{"id":8071,"date":"2025-10-27T17:43:37","date_gmt":"2025-10-27T09:43:37","guid":{"rendered":"https:\/\/topfastpcba.com\/?p=8071"},"modified":"2025-10-27T17:43:42","modified_gmt":"2025-10-27T09:43:42","slug":"general-standard-for-printed-circuit-boards-pcb","status":"publish","type":"post","link":"https:\/\/topfastpcba.com\/fr\/general-standard-for-printed-circuit-boards-pcb\/","title":{"rendered":"Norme g\u00e9n\u00e9rale pour les cartes de circuits imprim\u00e9s (PCB)"},"content":{"rendered":"<p>Les cartes de circuits imprim\u00e9s (PCB) constituent la base fondamentale des appareils \u00e9lectroniques, et leur qualit\u00e9 et leur fiabilit\u00e9 ont un impact direct sur les performances de l'ensemble du syst\u00e8me \u00e9lectronique. Afin de garantir la coh\u00e9rence et la fiabilit\u00e9 tout au long des processus de conception, de fabrication, d'assemblage et de test des PCB, l'industrie a \u00e9tabli une s\u00e9rie de normes universelles. Cet article pr\u00e9sente de mani\u00e8re syst\u00e9matique les principales normes relatives aux PCB, couvrant plusieurs \u00e9tapes critiques telles que <strong>S\u00e9lection des mat\u00e9riaux<\/strong>, <strong>D\u00e9roulement du processus<\/strong>, <strong>Contr\u00f4le de la qualit\u00e9<\/strong>et <strong>Exigences environnementales<\/strong>, aidant les ing\u00e9nieurs et les fabricants \u00e0 am\u00e9liorer de mani\u00e8re globale la conformit\u00e9 et les performances des produits.<\/p>\n\n\n\n<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_75 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table des mati\u00e8res<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/topfastpcba.com\/fr\/general-standard-for-printed-circuit-boards-pcb\/#Section_1_Design_and_Material_Standards\" >Section 1 : Normes relatives \u00e0 la conception et aux mat\u00e9riaux<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/topfastpcba.com\/fr\/general-standard-for-printed-circuit-boards-pcb\/#1_IPC-6010_Series_Quality_and_Performance_Specifications\" >1. S\u00e9rie IPC-6010 : Sp\u00e9cifications de qualit\u00e9 et de performance<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/topfastpcba.com\/fr\/general-standard-for-printed-circuit-boards-pcb\/#2_Material_Standards\" >2. Normes relatives aux mat\u00e9riaux<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/topfastpcba.com\/fr\/general-standard-for-printed-circuit-boards-pcb\/#Section_2_Process_and_Manufacturing_Standards\" >Section 2 : Normes de processus et de fabrication<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/topfastpcba.com\/fr\/general-standard-for-printed-circuit-boards-pcb\/#1_Soldering_and_Cleaning\" >1. Soudure et nettoyage<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/topfastpcba.com\/fr\/general-standard-for-printed-circuit-boards-pcb\/#2_Stencils_and_Coatings\" >2. Pochoirs et rev\u00eatements<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/topfastpcba.com\/fr\/general-standard-for-printed-circuit-boards-pcb\/#3_Thermal_Management_and_Reliability\" >3. Gestion thermique et fiabilit\u00e9<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/topfastpcba.com\/fr\/general-standard-for-printed-circuit-boards-pcb\/#Section_3_Assembly_and_Inspection_Standards\" >Section 3 : Normes d'assemblage et d'inspection<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/topfastpcba.com\/fr\/general-standard-for-printed-circuit-boards-pcb\/#1_Assembly_Specifications\" >1. Sp\u00e9cifications d'assemblage<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/topfastpcba.com\/fr\/general-standard-for-printed-circuit-boards-pcb\/#2_Inspection_and_Testing\" >2. Inspection et essais<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/topfastpcba.com\/fr\/general-standard-for-printed-circuit-boards-pcb\/#Section_4_Environmental_and_Safety_Standards\" >Section 4 : Normes environnementales et de