{"id":6758,"date":"2025-06-02T20:33:19","date_gmt":"2025-06-02T12:33:19","guid":{"rendered":"https:\/\/topfastpcba.com\/?p=6758"},"modified":"2025-10-22T17:06:32","modified_gmt":"2025-10-22T09:06:32","slug":"smt-placement-technology","status":"publish","type":"post","link":"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/","title":{"rendered":"Technologie de placement SMT"},"content":{"rendered":"<p>Dans la fabrication \u00e9lectronique moderne, la technologie SMT (Surface Mount Technology) est devenue le processus de base pour l'assemblage des circuits imprim\u00e9s. Cet article aborde tous les aspects de la technologie SMT, y compris ses principes de fonctionnement, le flux de travail complet, les probl\u00e8mes courants et leurs solutions, ainsi que des conseils pratiques. Que vous soyez novice en mati\u00e8re de fabrication \u00e9lectronique ou un professionnel cherchant \u00e0 optimiser ses lignes de production, vous trouverez ici des informations pr\u00e9cieuses.<\/p>\n\n\n\n<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_75 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table des mati\u00e8res<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#What_is_SMT_Technology\" >Qu'est-ce que la technologie SMT ?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Step-by-Step_Breakdown_of_the_SMT_Process\" >D\u00e9composition \u00e9tape par \u00e9tape du processus SMT<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Pre-Production_The_Foundation_of_Success\" >La pr\u00e9production : La base du succ\u00e8s<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Solder_Paste_Printing_The_Art_of_Precision\" >Impression de p\u00e2te \u00e0 braser :L'art de la pr\u00e9cision<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Component_Placement_Balancing_Speed_and_Accuracy\" >Placement des composants :\u00c9quilibrer la vitesse et la pr\u00e9cision<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Reflow_Soldering_The_Dance_of_Heat\" >Le brasage par refusion :La danse de la chaleur<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Inspection_Testing_Guardians_of_Quality\" >Inspection et essais :Les gardiens de la qualit\u00e9<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#SMT_vs_SMD_Key_Differences_Explained\" >SMT vs. SMD : les principales diff\u00e9rences expliqu\u00e9es<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Top_5_Common_SMT_Issues_Solutions\" >Les 5 probl\u00e8mes SMT les plus courants et leurs solutions<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Issue_1_Why_is_the_solder_paste_print_irregular\" >Question 1 : Pourquoi l'impression de la p\u00e2te \u00e0 braser est-elle irr\u00e9guli\u00e8re ?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Issue_2_Components_shift_after_placement%E2%80%94what_to_do\" >Issue 2: Components shift after placement\u2014what to do?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Issue_3_Solder_balls_after_reflow%E2%80%94why\" >Issue 3: Solder balls after reflow\u2014why?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Issue_4_How_to_troubleshoot_BGA_voiding\" >Question 4 : Comment r\u00e9soudre les probl\u00e8mes de vide dans les BGA ?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Issue_5_How_to_reduce_QFN_soldering_defects\" >Question 5 : Comment r\u00e9duire les d\u00e9fauts de soudure des QFN ?<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Advanced_Tips_Industry_Trends\" >Conseils avanc\u00e9s et tendances de l'industrie<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Handling_Special_Components\" >Manipulation de composants sp\u00e9ciaux<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Lead-Free_Process_Considerations\" >Consid\u00e9rations sur les proc\u00e9d\u00e9s sans plomb<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Smart_Manufacturing_in_SMT\" >Fabrication intelligente en SMT<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Practical_Advice_Recommended_Resources\" >Conseils pratiques et ressources recommand\u00e9es<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Final_Thoughts\" >R\u00e9flexions finales<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/#Related_Articles\" >Articles connexes<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_is_SMT_Technology\"><\/span>Qu'est-ce que la technologie SMT ? <span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>SMT (Surface Mount Technology) is an advanced process that directly mounts electronic components onto the surface of a PCB (Printed Circuit Board), achieving reliable electrical connections through reflow soldering. Compared to traditional through-hole technology (DIP), SMT eliminates the need for drilling numerous holes in the PCB\u2014components simply &#8220;sit&#8221; on the pads, greatly simplifying the manufacturing process.