{"id":8099,"date":"2025-11-07T13:53:08","date_gmt":"2025-11-07T05:53:08","guid":{"rendered":"https:\/\/topfastpcba.com\/?p=8099"},"modified":"2025-11-07T13:53:14","modified_gmt":"2025-11-07T05:53:14","slug":"pcb-via-in-pad-design-in-manufacturing","status":"publish","type":"post","link":"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/","title":{"rendered":"Conception de vias dans les pastilles pour circuits imprim\u00e9s dans la fabrication"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_75 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table des mati\u00e8res<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#What_is_Via-in-Pad\" >Qu'est-ce que Via-in-Pad ?<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#Why_Use_Via-in-Pad\" >Pourquoi utiliser Via-in-Pad ?<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#Two_Core_Processes_Resin_Plugging_vs_Electroplating_Filling\" >Deux processus principaux : bouchage \u00e0 la r\u00e9sine ou remplissage par galvanoplastie<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#Process_Comparison_Table\" >Tableau comparatif des processus<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#Key_Points_for_Resin_Plugging_Practice\" >Points cl\u00e9s pour la pratique du bouchage \u00e0 la r\u00e9sine<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#Insider_Knowledge_of_Electroplating_Filling_Technology\" >Connaissances approfondies de la technologie de remplissage par galvanoplastie<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#%E2%80%9CPit_Avoidance_Guide%E2%80%9D_for_the_Design_Phase\" >\u00ab Guide pour \u00e9viter les pi\u00e8ges \u00bb pour la phase de conception<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#Golden_Rules_for_Aperture_Design\" >R\u00e8gles d'or pour la conception des ouvertures<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#Wisdom_in_Material_Selection\" >Sagesse dans le choix des mat\u00e9riaux<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#Production_Process\" >Processus de production<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#Manufacturing_Process_Flow\" >Processus de fabrication<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#Key_Control_Points\" >Points de contr\u00f4le cl\u00e9s<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#Quality_Inspection\" >Inspection de la qualit\u00e9<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#Comprehensive_Inspection_Methods\" >M\u00e9thodes d'inspection compl\u00e8tes<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#Reliability_Test_Items\" >\u00c9l\u00e9ments du test de fiabilit\u00e9<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#When_Should_You_Use_Via-in-Pad\" >Quand utiliser Via-in-Pad ?<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#Recommended_Application_Scenarios\" >Sc\u00e9narios d'application recommand\u00e9s<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#Use_with_Caution\" >\u00c0 utiliser avec pr\u00e9caution<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/#Summary\" >R\u00e9sum\u00e9<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_is_Via-in-Pad\"><\/span>Qu'est-ce que Via-in-Pad ?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>La technologie Via-in-Pad (VIP) signifie essentiellement <strong>Placement des vias directement \u00e0 l'int\u00e9rieur des pastilles des composants<\/strong>. Voyez les choses ainsi : alors que les conceptions traditionnelles placent les vias \u00e0 c\u00f4t\u00e9 des pastilles, la technologie VIP permet aux vias de \u00ab r\u00e9sider \u00bb \u00e0 l'int\u00e9rieur m\u00eame des pastilles.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Why_Use_Via-in-Pad\"><\/span>Pourquoi utiliser Via-in-Pad ?