{"id":1517,"date":"2025-04-19T09:28:00","date_gmt":"2025-04-19T01:28:00","guid":{"rendered":"https:\/\/topfastpcba.com\/?p=1517"},"modified":"2025-04-18T17:33:01","modified_gmt":"2025-04-18T09:33:01","slug":"pcb-pcba-common-technical-terms","status":"publish","type":"post","link":"https:\/\/topfastpcba.com\/pt\/pcb-pcba-common-technical-terms\/","title":{"rendered":"Termos t\u00e9cnicos comuns de PCB\/PCBA"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_75 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">\u00cdndice<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/topfastpcba.com\/pt\/pcb-pcba-common-technical-terms\/#Here_are_the_translations_of_the_8_PCB_professional_terms\" >Aqui est\u00e3o as tradu\u00e7\u00f5es dos 8 termos profissionais do PCB:<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/topfastpcba.com\/pt\/pcb-pcba-common-technical-terms\/#PCBA_Processing_%E2%80%93_30_Key_Terms\" >PCBA Processing \u2013 30 Key Terms<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Here_are_the_translations_of_the_8_PCB_professional_terms\"><\/span>Aqui est\u00e3o as tradu\u00e7\u00f5es dos 8 termos profissionais do PCB:<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>01 <strong>Painel (matriz)<\/strong><br>Alguns fabricantes de PCBs se referem \u00e0s matrizes como \"pain\u00e9is\". Os pain\u00e9is s\u00e3o divididos em <strong>pain\u00e9is de expedi\u00e7\u00e3o<\/strong> e <strong>pain\u00e9is de trabalho<\/strong>. A <strong>painel de expedi\u00e7\u00e3o<\/strong> refere-se \u00e0s PCBs organizadas para remessa, geralmente projetadas para atender aos requisitos de produ\u00e7\u00e3o de PCBA, e \u00e0s vezes \u00e9 chamado de \"conjunto\". <strong>painel de trabalho<\/strong> refere-se \u00e0 matriz de produ\u00e7\u00e3o, que cont\u00e9m v\u00e1rios pain\u00e9is de expedi\u00e7\u00e3o. Os PCBs s\u00e3o fabricados como pain\u00e9is de trabalho e, posteriormente, separados em pain\u00e9is de expedi\u00e7\u00e3o.<br>02 <strong>\u00d3xido preto \/ \u00d3xido marrom<\/strong><br>Esse \u00e9 um processo qu\u00edmico que forma uma camada uniforme e difusa na superf\u00edcie do cobre. Essa camada aumenta a \u00e1rea de contato entre o cobre e o pr\u00e9-impregnado (PP), melhorando a ades\u00e3o.<br>O objetivo do \u00f3xido preto e do \u00f3xido marrom \u00e9 o mesmo, mas eles diferem no comprimento da penugem, no custo qu\u00edmico e na dificuldade do processo.O \u00f3xido preto proporciona uma ades\u00e3o mais forte do que o \u00f3xido marrom, mas \u00e9 mais caro e mais dif\u00edcil de manusear. Al\u00e9m disso, o \u00f3xido preto \u00e9 mais propenso a defeitos de \"anel rosa\". Atualmente, a maioria dos fabricantes usa o processo de \u00f3xido marrom.<br>03 <strong>Lamina\u00e7\u00e3o<\/strong><br>As PCBs multicamadas exigem o empilhamento de v\u00e1rios n\u00facleos, camadas de PP e folhas de cobre, que s\u00e3o ent\u00e3o unidas sob alta temperatura e press\u00e3o.Sob calor, o PP torna-se viscoso e flui sob press\u00e3o, preenchendo as lacunas gravadas nas camadas internas de cobre.<br>04 <strong>V\u00e1rios tipos de furos<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>PTH (Plated Through Hole)<\/strong>: Um orif\u00edcio metalizado e revestido de cobre.<\/li>\n\n\n\n<li><strong>NPTH (Non-Plated Through Hole)<\/strong>: Um orif\u00edcio n\u00e3o revestido de cobre e n\u00e3o metalizado.