s\u00e9curit\u00e9<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/topfastpcba.com\/fr\/general-standard-for-printed-circuit-boards-pcb\/#1_Hazardous_Substance_Control\" >1. Contr\u00f4le des substances dangereuses<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/topfastpcba.com\/fr\/general-standard-for-printed-circuit-boards-pcb\/#2_Cleaner_Production\" >2. Production plus propre<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/topfastpcba.com\/fr\/general-standard-for-printed-circuit-boards-pcb\/#Section_5_Industry-Specific_Standards\" >Section 5 : Normes sp\u00e9cifiques \u00e0 l'industrie<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/topfastpcba.com\/fr\/general-standard-for-printed-circuit-boards-pcb\/#Section_6_Future_Trends_and_Innovations\" >Section 6 : Tendances futures et innovations<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/topfastpcba.com\/fr\/general-standard-for-printed-circuit-boards-pcb\/#Conclusion\" >Conclusion<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Section_1_Design_and_Material_Standards\"><\/span>Section 1 : Normes relatives \u00e0 la conception et aux mat\u00e9riaux<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_IPC-6010_Series_Quality_and_Performance_Specifications\"><\/span>1. <strong>S\u00e9rie IPC-6010 : Sp\u00e9cifications de qualit\u00e9 et de performance<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>IPC-6018A<\/strong>: Sp\u00e9cifie les exigences de performance et de qualification pour les circuits imprim\u00e9s micro-ondes haute fr\u00e9quence, applicables aux syst\u00e8mes de communication et aux radars.<\/li>\n\n\n\n<li><strong>IPC-D-317A<\/strong>: Directives de conception pour les bo\u00eetiers de circuits \u00e0 haute vitesse, couvrant les consid\u00e9rations de conception \u00e9lectrique et m\u00e9canique afin de garantir l'int\u00e9grit\u00e9 du signal.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Material_Standards\"><\/span>2. <strong>Normes relatives aux mat\u00e9riaux<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>IPC-4101<\/strong>: Sp\u00e9cifications pour les substrats rigides de circuits imprim\u00e9s, d\u00e9finissant les param\u00e8tres de performance des stratifi\u00e9s.<\/li>\n\n\n\n<li><strong>IPC-4204<\/strong>: Normes relatives aux mat\u00e9riaux pour circuits imprim\u00e9s flexibles, adapt\u00e9s aux appareils \u00e9lectroniques pliables.<\/li>\n\n\n\n<li><strong>IPC-SM-840<\/strong>: Certification de qualit\u00e9 pour les masques de soudure, garantissant la pr\u00e9cision du soudage et les performances d'isolation.<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Section_2_Process_and_Manufacturing_Standards\"><\/span>Section 2 : Normes de processus et de fabrication<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Soldering_and_Cleaning\"><\/span>1. <strong>Soudure et nettoyage<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>IPC-J-STD-001<\/strong>: Exigences relatives aux processus de soudage, couvrant \u00e0 la fois le soudage manuel et automatis\u00e9.<\/li>\n\n\n\n<li><strong>IPC-A-610<\/strong>Crit\u00e8res d'acceptabilit\u00e9 pour les assemblages \u00e9lectroniques, largement utilis\u00e9s dans le contr\u00f4le qualit\u00e9.<\/li>\n\n\n\n<li><strong>IPC-CH-65-A<\/strong>: Directives de nettoyage, introduction d'agents nettoyants respectueux de l'environnement et m\u00e9thodes de contr\u00f4le des processus.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Stencils_and_Coatings\"><\/span>2. <strong>Pochoirs et rev\u00eatements<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>IPC-7525<\/strong>: Directives pour la conception de pochoirs pour p\u00e2te \u00e0 souder, optimisant la pr\u00e9cision du processus SMT.<\/li>\n\n\n\n<li><strong>IPC-CC-830B<\/strong>: Certification des performances des compos\u00e9s isolants, garantissant la fiabilit\u00e9 de la protection du rev\u00eatement.