{"id":6766,"date":"2025-06-04T17:42:28","date_gmt":"2025-06-04T09:42:28","guid":{"rendered":"https:\/\/topfastpcba.com\/?p=6766"},"modified":"2025-06-04T17:42:33","modified_gmt":"2025-06-04T09:42:33","slug":"pcb-common-terminology","status":"publish","type":"post","link":"https:\/\/topfastpcba.com\/fr\/pcb-common-terminology\/","title":{"rendered":"Terminologie courante des PCB"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_75 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table des mati\u00e8res<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-common-terminology\/#Detailed_Explanation_of_Common_PCB_Terminology\" >Explication d\u00e9taill\u00e9e de la terminologie courante des PCB<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-common-terminology\/#1_Basic_PCB_Structure_Terms\" >1. Termes de base de la structure du circuit imprim\u00e9<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-common-terminology\/#2_PCB_Design_and_Verification_Terms\" >2.Termes relatifs \u00e0 la conception et \u00e0 la v\u00e9rification des circuits imprim\u00e9s<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-common-terminology\/#3_PCB_Hole-Related_Terms\" >3.Termes relatifs aux trous de PCB<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-common-terminology\/#4_PCB_Manufacturing_Process_Terms\" >4.Termes du processus de fabrication des PCB<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-common-terminology\/#5_Special_PCB_Structures_and_Materials\" >5.Structures et mat\u00e9riaux sp\u00e9ciaux pour circuits imprim\u00e9s<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-common-terminology\/#6_PCB_Assembly_and_Testing_Terms\" >6.Termes relatifs \u00e0 l'assemblage et aux essais des circuits imprim\u00e9s<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-common-terminology\/#7_Advanced_PCB_Design_Concepts\" >7.Concepts avanc\u00e9s de conception de circuits imprim\u00e9s<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Detailed_Explanation_of_Common_PCB_Terminology\"><\/span>Explication d\u00e9taill\u00e9e de la terminologie courante des PCB<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Basic_PCB_Structure_Terms\"><\/span>1. Termes de base de la structure du circuit imprim\u00e9<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Anneau annulaire<\/strong> d\u00e9signe l'anneau de cuivre entourant un trou de passage plaqu\u00e9 (PTH) sur un circuit imprim\u00e9. Cette structure est essentielle pour le montage des composants et la transmission des signaux, et sa largeur affecte directement la fiabilit\u00e9 des connexions et la capacit\u00e9 de transport du courant. Les concepteurs doivent veiller \u00e0 ce que la largeur de l'anneau annulaire soit suffisante pour \u00e9viter les d\u00e9faillances de connexion dues \u00e0 un mauvais alignement du per\u00e7age.<\/p>\n\n\n\n<p><strong>Pad<\/strong> est une zone m\u00e9tallique expos\u00e9e sur la surface du circuit imprim\u00e9, utilis\u00e9e pour souder des composants.En fonction du type de composant, les pastilles peuvent \u00eatre class\u00e9es comme des pastilles \u00e0 trous traversants ou des pastilles \u00e0 montage en surface.La conception des pastilles doit tenir compte de facteurs tels que la taille des composants, le processus de soudure et les exigences en mati\u00e8re de courant.<\/p>\n\n\n\n<p><strong>Avion<\/strong> d\u00e9signe de grandes surfaces de cuivre sur un circuit imprim\u00e9, g\u00e9n\u00e9ralement utilis\u00e9es pour la distribution de l'alimentation ou de la masse. Contrairement aux traces de signaux, les plans sont d\u00e9finis par des limites plut\u00f4t que par des chemins, ce qui offre une imp\u00e9dance plus faible et une meilleure dissipation de la chaleur. L'utilisation correcte des plans peut am\u00e9liorer de mani\u00e8re significative la compatibilit\u00e9 \u00e9lectromagn\u00e9tique (CEM) d'un circuit imprim\u00e9.