<\/p>\n\n\n\n<p><strong>Pourquoi cette technologie est-elle si importante ?<\/strong> Il y a trois raisons principales \u00e0 cela :<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Rapport co\u00fbt-efficacit\u00e9<\/strong>: Le nombre r\u00e9duit de trous perc\u00e9s se traduit par des co\u00fbts de traitement nettement inf\u00e9rieurs, ce qui en fait un produit id\u00e9al pour la production de masse.<\/li>\n\n\n\n<li><strong>\u00c9conomie d'espace<\/strong>: Les composants SMT sont beaucoup plus petits que les composants traditionnels, ce qui permet d'obtenir des appareils \u00e9lectroniques plus fins et plus l\u00e9gers.<\/li>\n\n\n\n<li><strong>Am\u00e9lioration des performances<\/strong>: Des fils plus courts r\u00e9duisent l'inductance et la capacit\u00e9 parasites, ce qui am\u00e9liore les performances du circuit.<\/li>\n<\/ol>\n\n\n\n<p>Imagine modern smartphones packed with components\u2014without SMT, they might still be as bulky as the &#8220;brick phones&#8221; of the past. That\u2019s the transformative power of SMT in the electronics industry.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt-1.jpg\" alt=\"Technologie de placement SMT\" class=\"wp-image-6759\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt-1.jpg 600w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt-1-300x201.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt-1-150x101.jpg 150w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Step-by-Step_Breakdown_of_the_SMT_Process\"><\/span>D\u00e9composition \u00e9tape par \u00e9tape du processus SMT<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Pre-Production_The_Foundation_of_Success\"><\/span>La pr\u00e9production : La base du succ\u00e8s<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Conception de circuits<\/strong> est le point de d\u00e9part du SMT. Une conception bien pens\u00e9e doit prendre en compte<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Placement optimal des composants (\u00e9loigner les composants \u00e0 haute fr\u00e9quence des sources d'interf\u00e9rence)<\/li>\n\n\n\n<li>Optimisation du trac\u00e9 (\u00e9viter les angles aigus, tenir compte de la capacit\u00e9 de transport de courant)<\/li>\n\n\n\n<li>Conception du tampon (taille et forme adapt\u00e9es aux composants)<\/li>\n<\/ul>\n\n\n\n<p><strong>Pr\u00e9paration des composants et de l'\u00e9quipement<\/strong> est tout aussi crucial :<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>V\u00e9rifier les sp\u00e9cifications des composants par rapport \u00e0 la nomenclature (BOM)<\/li>\n\n\n\n<li>Calibrate the placement machine accuracy (typically within \u00b10.05mm)<\/li>\n\n\n\n<li>V\u00e9rifier l'uniformit\u00e9 de la temp\u00e9rature du four de refusion<\/li>\n<\/ul>\n\n\n\n<p>J'ai vu une fois une usine sauter l'\u00e9tape de d\u00e9cong\u00e9lation de la p\u00e2te \u00e0 souder et l'utiliser directement \u00e0 partir de la r\u00e9frig\u00e9ration, ce qui a entra\u00een\u00e9 des co\u00fbts \u00e9lev\u00e9s pour tout un lot de produits dont les joints de soudure \u00e9taient froids. La pr\u00e9paration de la pr\u00e9production n'est pas un endroit o\u00f9 l'on peut prendre des raccourcis !