<\/li>\n\n\n\n<li><strong>Via<\/strong>: Um pequeno orif\u00edcio revestido de cobre usado apenas para condu\u00e7\u00e3o el\u00e9trica.<\/li>\n\n\n\n<li><strong>Buraco cego<\/strong>: Um furo que come\u00e7a na camada superior ou inferior, mas n\u00e3o atravessa toda a placa (vis\u00edvel em um lado).<\/li>\n\n\n\n<li><strong>Enterrado via<\/strong>: Um orif\u00edcio que conecta as camadas internas da PCB sem atingir as camadas externas de cobre (invis\u00edvel do lado de fora).<\/li>\n\n\n\n<li><strong>Furo HDI (interconex\u00e3o de alta densidade)<\/strong>: Microfuros cegos formados por perfura\u00e7\u00e3o a laser.<br>05 <strong>Deposi\u00e7\u00e3o de cobre sem eletr\u00f3lise (revestimento qu\u00edmico de cobre)<\/strong><br>Tamb\u00e9m conhecido como revestimento qu\u00edmico de cobre, esse processo envolve uma rea\u00e7\u00e3o de oxida\u00e7\u00e3o-redu\u00e7\u00e3o na superf\u00edcie do substrato para formar uma fina camada de cobre, permitindo conex\u00f5es el\u00e9tricas entre camadas e facilitando o revestimento de cobre subsequente.<br>06 <strong>M\u00e1scara de solda<\/strong><br>A m\u00e1scara de solda, tamb\u00e9m chamada de resist\u00eancia de solda, \u00e9 uma camada de tinta aplicada \u00e0 superf\u00edcie da placa de circuito impresso para evitar curtos de solda.<br>A tinta da m\u00e1scara de solda \u00e9 muito comum em PCBs, sendo que cerca de 90% s\u00e3o verdes. Entretanto, outras cores tamb\u00e9m est\u00e3o dispon\u00edveis, como vermelho, azul, preto, branco e amarelo.<br>As fun\u00e7\u00f5es da m\u00e1scara de solda incluem:<\/li>\n\n\n\n<li>Evitar a soldagem incorreta de componentes.<\/li>\n\n\n\n<li>Preven\u00e7\u00e3o de pontes de solda.<\/li>\n\n\n\n<li>Fornecer prote\u00e7\u00e3o (a camada de pol\u00edmero cobre os tra\u00e7os de metal, oferecendo resist\u00eancia \u00e0 n\u00e9voa salina, umidade etc.).<br>07 <strong>Acabamento da superf\u00edcie<\/strong><br>O cobre nu tem boa soldabilidade, mas tende a se oxidar quando exposto ao ar por longos per\u00edodos. Portanto, o tratamento de superf\u00edcie \u00e9 aplicado para garantir boa soldabilidade ou desempenho el\u00e9trico.<br>Os acabamentos de superf\u00edcie comuns incluem:<\/li>\n\n\n\n<li>HASL (nivelamento de solda por ar quente)<\/li>\n\n\n\n<li>ENIG (ouro de imers\u00e3o em n\u00edquel sem eletr\u00f3lito)<\/li>\n\n\n\n<li>OSP (conservante org\u00e2nico de soldabilidade)<\/li>\n\n\n\n<li>Lata de imers\u00e3o<\/li>\n\n\n\n<li>Prata de imers\u00e3o<\/li>\n\n\n\n<li>Ouro galvanizado<\/li>\n\n\n\n<li>Dedos de ouro galvanizado<br>08 <strong>V-CUT<\/strong><br>O V-CUT \u00e9 um m\u00e9todo comum para separar PCBs em unidades individuais e remover bordas residuais. O <strong>espessura restante<\/strong> after V-CUT refers to the thickness left after the upper and lower blades cut the PCB. This thickness must be neither too thick nor too thin\u2014if too thick, separation is difficult and causes high stress; if too thin, the board lacks support and may break during production. Common V-CUT angles are 30\u00b0, 45\u00b0, and 60\u00b0.<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"800\" height=\"800\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Medical-Equipment-PCBA.jpg\" alt=\"\" class=\"wp-image-1518\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Medical-Equipment-PCBA.jpg 800w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Medical-Equipment-PCBA-300x300.