{"id":1165,"date":"2025-03-15T15:05:14","date_gmt":"2025-03-15T07:05:14","guid":{"rendered":"https:\/\/topfastpcba.com\/?p=1165"},"modified":"2025-03-21T11:52:18","modified_gmt":"2025-03-21T03:52:18","slug":"what-are-the-pcb-surface-treatment-processes","status":"publish","type":"post","link":"https:\/\/topfastpcba.com\/pt\/what-are-the-pcb-surface-treatment-processes\/","title":{"rendered":"Quais s\u00e3o os processos de tratamento de superf\u00edcie de PCBs, bem como suas vantagens e desvantagens"},"content":{"rendered":"

O processo de tratamento de superf\u00edcie de PCBs refere-se ao Placa PCB<\/a> componentes, conex\u00f5es el\u00e9tricas na forma\u00e7\u00e3o artificial de uma camada e as propriedades mec\u00e2nicas, f\u00edsicas e qu\u00edmicas do substrato da camada superficial, o objetivo principal \u00e9 garantir que a PCB tenha uma boa soldabilidade e propriedades el\u00e9tricas. Tecnologia comum de tratamento de superf\u00edcie de PCBs, incluindo nivelamento de ar quente (HASL), processo de revestimento org\u00e2nico (OSP), niquelagem qu\u00edmica\/imers\u00e3o em ouro (ENIG), processo de imers\u00e3o em prata, processo de imers\u00e3o em estanho e outros processos de niquelagem em ouro e pal\u00e1dio qu\u00edmico.<\/p>\n\n\n

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1, o nivelamento de solda por ar quente (HASL) \u00e9 uma tecnologia tradicional de tratamento de superf\u00edcie de PCB, por meio da superf\u00edcie da PCB revestida com uma camada de solda derretida e o uso de ar quente para torn\u00e1-la plana.Aplic\u00e1vel ao processo SMT, solda sem chumbo, processo maduro, baixo custo, f\u00e1cil de operar, adequado para os requisitos gerais de produtos eletr\u00f4nicos, especialmente placas grossas ou finas t\u00eam limita\u00e7\u00f5es, n\u00e3o sendo adequado para o projeto de interruptor de contato.
2\u3001Organic coating process (OSP) is a thin layer of organic protective film coated on the surface of the PCB, this film can prevent the oxidation of copper foil, and improve solderability. Suitable for lead-free soldering and SMT, low cost, environmentally friendly, OSP process is environmentally friendly, low cost, suitable for short-term storage and soldering of PCBs, the limitations of the number of reflow soldering, not suitable for crimping technology, wire bonding, and storage conditions require high.
3, revestimento qu\u00edmico de n\u00edquel\/imers\u00e3o em ouro (ENIG) \u00e9 uma camada de n\u00edquel quimicamente revestida na superf\u00edcie da placa de circuito impresso e, em seguida, tratamento de imers\u00e3o em ouro.Aplic\u00e1vel a PTH (plated through-hole), superf\u00edcie plana, sem chumbo, boa soldabilidade e resist\u00eancia \u00e0 corros\u00e3o, caro, n\u00e3o retrabalh\u00e1vel, longa vida \u00fatil, adequado para produtos eletr\u00f4nicos de alta densidade e passo fino.
4, o processo de imers\u00e3o em prata \u00e9 a forma\u00e7\u00e3o de uma camada de prata na superf\u00edcie da placa de circuito impresso, com boa condutividade e soldabilidade.Alta soldabilidade, boa planicidade da superf\u00edcie, baixo custo e sem chumbo (compat\u00edvel com RoHS), baixa resist\u00eancia de contato, adequado para circuitos de alta frequ\u00eancia, altos requisitos de armazenamento, a prata \u00e9 f\u00e1cil de oxidar, f\u00e1cil de ser contaminada, janela de montagem curta ap\u00f3s a remo\u00e7\u00e3o da embalagem, afetando a soldabilidade e a resist\u00eancia \u00e0 corros\u00e3o.<\/p>\n\n\n