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_PCB_Design_and_Verification_Terms\"><\/span>2. <a href=\"https:\/\/topfastpcba.com\/fr\/pcb-design-and-manufacturing\/\">Conception de circuits imprim\u00e9s<\/a> et les conditions de v\u00e9rification<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>DRC (Design Rule Check)<\/strong> est une fonction de v\u00e9rification automatis\u00e9e dans les logiciels de conception de circuits imprim\u00e9s qui garantit la conformit\u00e9 avec les exigences de fabrication. Elle d\u00e9tecte les probl\u00e8mes courants tels qu'un espacement insuffisant entre les traces, des trous sous-dimensionn\u00e9s ou des anneaux inad\u00e9quats, garantissant ainsi la fabricabilit\u00e9.<\/p>\n\n\n\n<p><strong>Fichiers Gerber<\/strong> sont le format de fichier standard pour la fabrication des circuits imprim\u00e9s, contenant des donn\u00e9es graphiques pour chaque couche. Les fichiers Gerber modernes utilisent g\u00e9n\u00e9ralement le format RS-274X, qui int\u00e8gre des tables d'ouverture et des attributs de couche. La g\u00e9n\u00e9ration de fichiers Gerber pr\u00e9cis est cruciale pour passer de la conception \u00e0 la production.<\/p>\n\n\n\n<p><strong>Fichiers ODB<\/strong> sont un format de donn\u00e9es de fabrication alternatif qui utilise une structure de base de donn\u00e9es au lieu de fichiers s\u00e9par\u00e9s, fournissant une repr\u00e9sentation plus compl\u00e8te de l'intention de la conception. Par rapport \u00e0 Gerber, ODB++ inclut des informations suppl\u00e9mentaires telles que les listes de r\u00e9seaux et les sp\u00e9cifications des mat\u00e9riaux, ce qui r\u00e9duit les erreurs de communication.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_PCB_Hole-Related_Terms\"><\/span>3.Termes relatifs aux trous de PCB<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Trou de passage plaqu\u00e9 (PTH)<\/strong> is a hole drilled through the entire PCB and plated with conductive metal, used for interlayer connections or mounting through-hole components. PTH reliability depends on plating quality and thickness, typically requiring an average copper thickness of at least 20\u03bcm.<\/p>\n\n\n\n<p><strong>Via<\/strong> est un trou plaqu\u00e9 sp\u00e9cifiquement pour les connexions inter-couches, class\u00e9es en trois cat\u00e9gories principales :<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Par le biais de<\/strong>: Traverse toutes les couches, simple \u00e0 fabriquer mais occupe plus d'espace.<\/li>\n\n\n\n<li><strong>Via aveugle<\/strong>Connecte une couche externe \u00e0 une couche interne, augmentant ainsi la densit\u00e9 de routage.<\/li>\n\n\n\n<li><strong>Enterr\u00e9 Via<\/strong>Ne relie que les couches internes, ce qui permet de conserver l'espace de surface.<\/li>\n<\/ul>\n\n\n\n<p><strong>Microvia<\/strong> is a small via (typically less than 150\u03bcm in diameter) created using laser drilling, widely used in HDI (High-Density Interconnect) boards. Microvias enable higher connection density, supporting modern high-pin-count components.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_PCB_Manufacturing_Process_Terms\"><\/span>4. <a href=\"https:\/\/topfastpcba.com\/fr\/pcb-manufacturing-proofing-process\/\">Processus de fabrication des PCB<\/a> Conditions<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Masque de soudure<\/strong> est un rev\u00eatement protecteur appliqu\u00e9 \u00e0 la surface du circuit imprim\u00e9, g\u00e9n\u00e9ralement de couleur verte (bien que le rouge, le bleu, le noir et d'autres couleurs soient \u00e9galement utilis\u00e9s). Elle emp\u00eache les courts-circuits et l'oxydation, les ouvertures exposant les plages pour la soudure. La pr\u00e9cision de l'alignement a une incidence directe sur la qualit\u00e9 de la soudure.