<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Solder_Paste_Printing_The_Art_of_Precision\"><\/span>Impression de p\u00e2te \u00e0 braser :L'art de la pr\u00e9cision<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Fabrication de pochoirs<\/strong> vient en premier :<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>T\u00f4les d'acier inoxydable d\u00e9coup\u00e9es au laser avec des ouvertures correspondant aux pads du circuit imprim\u00e9 1:1<\/li>\n\n\n\n<li>Choose thickness (typically 0.1\u20130.15mm, adjusted based on component size)<\/li>\n<\/ul>\n\n\n\n<p><strong>Manipulation de la p\u00e2te \u00e0 braser<\/strong> Conseils :<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>D\u00e9congeler pendant au moins 4 heures (si r\u00e9frig\u00e9r\u00e9)<\/li>\n\n\n\n<li>Remuer jusqu'\u00e0 obtenir une consistance lisse de beurre de cacahu\u00e8te.<\/li>\n\n\n\n<li>Control the printing environment (23\u00b13\u00b0C, humidity &lt;60%)<\/li>\n<\/ul>\n\n\n\n<p><strong>Contr\u00f4les de la qualit\u00e9 d'impression<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Examiner la forme de la p\u00e2te \u00e0 la loupe pour s'assurer qu'elle est compl\u00e8te.<\/li>\n\n\n\n<li>Measure thickness (usually 80\u201390% of stencil thickness)<\/li>\n\n\n\n<li>Recherchez des probl\u00e8mes tels que des retomb\u00e9es, des lacunes ou des ponts.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Component_Placement_Balancing_Speed_and_Accuracy\"><\/span>Placement des composants :\u00c9quilibrer la vitesse et la pr\u00e9cision<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Les machines modernes de pr\u00e9l\u00e8vement et de placement sont \u00e9tonnantes :<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Les machines \u00e0 grande vitesse peuvent placer plus de 150 000 composants par heure.<\/li>\n\n\n\n<li>Plusieurs buses fonctionnant simultan\u00e9ment augmentent l'efficacit\u00e9<\/li>\n\n\n\n<li>Vision systems ensure precise alignment (\u00b10.025mm)<\/li>\n<\/ul>\n\n\n\n<p><strong>Conseils de programmation<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Optimiser la s\u00e9quence de placement pour minimiser la distance de d\u00e9placement<\/li>\n\n\n\n<li>Placez les composants les plus volumineux en dernier pour \u00e9viter les interf\u00e9rences<\/li>\n\n\n\n<li>D\u00e9finir des param\u00e8tres sp\u00e9ciaux pour des composants uniques (par exemple, QFN)<\/li>\n<\/ul>\n\n\n\n<p>Pro tip: Clean nozzles regularly\u2014I\u2019ve seen a tiny 0.1mm solder paste residue cause an entire batch of misaligned components.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Reflow_Soldering_The_Dance_of_Heat\"><\/span>Le brasage par refusion :La danse de la chaleur<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Configuration du profil de temp\u00e9rature<\/strong> est essentiel :<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Preheat zone (1\u20133\u00b0C\/sec, up to 150\u2013180\u00b0C)<\/li>\n\n\n\n<li>Soak zone (60\u2013120 sec for even board heating)<\/li>\n\n\n\n<li>Reflow zone (peak temperature 20\u201330\u00b0C above solder melting point)<\/li>\n\n\n\n<li>Cooling zone (controlled at \u22644\u00b0C\/sec)<\/li>\n<\/ul>\n\n\n\n<p><strong>Les pi\u00e8ges les plus fr\u00e9quents<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Un chauffage trop rapide peut provoquer des dommages dus \u00e0 la contrainte thermique<\/li>\n\n\n\n<li>Une temp\u00e9rature de pointe insuffisante entra\u00eene des joints de soudure froids<\/li>\n\n\n\n<li>Une chaleur excessive peut endommager les composants ou la carte de circuit imprim\u00e9.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Inspection_Testing_Guardians_of_Quality\"><\/span>Inspection et essais :Les gardiens de la qualit\u00e9<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>L'essentiel de l'AOI (Inspection optique automatis\u00e9e)<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>D\u00e9finir les param\u00e8tres de d\u00e9tection appropri\u00e9s (par exemple, les seuils de luminosit\u00e9 des joints de soudure).<\/li>\n\n\n\n<li>\u00c9talonner r\u00e9guli\u00e8rement le syst\u00e8me de cam\u00e9ra<\/li>\n\n\n\n<li>Constituer une biblioth\u00e8que d'\u00e9chantillons de d\u00e9fauts typiques<\/li>\n<\/ul>\n\n\n\n<p><strong>Strat\u00e9gies de tests fonctionnels<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>V\u00e9rifier les modules \u00e9tape par \u00e9tape<\/li>\n\n\n\n<li>Essai dans des conditions limites (par exemple, fluctuations de tension)<\/li>\n\n\n\n<li>Utiliser l'Environmental Stress Screening (ESS) pour am\u00e9liorer la fiabilit\u00e9<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt-3.jpg\" alt=\"Technologie de placement SMT\" class=\"wp-image-6760\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt-3.jpg 600w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt-3-300x201.