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Thermal_Management_and_Reliability\"><\/span>3. <strong>Gestion thermique et fiabilit\u00e9<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>IPC-7530<\/strong>: Directives relatives aux profils de temp\u00e9rature pour le soudage par refusion et \u00e0 la vague, afin d'\u00e9viter les dommages thermiques.<\/li>\n\n\n\n<li><strong>IPC-7095<\/strong>: Concevoir et traiter les compl\u00e9ments pour les dispositifs BGA, en relevant les d\u00e9fis li\u00e9s au conditionnement haute densit\u00e9.<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/10\/PCB-General-Standards.jpg\" alt=\"Normes g\u00e9n\u00e9rales relatives aux circuits imprim\u00e9s\" class=\"wp-image-8072\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/10\/PCB-General-Standards.jpg 600w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/10\/PCB-General-Standards-300x201.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/10\/PCB-General-Standards-18x12.jpg 18w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/10\/PCB-General-Standards-150x101.jpg 150w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Section_3_Assembly_and_Inspection_Standards\"><\/span>Section 3 : Normes d'assemblage et d'inspection<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Assembly_Specifications\"><\/span>1. <strong>Sp\u00e9cifications d'assemblage<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>IPC-AJ-820<\/strong>: Manuel sur les techniques d'assemblage et de soudage, couvrant les technologies de montage en surface et \u00e0 trous traversants.<\/li>\n\n\n\n<li><strong>IPC-HDBK-001<\/strong>: Directives pour les op\u00e9rations de soudage, fournissant des conseils pratiques et des solutions aux probl\u00e8mes rencontr\u00e9s.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Inspection_and_Testing\"><\/span>2. <strong>Inspection et essais<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>IPC-TM-650<\/strong>M\u00e9thodes d'essai normalis\u00e9es, y compris la soudabilit\u00e9, la r\u00e9sistance d'isolement, etc.<\/li>\n\n\n\n<li><strong>IPC-9252<\/strong>: Normes d'essais \u00e9lectriques pour les cartes nues et les cartes assembl\u00e9es.<\/li>\n\n\n\n<li><strong>IPC-9201<\/strong>: Test de r\u00e9sistance d'isolement de surface (SIR), \u00e9valuation de la durabilit\u00e9 environnementale.<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Section_4_Environmental_and_Safety_Standards\"><\/span>Section 4 : Normes environnementales et de s\u00e9curit\u00e9<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Hazardous_Substance_Control\"><\/span>1. <strong>Contr\u00f4le des substances dangereuses<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>IPC-1752<\/strong>: Normes de d\u00e9claration des mat\u00e9riaux, conformes aux exigences RoHS et REACH.<\/li>\n\n\n\n<li><strong>J-STD-004\/005<\/strong>: Sp\u00e9cifications pour les flux et p\u00e2tes \u00e0 souder sans halog\u00e8ne, favorisant une fabrication \u00e9cologique.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Cleaner_Production\"><\/span>2. <strong>Production plus propre<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>IPC-1401<\/strong>: Normes de responsabilit\u00e9 sociale dans la cha\u00eene d'approvisionnement, ax\u00e9es sur les aspects environnementaux et \u00e9thiques.<\/li>\n\n\n\n<li><strong>IPC-SC-60A<\/strong>: Manuel de nettoyage au solvant, r\u00e9duisant les \u00e9missions de compos\u00e9s organiques volatils (COV).<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Section_5_Industry-Specific_Standards\"><\/span>Section 5 : Normes sp\u00e9cifiques \u00e0 l'industrie<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Champ d'application<\/th><th>Num\u00e9ro standard<\/th><th>Contenu cl\u00e9<\/th><\/tr><\/thead><tbody><tr><td>\u00c9lectronique automobile<\/td><td>IPC-6012DA<\/td><td>Exigences de performance des circuits imprim\u00e9s \u00e0 haute fiabilit\u00e9<\/td><\/tr><tr><td>A\u00e9rospatiale<\/td><td>IPC-6011DS<\/td><td>Essais de durabilit\u00e9 dans des environnements extr\u00eames<\/td><\/tr><tr><td>Dispositifs