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Medical-Equipment-PCBA-150x150.jpg 150w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Medical-Equipment-PCBA-768x768.jpg 768w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Medical-Equipment-PCBA-400x400.jpg 400w\" sizes=\"auto, (max-width: 800px) 100vw, 800px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"PCBA_Processing_%E2%80%93_30_Key_Terms\"><\/span><strong>PCBA Processing \u2013 30 Key Terms<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>Na fabrica\u00e7\u00e3o de produtos eletr\u00f4nicos, <strong><a href=\"https:\/\/topfastpcba.com\/pt\/pcb-assembly\/\">PCBA<\/a> (Montagem de placa de circuito impresso)<\/strong> O processamento \u00e9 um processo complexo e preciso que envolve v\u00e1rios termos t\u00e9cnicos e tecnologias essenciais.<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>PCBA<\/strong> \u2013 Short for <em>Montagem de placas de circuito impresso<\/em>, referindo-se a todo o processo de fabrica\u00e7\u00e3o de PCBs, incluindo <strong>Montagem SMT, inser\u00e7\u00e3o de DIP, teste funcional e montagem final<\/strong>.<\/li>\n\n\n\n<li><strong>PCB<\/strong> \u2013 Short for <em>Placa de circuito impresso<\/em>O termo \"placa de circuito impresso\", normalmente se refere a placas de circuito, que podem ser <strong>face simples, dupla face ou multicamadas<\/strong>, feito de materiais como <strong>Substratos de FR-4, resina, fibra de vidro ou alum\u00ednio<\/strong>.<\/li>\n\n\n\n<li><strong>Arquivo Gerber<\/strong> \u2013 A set of files describing PCB images (circuit layers, solder mask, silkscreen, etc.) along with drilling and milling data, required for PCBA quotations.<\/li>\n\n\n\n<li><strong>BOM (Lista de Materiais)<\/strong> \u2013 A list of all components used in PCBA, including quantities and process routes, serving as a key reference for procurement.<\/li>\n\n\n\n<li><strong>SMT (tecnologia de montagem em superf\u00edcie)<\/strong> \u2013 A process involving <strong>impress\u00e3o de pasta de solda, coloca\u00e7\u00e3o de componentes e solda por refluxo<\/strong> sobre PCBs.<\/li>\n\n\n\n<li><strong>Impress\u00e3o de pasta de solda<\/strong> \u2013 Depositing solder paste through a stencil onto PCB pads using a squeegee blade.<\/li>\n\n\n\n<li><strong>SPI (inspe\u00e7\u00e3o de pasta de solda)<\/strong> \u2013 A machine that checks solder paste thickness and printing quality post-application.<\/li>\n\n\n\n<li><strong>Solda por Refluxo<\/strong> \u2013 Heating PCBs in a reflow oven to melt solder paste, forming solid solder joints upon cooling.<\/li>\n\n\n\n<li><strong>AOI (inspe\u00e7\u00e3o \u00f3ptica automatizada)<\/strong> \u2013 A scanning system that detects soldering defects by comparing PCB images to standards.<\/li>\n\n\n\n<li><strong>DIP (Dual In-line Package)<\/strong> \u2013 A process where <strong>componentes de furo passante<\/strong> s\u00e3o inseridos nos PCBs, seguidos por <strong>solda por onda, corte de pinos, retoques e limpeza<\/strong>.<\/li>\n\n\n\n<li><strong>Solda por onda<\/strong> \u2013 Passing PCBs over a molten solder wave to solder through-hole components.<\/li>\n\n\n\n<li><strong>Corte de pinos<\/strong> \u2013 Cutting excess component leads after soldering for proper sizing.<\/li>\n\n\n\n<li><strong>Retoque (retrabalho)<\/strong> \u2013 Repairing incomplete or defective solder joints manually.