<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Tableau comparatif des sc\u00e9narios d'application<\/strong><\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Sc\u00e9nario d'application<\/th><th>Probl\u00e8mes li\u00e9s \u00e0 la conception traditionnelle<\/th><th>Solution VIP<\/th><\/tr><\/thead><tbody><tr><td>Puces BGA<\/td><td>Broches trop denses, pas d'espace pour les vias<\/td><td>Les vias sont dissimul\u00e9s sous les pastilles, ce qui permet de gagner de la place.<\/td><\/tr><tr><td>Circuits haute fr\u00e9quence<\/td><td>Les chemins de signal longs affectent les performances<\/td><td>Raccourcir les chemins, am\u00e9liorer la qualit\u00e9 du signal<\/td><\/tr><tr><td>Modules d'alimentation<\/td><td>Mauvaise dissipation thermique, surchauffe des puces<\/td><td>Am\u00e9liorer la dissipation thermique gr\u00e2ce aux vias<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p><strong>Cas r\u00e9el<\/strong>: Le bo\u00eetier BGA d'un processeur sur une carte m\u00e8re de smartphone a un pas de broche de seulement 0,4 mm &amp;#8211 ; sans VIP, le routage serait impossible !<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Two_Core_Processes_Resin_Plugging_vs_Electroplating_Filling\"><\/span>Deux processus principaux : bouchage \u00e0 la r\u00e9sine ou remplissage par galvanoplastie<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Process_Comparison_Table\"><\/span>Tableau comparatif des processus<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Caract\u00e9ristique<\/th><th>Bouchon en r\u00e9sine<\/th><th>Remplissage par galvanoplastie<\/th><\/tr><\/thead><tbody><tr><td>Co\u00fbt<\/td><td>Moyen<\/td><td>Haut<\/td><\/tr><tr><td>Difficult\u00e9<\/td><td>Relativement facile<\/td><td>Difficile<\/td><\/tr><tr><td>Plan\u00e9it\u00e9 de surface<\/td><td>Bon (n\u00e9cessite un meulage)<\/td><td>Excellent<\/td><\/tr><tr><td>Conductivit\u00e9 thermique<\/td><td>Moyenne<\/td><td>Excellent<\/td><\/tr><tr><td>Sc\u00e9narios d'application<\/td><td>BGA standard<\/td><td>Puces haut de gamme, exigences \u00e9lev\u00e9es en mati\u00e8re de dissipation thermique<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Key_Points_for_Resin_Plugging_Practice\"><\/span>Points cl\u00e9s pour la pratique du bouchage \u00e0 la r\u00e9sine<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Le choix des mat\u00e9riaux est essentiel<\/strong>:<br>R\u00e9sine de haute qualit\u00e9 = faible taux de retrait + valeur Tg \u00e9lev\u00e9e + CTE adapt\u00e9<\/p>\n\n\n\n<p>Si le taux de retrait de la r\u00e9sine est trop \u00e9lev\u00e9, un \u00ab effet de piq\u00fbre \u00bb se produit, similaire \u00e0 l'affaissement d'une route, provoquant un creusement de la surface du tampon et entra\u00eenant des d\u00e9fauts de soudure.<\/p>\n\n\n\n<p><strong>Points de contr\u00f4le du processus<\/strong>:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Propret\u00e9 : contamination dans les trous ? Absolument pas ! Comme une op\u00e9ration st\u00e9rile en chirurgie.<\/li>\n\n\n\n<li>Filling Pressure: Too high \u2192 resin overflow; Too low \u2192 incomplete filling<\/li>\n\n\n\n<li>Courbe de cuisson : une augmentation rapide de la temp\u00e9rature provoque la formation de bulles, comme lorsque l'on contr\u00f4le la chaleur lors de la cuisson au four.<\/li>\n<\/ol>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Insider_Knowledge_of_Electroplating_Filling_Technology\"><\/span>Connaissances approfondies de la technologie de remplissage par galvanoplastie<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Exigences \u00e9lev\u00e9es en mati\u00e8re d'\u00e9quipement<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>\u00c9quipement de d\u00e9p\u00f4t horizontal de cuivre<\/li>\n\n\n\n<li>Syst\u00e8me de galvanoplastie \u00e0 impulsions<\/li>\n\n\n\n<li>Logiciel de contr\u00f4le de pr\u00e9cision<\/li>\n<\/ul>\n\n\n\n<p><strong>Indicateur de r\u00e9ussite<\/strong>: Lors de l'inspection transversale, le trou doit ressembler \u00e0 un pilier en cuivre massif sans vide !<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/11\/PCB-Via-in-Pad-1.jpg\" alt=\"PCB Via-in-Pad\" class=\"wp-image-8100\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/11\/PCB-Via-in-Pad-1.jpg 600w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/11\/PCB-Via-in-Pad-1-300x201.