m\u00e9dicaux<\/td><td>IEC 60601-1<\/td><td>S\u00e9curit\u00e9 et compatibilit\u00e9 \u00e9lectromagn\u00e9tique (CEM)<\/td><\/tr><tr><td>\u00c9lectronique grand public<\/td><td>IPC-2221B<\/td><td>Sp\u00e9cifications g\u00e9n\u00e9rales de conception et optimisation des co\u00fbts<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/10\/PCB-General-Standards-1.jpg\" alt=\"Normes g\u00e9n\u00e9rales relatives aux circuits imprim\u00e9s\" class=\"wp-image-8074\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/10\/PCB-General-Standards-1.jpg 600w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/10\/PCB-General-Standards-1-300x201.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/10\/PCB-General-Standards-1-18x12.jpg 18w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/10\/PCB-General-Standards-1-150x101.jpg 150w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Section_6_Future_Trends_and_Innovations\"><\/span>Section 6 : Tendances futures et innovations<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Interconnexion haute densit\u00e9 (HDI)<\/strong>: La norme IPC-6016 r\u00e9git les processus li\u00e9s aux circuits imprim\u00e9s HDI.<\/li>\n\n\n\n<li><strong>\u00c9lectronique hybride flexible (FHE)<\/strong>: La norme IPC-J-STD-1776 favorise le d\u00e9veloppement des appareils portables.<\/li>\n\n\n\n<li><strong>Usines intelligentes<\/strong>: IPC-CFX (norme Hermes) permet l'int\u00e9gration de l'IoT dans les lignes de production.<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span>Conclusion<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>Les normes relatives aux circuits imprim\u00e9s constituent la pierre angulaire de l'industrie de la fabrication \u00e9lectronique, couvrant l'ensemble du cycle de vie, depuis <strong>S\u00e9lection des mat\u00e9riaux<\/strong> to <strong>Produits finis<\/strong>En adh\u00e9rant \u00e0 des normes faisant autorit\u00e9 telles que IPC, IEC et JEDEC, les entreprises peuvent am\u00e9liorer la coh\u00e9rence, la fiabilit\u00e9 et la comp\u00e9titivit\u00e9 commerciale de leurs produits. \u00c0 mesure que la technologie \u00e9volue, les normes de nouvelle g\u00e9n\u00e9ration continueront \u00e0 faire progresser les circuits imprim\u00e9s vers <strong>Fr\u00e9quences plus \u00e9lev\u00e9es<\/strong>, <strong>Miniaturisation<\/strong>et <strong>Fabrication \u00e9cologique<\/strong>.<\/p>","protected":false},"excerpt":{"rendered":"<p>Le syst\u00e8me standard universel pour les cartes de circuits imprim\u00e9s (PCB) englobe les sp\u00e9cifications de conception (par exemple, IPC-6010), les normes relatives aux mat\u00e9riaux (par exemple, IPC-4101), les processus de soudage (par exemple, J-STD-001), les m\u00e9thodes d'inspection (par exemple, IPC-TM-650) et les exigences environnementales (par exemple, IPC-1752). Garantir la fiabilit\u00e9 et la conformit\u00e9 des PCB dans des conditions de haute densit\u00e9, haute fr\u00e9quence et d'environnement difficile.<\/p>","protected":false},"author":2,"featured_media":8075,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[154],"class_list":["post-8071","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry","tag-pcb-general-standards"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.6 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>General Standard for Printed Circuit Boards (PCB) - Topfastpcba<\/title>\n<meta name=\"description\" content=\"General Standards for Printed Circuit Boards (PCBs) Covering key standards such as IPC, IEC, and JEDEC, these encompass design, materials, soldering, inspection, and environmental requirements to enhance PCB reliability, compliance, and performance.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/topfastpcba.com\/fr\/general-standard-for-printed-circuit-boards-pcb\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"General Standard for Printed Circuit Boards (PCB) - 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