<\/li>\n\n\n\n<li><strong>Limpeza da placa<\/strong> \u2013 Removing flux residues and contaminants to meet environmental and cleanliness standards.<\/li>\n\n\n\n<li><strong>Revestimento conformal<\/strong> \u2013 Applying a protective layer (e.g., acrylic, silicone) to PCBA for <strong>isolamento, resist\u00eancia \u00e0 umidade e preven\u00e7\u00e3o de corros\u00e3o<\/strong>.<\/li>\n\n\n\n<li><strong>Pads (padr\u00f5es de terra)<\/strong> \u2013 Exposed copper areas on PCBs for component soldering.<\/li>\n\n\n\n<li><strong>Embalagem de componentes<\/strong> \u2013 The physical form of components, mainly <strong>DIP (through-hole) e SMD (surface-mount)<\/strong>.<\/li>\n\n\n\n<li><strong>Pitch (espa\u00e7amento de chumbo)<\/strong> \u2013 The distance between adjacent component leads\/terminals.<\/li>\n\n\n\n<li><strong>QFP (Quad Flat Package)<\/strong> \u2013 A surface-mount IC with gull-wing leads on all four sides.<\/li>\n\n\n\n<li><strong>BGA (Ball Grid Array)<\/strong> \u2013 An IC package with solder balls arranged in a grid on its underside.<\/li>\n\n\n\n<li><strong>QA (Garantia de Qualidade)<\/strong> \u2013 Ensures product quality through inspections and testing.<\/li>\n\n\n\n<li><strong>FCT (teste de circuito funcional)<\/strong> \u2013 Simulates real-world operation to verify PCBA functionality.<\/li>\n\n\n\n<li><strong>Teste de queima<\/strong> \u2013 Stress-testing PCBAs under extreme conditions to identify early failures.<\/li>\n\n\n\n<li><strong>Teste de vibra\u00e7\u00e3o<\/strong> \u2013 Assessing PCBA durability against mechanical vibrations during use\/transport.<\/li>\n\n\n\n<li><strong>IQC (Controle de Qualidade de Entrada)<\/strong> \u2013 Inspects raw materials\/components upon receipt.<\/li>\n\n\n\n<li><strong>Est\u00eancil (m\u00e1scara de solda)<\/strong> \u2013 A laser-cut metal sheet for precise solder paste deposition.<\/li>\n\n\n\n<li><strong>Dispositivo (Jig)<\/strong> \u2013 A tool for batch production, including <strong>montagem, teste e dispositivos de teste de PCB<\/strong>.<\/li>\n\n\n\n<li><strong>Furo passante revestido (PTH)<\/strong> \u2013 Copper-plated holes for interlayer connections\/signal transmission.<\/li>\n\n\n\n<li><strong>M\u00e1scara de solda<\/strong> \u2013 A protective layer over copper traces to prevent shorts\/corrosion.<\/li>\n\n\n\n<li><strong>SMD (Surface-Mount Device, dispositivo de montagem em superf\u00edcie)<\/strong> \u2013 Components mounted directly onto PCBs without leads, the dominant assembly method today.<\/li>\n<\/ol>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Here\u2019s the translation of the **30 PCBA (Printed Circuit Board Assembly) processing terms** in the electronics manufacturing industry<\/p>","protected":false},"author":2,"featured_media":1075,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[],"class_list":["post-1517","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.6 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB\/PCBA common technical terms - Topfastpcba<\/title>\n<meta name=\"description\" content=\"Here\u2019s the translation of the **30 PCBA (Printed Circuit Board Assembly) processing terms** in the electronics manufacturing industry\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/topfastpcba.com\/pt\/pcb-pcba-common-technical-terms\/\" \/>\n<meta property=\"og:locale\" content=\"pt_BR\" \/>\n<meta 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