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/11\/PCB-Via-in-Pad-1-18x12.jpg 18w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/11\/PCB-Via-in-Pad-1-150x101.jpg 150w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"%E2%80%9CPit_Avoidance_Guide%E2%80%9D_for_the_Design_Phase\"><\/span>\u00ab Guide pour \u00e9viter les pi\u00e8ges \u00bb pour la phase de conception<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Golden_Rules_for_Aperture_Design\"><\/span>R\u00e8gles d'or pour la conception des ouvertures<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Recommand\u00e9 : via laser de 0,10 mm<br>Avertissement : la difficult\u00e9 de remplissage augmente consid\u00e9rablement pour les trous &gt; 0,15 mm !<\/p>\n\n\n\n<p><strong>Calcul de la taille du tampon<\/strong>:<br>Pad diameter \u2265 Hole diameter + 0.20mm<\/p>\n\n\n\n<p>Exemple : pour un trou de 0,10 mm de diam\u00e8tre, le plot doit mesurer au moins 0,30 mm.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Wisdom_in_Material_Selection\"><\/span>Sagesse dans le choix des mat\u00e9riaux<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Mat\u00e9riau de base : Choisissez FR-4 TG170 ou sup\u00e9rieur pour une r\u00e9sistance aux temp\u00e9ratures \u00e9lev\u00e9es.<\/li>\n\n\n\n<li>Feuille de cuivre : doit \u00eatre compatible avec le processus de galvanoplastie.<\/li>\n\n\n\n<li>Communication pr\u00e9coce : ne partez pas du principe que les fabricants peuvent tout faire !<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Production_Process\"><\/span>Processus de production<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Manufacturing_Process_Flow\"><\/span>Processus de fabrication<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Drilling \u2192 Hole Metallization \u2192 Plugging\/Filling \u2192 Surface Treatment \u2192 Inspection<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Key_Control_Points\"><\/span>Points de contr\u00f4le cl\u00e9s<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>\u00c9tape de forage<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Contr\u00f4lez correctement la \u00ab chaleur \u00bb pour le per\u00e7age au laser.<\/li>\n\n\n\n<li>Les parois lisses comme un miroir sont id\u00e9ales<\/li>\n<\/ul>\n\n\n\n<p><strong>Liste de contr\u00f4le de la qualit\u00e9 de la phase de branchement<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Plan\u00e9it\u00e9 de surface : d\u00e9pression &lt; 25 um<\/li>\n\n\n\n<li>Taux de remplissage : &gt;95 %<\/li>\n\n\n\n<li>Bulles : tol\u00e9rance z\u00e9ro<\/li>\n\n\n\n<li>Propret\u00e9 : aucune contamination<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/11\/PCB-Via-in-Pad.jpg\" alt=\"PCB Via-in-Pad\" class=\"wp-image-8101\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/11\/PCB-Via-in-Pad.jpg 600w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/11\/PCB-Via-in-Pad-300x201.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/11\/PCB-Via-in-Pad-18x12.jpg 18w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/11\/PCB-Via-in-Pad-150x101.jpg 150w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Quality_Inspection\"><\/span>Inspection de la qualit\u00e9<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Comprehensive_Inspection_Methods\"><\/span>M\u00e9thodes d'inspection compl\u00e8tes<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>M\u00e9thode d'inspection<\/th><th>Ce qu'il faut v\u00e9rifier<\/th><th>Exigences standard<\/th><\/tr><\/thead><tbody><tr><td>Analyse de la microsection<\/td><td>Structure interne<\/td><td>Pas de vides, l'\u00e9paisseur du cuivre est conforme aux normes<\/td><\/tr><tr><td>Inspection AOI<\/td><td>D\u00e9fauts de surface<\/td><td>Pas de d\u00e9pression, pas de contamination<\/td><\/tr><tr><td>Rayons X<\/td><td>Remplissage interne<\/td><td>Pas