<\/p>\n\n\n\n<p><strong>P\u00e2te \u00e0 braser<\/strong> est un m\u00e9lange de poudre de soudure et de flux utilis\u00e9 dans l'assemblage par montage en surface. Il est d\u00e9pos\u00e9 avec pr\u00e9cision sur les plaquettes \u00e0 l'aide d'un pochoir et fond pendant le soudage par refusion pour former des connexions \u00e9lectriques. La composition m\u00e9tallique, la taille des particules et le niveau d'activit\u00e9 doivent \u00eatre s\u00e9lectionn\u00e9s en fonction des exigences de l'application.<\/p>\n\n\n\n<p><strong>Soudure par refusion<\/strong> est une \u00e9tape critique de l'assemblage SMT, o\u00f9 un chauffage contr\u00f4l\u00e9 fait fondre la p\u00e2te \u00e0 braser pour former des joints fiables.Un profil de refusion typique comprend des \u00e9tapes de pr\u00e9chauffage, de trempage, de refusion et de refroidissement, chacune n\u00e9cessitant un contr\u00f4le pr\u00e9cis de la temp\u00e9rature.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_Special_PCB_Structures_and_Materials\"><\/span>5.Structures et mat\u00e9riaux sp\u00e9ciaux pour circuits imprim\u00e9s<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Doigt d'or<\/strong> d\u00e9signe les languettes de contact plaqu\u00e9es or sur le bord d'un circuit imprim\u00e9, utilisant g\u00e9n\u00e9ralement un placage en or dur (avec une sous-couche de nickel) pour la r\u00e9sistance \u00e0 l'usure. Les consid\u00e9rations de conception comprennent la force d'insertion, la r\u00e9sistance de contact et les cycles d'accouplement. On les trouve couramment dans les modules de m\u00e9moire et les cartes d'extension.<\/p>\n\n\n\n<p><strong>Carte de circuit imprim\u00e9 rigide-flexible<\/strong> combine les avantages des circuits rigides et flexibles, avec des sections \u00e0 la fois rigides et flexibles.Cette conception r\u00e9duit les besoins en connecteurs et am\u00e9liore la fiabilit\u00e9, mais elle est plus co\u00fbteuse et plus complexe \u00e0 concevoir.Elle est souvent utilis\u00e9e dans l'a\u00e9rospatiale et les appareils m\u00e9dicaux.<\/p>\n\n\n\n<p><strong>Prepreg (mat\u00e9riau pr\u00e9-impr\u00e9gn\u00e9)<\/strong> est un mat\u00e9riau de liaison dans les circuits imprim\u00e9s multicouches, constitu\u00e9 de fibres de verre enduites de r\u00e9sine. Lors de la stratification, la r\u00e9sine s'\u00e9coule et durcit, liant les couches centrales entre elles. Les diff\u00e9rents types de pr\u00e9-impr\u00e9gn\u00e9s varient en termes de teneur en r\u00e9sine et de caract\u00e9ristiques d'\u00e9coulement.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"885\" height=\"596\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/aqua-pcb1\u200b.jpg\" alt=\"Terminologie courante des PCB\" class=\"wp-image-6571\" style=\"width:600px\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/aqua-pcb1\u200b.jpg 885w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/aqua-pcb1\u200b-300x202.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/aqua-pcb1\u200b-768x517.jpg 768w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/aqua-pcb1\u200b-150x101.jpg 150w\" sizes=\"auto, (max-width: 885px) 100vw, 885px\" \/><\/figure>\n<\/div>\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"6_PCB_Assembly_and_Testing_Terms\"><\/span>6.Termes relatifs \u00e0 l'assemblage et aux essais des circuits imprim\u00e9s<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Choisir et placer<\/strong> is an automated component placement process in SMT assembly lines. Modern machines achieve placement speeds of tens of thousands of components per hour with \u00b125\u03bcm accuracy. Programming considerations include component recognition, feeder arrangement, and placement sequence.<\/p>\n\n\n\n<p><strong>Soudure \u00e0 la vague<\/strong> est utilis\u00e9 pour les composants \u00e0 trous traversants, o\u00f9 le circuit imprim\u00e9 passe sur une vague de soudure en fusion, formant des joints par action capillaire. Les contr\u00f4les cl\u00e9s du processus comprennent l'application du flux, la temp\u00e9rature de pr\u00e9chauffage et le temps de contact avec la vague.