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5, o processo de imers\u00e3o em estanho \u00e9 revestido com uma camada de estanho na superf\u00edcie da placa de circuito impresso, adequado para componentes de passo fino\/BGA\/menores, excelente nivelamento, custo m\u00e9dio, boa soldabilidade, mas baixa resist\u00eancia \u00e0 corros\u00e3o, adequado para ocasi\u00f5es que exigem alta soldabilidade, sens\u00edvel ao manuseio, vida \u00fatil curta, erosivo para a m\u00e1scara de solda.
6, revestimento qu\u00edmico de n\u00edquel - o ouro de imers\u00e3o de revestimento qu\u00edmico de pal\u00e1dio (ENEPIG) \u00e9 feito por meio do agente redutor (como o di-hidrog\u00eanio hipofosfito de s\u00f3dio), de modo que os \u00edons de pal\u00e1dio na redu\u00e7\u00e3o da superf\u00edcie catal\u00edtica se transformem em pal\u00e1dio, o pal\u00e1dio rec\u00e9m-nascido pode ser chamado para promover a rea\u00e7\u00e3o do catalisador e, assim, pode ser obtido em qualquer espessura de camada revestida de pal\u00e1dio, mais ecol\u00f3gico do que o ENIG, pode fornecer boas propriedades el\u00e9tricas e prote\u00e7\u00e3o, com boa confiabilidade de soldagem, estabilidade t\u00e9rmica e planicidade da superf\u00edcie. A desvantagem \u00e9 que o pal\u00e1dio \u00e9 um metal precioso raro, portanto, o custo aumentar\u00e1.
7, o ouro duro (ouro duro eletrol\u00edtico) est\u00e1 no condutor da superf\u00edcie da placa de circuito impresso, primeiro revestido em uma camada de n\u00edquel e, em seguida, revestido em uma camada de ouro. O revestimento de n\u00edquel tem como principal objetivo evitar a difus\u00e3o do ouro e do cobre entre a soldagem, o que far\u00e1 com que o ouro galvanizado se torne fr\u00e1gil, diminuindo a vida \u00fatil e, portanto, evitando a soldagem no ouro galvanizado.<\/p>\n\n\n

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A escolha do processo correto de tratamento de superf\u00edcie de PCB pode melhorar significativamente o desempenho e a confiabilidade dos produtos eletr\u00f4nicos, mas tamb\u00e9m pode economizar muito em custos. A Topfast PCBA \u00e9 especializada em PCB\/PCBA<\/a> fabrica\u00e7\u00e3o com servi\u00e7o completo, selecionando a solu\u00e7\u00e3o certa para o seu projeto e fornecendo solu\u00e7\u00f5es de fabrica\u00e7\u00e3o eletr\u00f4nica profissionais e eficientes.<\/p>","protected":false},"excerpt":{"rendered":"

O processo de tratamento da superf\u00edcie da placa de circuito impresso refere-se aos componentes da placa de circuito impresso, \u00e0s conex\u00f5es el\u00e9tricas na forma\u00e7\u00e3o artificial de uma camada e \u00e0s propriedades mec\u00e2nicas, f\u00edsicas e qu\u00edmicas do substrato da camada de superf\u00edcie, cujo objetivo principal \u00e9 garantir que a placa de circuito impresso tenha boa soldabilidade e propriedades el\u00e9tricas. <\/p>","protected":false},"author":2,"featured_media":1167,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[53,63],"class_list":["post-1165","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry","tag-pcb-board","tag-surface-treatment-process"],"yoast_head":"\nWhat are the PCB surface treatment processes, as well as the advantages and disadvantages - Topfastpcba<\/title>\n<meta name=\"description\" content=\"PCB surface treatment process, refers to the PCB board components, electrical connections on the artificial formation of a layer and the substrate's mechanical, physical and chemical properties of the surface layer, the core purpose is to ensure that the PCB has a good solderability and electrical properties.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/topfastpcba.com\/pt\/what-are-the-pcb-surface-treatment-processes\/\" \/>\n<meta property=\"og:locale\" content=\"pt_BR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"What are the PCB surface treatment processes, as well as the advantages and disadvantages - 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