de vides de grande superficie<\/td><\/tr><tr><td>Test \u00e9lectrique<\/td><td>Performances de connexion<\/td><td>Test de continuit\u00e9 \u00e0 100 %<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Reliability_Test_Items\"><\/span>\u00c9l\u00e9ments du test de fiabilit\u00e9<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Thermal Stress Test: 288\u2103 solder pot immersion for 10 seconds, check for board delamination<\/li>\n\n\n\n<li>Temperature Cycling: -55\u2103 to 125\u2103 repeated testing, verify lifespan<\/li>\n\n\n\n<li>Essai de choc thermique : passage instantan\u00e9 entre le froid extr\u00eame et la chaleur extr\u00eame, essai d'adh\u00e9rence du mat\u00e9riau<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"When_Should_You_Use_Via-in-Pad\"><\/span>Quand utiliser Via-in-Pad ?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Recommended_Application_Scenarios\"><\/span>Sc\u00e9narios d'application recommand\u00e9s<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Sous les puces BGA, en particulier avec un pas inf\u00e9rieur \u00e0 0,8 mm<\/li>\n\n\n\n<li>Les broches d'alimentation du CPU\/GPU n\u00e9cessitent une bonne dissipation thermique.<\/li>\n\n\n\n<li>Les signaux diff\u00e9rentiels \u00e0 haute fr\u00e9quence n\u00e9cessitent une imp\u00e9dance constante.<\/li>\n\n\n\n<li>Interfaces haut d\u00e9bit telles que HDMI, USB 3.0<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Use_with_Caution\"><\/span>\u00c0 utiliser avec pr\u00e9caution<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Les projets sensibles aux co\u00fbts n\u00e9cessitent des compromis.<\/li>\n\n\n\n<li>Lorsque la capacit\u00e9 de traitement du fabricant est insuffisante<\/li>\n\n\n\n<li>Lorsque les conceptions traditionnelles suffisent pour les composants \u00e0 pas standard<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Summary\"><\/span>R\u00e9sum\u00e9<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>Via-in-Pad est une technologie cl\u00e9 pour la conception de circuits imprim\u00e9s \u00e0 haute densit\u00e9, qui n\u00e9cessite une collaboration \u00e9troite entre les \u00e9quipes de conception et de fabrication pour une mise en \u0153uvre r\u00e9ussie. Gr\u00e2ce \u00e0 une s\u00e9lection appropri\u00e9e des processus, \u00e0 un contr\u00f4le qualit\u00e9 rigoureux et \u00e0 une v\u00e9rification approfondie de la fiabilit\u00e9, ses avantages en termes de gain d'espace et d'am\u00e9lioration des performances peuvent \u00eatre pleinement exploit\u00e9s.<\/p>","protected":false},"excerpt":{"rendered":"<p>Analyse d\u00e9taill\u00e9e des points cl\u00e9s du processus de la technologie PCB Via-in-Pad, comparant les diff\u00e9rences entre les vias remplis de r\u00e9sine et les vias \u00e9lectroplaqu\u00e9s, fournissant un guide complet de la conception \u00e0 la fabrication, y compris des recommandations de param\u00e8tres et des m\u00e9thodes de contr\u00f4le qualit\u00e9.<\/p>","protected":false},"author":2,"featured_media":8102,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[157],"class_list":["post-8099","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry","tag-via-in-pad"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.6 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB Via-in-Pad Design in Manufacturing - Topfastpcba<\/title>\n<meta name=\"description\" content=\"Detailed Analysis of PCB Via-in-Pad Design and Manufacturing: Resin Via-Filling vs. Electroplating Process Comparison, BGA Pad Via Design Parameters and Quality Inspection Standards, Enabling Successful Mass Production of High-Density PCBs.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"PCB Via-in-Pad Design in Manufacturing - Topfastpcba\" \/>\n<meta property=\"og:description\" content=\"Detailed Analysis of PCB Via-in-Pad Design and Manufacturing: Resin Via-Filling vs. Electroplating Process Comparison, BGA Pad Via Design Parameters and Quality Inspection Standards, Enabling Successful Mass Production of High-Density PCBs.