<\/p>\n\n\n\n<p><strong>Test de la sonde volante<\/strong> est une m\u00e9thode de test \u00e9lectrique sans fixation, dans laquelle des sondes programmables entrent en contact avec des points de test pour v\u00e9rifier la continuit\u00e9 et l'isolation.Compar\u00e9s aux tests sur lit de clous, les tests \u00e0 sondes volantes n\u00e9cessitent moins de temps d'installation et sont id\u00e9aux pour la production de faibles volumes.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"7_Advanced_PCB_Design_Concepts\"><\/span>7.Concepts avanc\u00e9s de conception de circuits imprim\u00e9s<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Gravure sur cuivre<\/strong> removes excess copper to form circuit patterns. To reduce etching time and chemical consumption, unused copper areas are often designed as grids or hatched patterns\u2014a technique known as copper thieving or balancing.<\/p>\n\n\n\n<p><strong>Soulagement thermique<\/strong> est une conception sp\u00e9ciale du trac\u00e9 reliant les pads aux plans, utilisant des rayons fins au lieu de connexions solides pour contr\u00f4ler la dissipation de la chaleur pendant la soudure. Un relief thermique ad\u00e9quat garantit les performances \u00e9lectriques tout en facilitant la soudure.<\/p>\n\n\n\n<p><strong>Int\u00e9grit\u00e9 du signal (SI)<\/strong> \u00e9tudie la qualit\u00e9 de la transmission des signaux sur les circuits imprim\u00e9s, en couvrant le contr\u00f4le de l'imp\u00e9dance, la suppression de la diaphonie et l'analyse de la synchronisation. Les conceptions \u00e0 grande vitesse doivent tenir compte de l'effet de peau, de la perte di\u00e9lectrique et des discontinuit\u00e9s d'imp\u00e9dance de l'interface.<\/p>\n\n\n\n<p>En ma\u00eetrisant ces termes relatifs aux circuits imprim\u00e9s, les ing\u00e9nieurs peuvent communiquer plus pr\u00e9cis\u00e9ment les intentions de conception, r\u00e9soudre plus efficacement les probl\u00e8mes de fabrication et mieux collaborer tout au long de la cha\u00eene d'approvisionnement.\u00c0 mesure que la technologie \u00e9lectronique \u00e9volue, la terminologie des circuits imprim\u00e9s continue de s'\u00e9tendre, ce qui rend la formation continue essentielle au maintien de l'expertise professionnelle.<\/p>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Terminologie de l'industrie des circuits imprim\u00e9s couvrant des concepts cl\u00e9s tels que la structure des cartes, les sp\u00e9cifications de conception, les processus de fabrication et les propri\u00e9t\u00e9s des mat\u00e9riaux. Des alignements et pastilles de base aux technologies HDI complexes, et des composants traditionnels \u00e0 trous traversants aux processus modernes de montage en surface, les articles fournissent des explications compl\u00e8tes et approfondies pour aider les lecteurs \u00e0 ma\u00eetriser le langage sp\u00e9cialis\u00e9 et les points techniques du domaine des PCB.<\/p>","protected":false},"author":2,"featured_media":6767,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[],"class_list":["post-6766","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.6 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB Common Terminology - Topfastpcba<\/title>\n<meta name=\"description\" content=\"Common terminology used in PCB design and manufacturing, including specialized content on structural components, design elements, manufacturing processes, and material properties, is a must for electronics engineers and beginners in PCB design.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-common-terminology\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"PCB Common Terminology - 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