\u00e3o lateral para obter a corros\u00e3o das paredes laterais da linha pr\u00f3ximas \u00e0 vertical.<\/li>\n\n\n\n<li><strong>Taxa de grava\u00e7\u00e3o<\/strong><br>A taxa de grava\u00e7\u00e3o lenta causar\u00e1 corros\u00e3o lateral grave, e a melhoria da qualidade da grava\u00e7\u00e3o e a taxa de grava\u00e7\u00e3o t\u00eam muito a ver com a acelera\u00e7\u00e3o. Quanto mais r\u00e1pida for a taxa de grava\u00e7\u00e3o, a placa permanecer\u00e1 na solu\u00e7\u00e3o de grava\u00e7\u00e3o por menos tempo, menor ser\u00e1 a quantidade de corros\u00e3o lateral e os gr\u00e1ficos ser\u00e3o gravados de forma clara e organizada.<\/li>\n\n\n\n<li><strong>O valor do pH da solu\u00e7\u00e3o de corros\u00e3o<\/strong><br>O valor de PH da solu\u00e7\u00e3o alcalina de grava\u00e7\u00e3o \u00e9 mais alto e a corros\u00e3o lateral aumenta. Para reduzir a corros\u00e3o lateral, o valor geral de PH deve ser controlado abaixo de 8,5.<\/li>\n\n\n\n<li><strong>Densidade da solu\u00e7\u00e3o de corros\u00e3o<\/strong><br>A densidade muito baixa da solu\u00e7\u00e3o alcalina de corros\u00e3o agravar\u00e1 a corros\u00e3o lateral; a escolha de uma alta concentra\u00e7\u00e3o de cobre na solu\u00e7\u00e3o de corros\u00e3o para reduzir a corros\u00e3o lateral \u00e9 favor\u00e1vel.<\/li>\n\n\n\n<li><strong>Espessura da folha de cobre<\/strong><br>Para obter o m\u00ednimo de corros\u00e3o lateral da grava\u00e7\u00e3o de fios finos, \u00e9 melhor usar uma folha de cobre (super) fina. E quanto menor a largura do fio, mais fina deve ser a espessura da folha de cobre. Quanto mais fina for a folha de cobre na solu\u00e7\u00e3o de grava\u00e7\u00e3o por um per\u00edodo mais curto, menor ser\u00e1 a quantidade de corros\u00e3o lateral.<br>Com a crescente demanda por miniaturiza\u00e7\u00e3o e alto desempenho em produtos eletr\u00f4nicos, as placas PCB multicamadas se tornaram a principal op\u00e7\u00e3o no mercado em virtude da maior integra\u00e7\u00e3o, da integridade do sinal e do desempenho de dissipa\u00e7\u00e3o de calor que elas proporcionam.<\/li>\n<\/ol>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Etching_Application_Scope\"><\/span>Escopo do aplicativo de grava\u00e7\u00e3o<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>Aplica\u00e7\u00f5es: Usado principalmente na fabrica\u00e7\u00e3o de PCBs (placas de camada \u00fanica e multicamadas), dispositivos semicondutores, etc.<br>Desafio: Necessidade de equilibrar a precis\u00e3o e a efici\u00eancia da grava\u00e7\u00e3o, para evitar o cobre residual ou a grava\u00e7\u00e3o excessiva causada por defeitos no circuito.<br>Por meio dos princ\u00edpios e processos acima, a tecnologia de grava\u00e7\u00e3o realiza o processamento gr\u00e1fico de circuitos de alta precis\u00e3o de dispositivos eletr\u00f4nicos, que \u00e9 um dos principais processos do setor eletr\u00f4nico moderno.<\/p>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>o circuito da parte gr\u00e1fica de uma camada de chumbo e estanho pr\u00e9-revestida na camada resistente \u00e0 corros\u00e3o e, em seguida, corro\u00edda quimicamente do restante da folha de cobre, chamada de Etching (grava\u00e7\u00e3o).<\/p>","protected":false},"author":2,"featured_media":6490,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[71],"class_list":["post-6489","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry","tag-fpc"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.6 - 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