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/\" \/>\n<meta property=\"og:site_name\" content=\"Topfastpcba\" \/>\n<meta property=\"article:published_time\" content=\"2025-11-07T05:53:08+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2025-11-07T05:53:14+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/11\/PCB-Via-in-Pad-2.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"600\" \/>\n\t<meta property=\"og:image:height\" content=\"402\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"topfastpcb\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"\u00c9crit par\" \/>\n\t<meta name=\"twitter:data1\" content=\"topfastpcb\" \/>\n\t<meta name=\"twitter:label2\" content=\"Dur\u00e9e de lecture estim\u00e9e\" \/>\n\t<meta name=\"twitter:data2\" content=\"4 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/topfastpcba.com\/pcb-via-in-pad-design-in-manufacturing\/\",\"url\":\"https:\/\/topfastpcba.com\/pcb-via-in-pad-design-in-manufacturing\/\",\"name\":\"PCB Via-in-Pad Design in Manufacturing - Topfastpcba\",\"isPartOf\":{\"@id\":\"https:\/\/topfastpcba.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/topfastpcba.com\/pcb-via-in-pad-design-in-manufacturing\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/topfastpcba.com\/pcb-via-in-pad-design-in-manufacturing\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/11\/PCB-Via-in-Pad-2.jpg\",\"datePublished\":\"2025-11-07T05:53:08+00:00\",\"dateModified\":\"2025-11-07T05:53:14+00:00\",\"author\":{\"@id\":\"https:\/\/topfastpcba.com\/#\/schema\/person\/3c78a799254faaf83da2317660076c6e\"},\"description\":\"Detailed Analysis of PCB Via-in-Pad Design and Manufacturing: Resin Via-Filling vs. Electroplating Process Comparison, BGA Pad Via Design Parameters and Quality Inspection Standards, Enabling Successful Mass Production of High-Density PCBs.\",\"breadcrumb\":{\"@id\":\"https:\/\/topfastpcba.com\/pcb-via-in-pad-design-in-manufacturing\/#breadcrumb\"},\"inLanguage\":\"fr-FR\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/topfastpcba.com\/pcb-via-in-pad-design-in-manufacturing\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/topfastpcba.com\/pcb-via-in-pad-design-in-manufacturing\/#primaryimage\",\"url\":\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/11\/PCB-Via-in-Pad-2.jpg\",\"contentUrl\":\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/11\/PCB-Via-in-Pad-2.jpg\",\"width\":600,\"height\":402,\"caption\":\"PCB Via-in-Pad\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/topfastpcba.com\/pcb-via-in-pad-design-in-manufacturing\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/topfastpcba.com\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Industry\",\"item\":\"https:\/\/topfastpcba.com\/category\/industry\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"PCB Via-in-Pad Design in Manufacturing\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/topfastpcba.com\/#website\",\"url\":\"https:\/\/topfastpcba.com\/\",\"name\":\"Topfastpcba\",\"description\":\"Topfast Prime Choice for Global Electronics Manufacturing\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/topfastpcba.com\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"fr-FR\"},{\"@type\":\"Person\",\"@id\":\"https:\/\/topfastpcba.com\/#\/schema\/person\/3c78a799254faaf83da2317660076c6e\",\"name\":\"topfastpcb\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"PCB Via-in-Pad Design in Manufacturing - Topfastpcba","description":"Detailed Analysis of PCB Via-in-Pad Design and Manufacturing: Resin Via-Filling vs. Electroplating Process Comparison, BGA Pad Via Design Parameters and Quality Inspection Standards, Enabling Successful Mass Production of High-Density PCBs.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/","og_locale":"fr_FR","og_type":"article","og_title":"PCB Via-in-Pad Design in Manufacturing - Topfastpcba","og_description":"Detailed Analysis of PCB Via-in-Pad Design and Manufacturing: Resin Via-Filling vs. Electroplating Process Comparison, BGA Pad Via Design Parameters and Quality Inspection Standards, Enabling Successful Mass Production of High-Density PCBs.","og_url":"https:\/\/topfastpcba.com\/fr\/pcb-via-in-pad-design-in-manufacturing\/","og_site_name":"Topfastpcba","article_published_time":"2025-11-07T05:53:08+00:00","article_modified_time":"2025-11-07T05:53:14+00:00","og_image":[{"width":600,"height":402,"url":"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/11\/PCB-Via-in-Pad-2.jpg","type":"image\/jpeg"}],"author":"topfastpcb","twitter_card":"summary_large_image","twitter_misc":{"\u00c9crit par":"topfastpcb","Dur\u00e9e de lecture estim\u00e9e":"4 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/topfastpcba.com\/pcb-via-in-pad-design-in-manufacturing\/","url":"https:\/\/topfastpcba.com\/pcb-via-in-pad-design-in-manufacturing\/","name":"PCB Via-in-Pad Design in Manufacturing - Topfastpcba","isPartOf":{"@id":"https:\/\/topfastpcba.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/topfastpcba.com\/pcb-via-in-pad-design-in-manufacturing\/#primaryimage"},"image":{"@id":"https:\/\/topfastpcba.com\/pcb-via-in-pad-design-in-manufacturing\/#primaryimage"},"thumbnailUrl":"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/11\/PCB-Via-in-Pad-2.jpg","datePublished":"2025-11-07T05:53:08+00:00","dateModified":"2025-11-07T05:53:14+00:00","author":{"@id":"https:\/\/topfastpcba.com\/#\/schema\/person\/3c78a799254faaf83da2317660076c6e"},"description":"Detailed Analysis of PCB Via-in-Pad Design and Manufacturing: Resin Via-Filling vs. Electroplating Process Comparison, BGA Pad Via Design Parameters and Quality Inspection Standards, Enabling Successful Mass Production of High-Density PCBs.","breadcrumb":{"@id":"https:\/\/topfastpcba.com\/pcb-via-in-pad-design-in-manufacturing\/#breadcrumb"},"inLanguage":"fr-FR","potentialAction":[{"@type":"ReadAction","target":["https:\/\/topfastpcba.com\/pcb-via-in-pad-design-in-manufacturing\/"]}]},{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/topfastpcba.com\/pcb-via-in-pad-design-in-manufacturing\/#primaryimage","url":"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/11\/PCB-Via-in-Pad-2.jpg","contentUrl":"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/11\/PCB-Via-in-Pad-2.jpg","width":600,"height":402,"caption":"PCB Via-in-Pad"},{"@type":"BreadcrumbList","@id":"https:\/\/topfastpcba.com\/pcb-via-in-pad-design-in-manufacturing\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/topfastpcba.com\/"},{"@type":"ListItem","position":2,"name":"Industry","item":"https:\/\/topfastpcba.com\/category\/industry\/"},{"@type":"ListItem","position":3,"name":"PCB Via-in-Pad Design in Manufacturing"}]},{"@type":"WebSite","@id":"https:\/\/topfastpcba.com\/#website","url":"https:\/\/topfastpcba.com\/","name":"Topfastpcba","description":"Topfast Prime Choice for Global Electronics Manufacturing","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/topfastpcba.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"fr-FR"},{"@type":"Person","@id":"https:\/\/topfastpcba.com\/#\/schema\/person\/3c78a799254faaf83da2317660076c6e","name":"topfastpcb"}]}},"_links":{"self":[{"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/posts\/8099","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/comments?post=8099"}],"version-history":[{"count":1,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/posts\/8099\/revisions"}],"predecessor-version":[{"id":8103,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/posts\/8099\/revisions\/8103"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/media\/8102"}],"wp:attachment":[{"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/media?parent=8099"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/categories?post=8099"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/tags?post=8099"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}