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt-3-150x101.jpg 150w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"SMT_vs_SMD_Key_Differences_Explained\"><\/span>SMT vs. SMD : les principales diff\u00e9rences expliqu\u00e9es<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>De nombreux d\u00e9butants confondent ces deux termes :<\/p>\n\n\n\n<p><strong>SMD (Surface Mount Device)<\/strong> d\u00e9signe les composants \u00e9lectroniques con\u00e7us sp\u00e9cifiquement pour \u00eatre mont\u00e9s en surface. Ils pr\u00e9sentent les caract\u00e9ristiques suivantes<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Pas de longs fils, uniquement des surfaces de contact plates<\/li>\n\n\n\n<li>Exemples : r\u00e9sistances, condensateurs (bo\u00eetiers 0805, 0603), circuits int\u00e9gr\u00e9s QFP\/BGA, petites inductances, diodes.<\/li>\n<\/ul>\n\n\n\n<p><strong>SMT (technologie de montage en surface)<\/strong> est l'ensemble du processus de montage des composants CMS sur les circuits imprim\u00e9s, y compris :<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Mat\u00e9riel d'impression, de placement et de soudure<\/li>\n\n\n\n<li>Contr\u00f4le des flux de processus<\/li>\n\n\n\n<li>Normes d'inspection de la qualit\u00e9<\/li>\n<\/ul>\n\n\n\n<p>En bref, le SMD est le \"quoi\" et le SMT le \"comment\". Pensez aux briques (SMD) et aux techniques de ma\u00e7onnerie (SMT).<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Top_5_Common_SMT_Issues_Solutions\"><\/span>Les 5 probl\u00e8mes SMT les plus courants et leurs solutions<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Issue_1_Why_is_the_solder_paste_print_irregular\"><\/span>Question 1 : Pourquoi l'impression de la p\u00e2te \u00e0 braser est-elle irr\u00e9guli\u00e8re ?<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Causes possibles<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>P\u00e2te r\u00e9siduelle sous le pochoir<\/li>\n\n\n\n<li>Pression de la raclette in\u00e9gale ou us\u00e9e<\/li>\n\n\n\n<li>Support in\u00e9gal de la carte de circuit imprim\u00e9<\/li>\n\n\n\n<li>Viscosit\u00e9 de la p\u00e2te \u00e0 braser incorrecte<\/li>\n<\/ul>\n\n\n\n<p><strong>Solutions<\/strong>:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Clean the stencil bottom every 5\u201310 prints<\/li>\n\n\n\n<li>Check the squeegee for damage; set pressure to 5\u20138 kg\/cm\u00b2<\/li>\n\n\n\n<li>Ajuster les broches de support pour assurer la plan\u00e9it\u00e9 du circuit imprim\u00e9<\/li>\n\n\n\n<li>Test paste viscosity (target: 800\u20131200 kcps)<\/li>\n<\/ol>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Issue_2_Components_shift_after_placement%E2%80%94what_to_do\"><\/span>Issue 2: Components shift after placement\u2014what to do?<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Causes possibles<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Faible vide de la buse<\/li>\n\n\n\n<li>R\u00e9glage incorrect de l'\u00e9paisseur du composant<\/li>\n\n\n\n<li>D\u00e9salignement du circuit imprim\u00e9<\/li>\n\n\n\n<li>Hauteur de placement incorrecte<\/li>\n<\/ul>\n\n\n\n<p><strong>Solutions<\/strong>:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>V\u00e9rifier l'absence de fuites au niveau du vide ; nettoyer ou remplacer les buses.<\/li>\n\n\n\n<li>Remesurer l'\u00e9paisseur des composants et mettre \u00e0 jour la base de donn\u00e9es<\/li>\n\n\n\n<li>R\u00e9\u00e9talonnage des rep\u00e8res de la carte de circuit imprim\u00e9<\/li>\n\n\n\n<li>Ajuster la hauteur de placement (g\u00e9n\u00e9ralement 0,1 mm en dessous de la hauteur du composant)<\/li>\n<\/ol>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Issue_3_Solder_balls_after_reflow%E2%80%94why\"><\/span>Issue 3: Solder balls after reflow\u2014why?<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Causes possibles<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Exc\u00e8s de p\u00e2te \u00e0 braser<\/li>\n\n\n\n<li>Mont\u00e9e en temp\u00e9rature trop rapide<\/li>\n\n\n\n<li>Mauvaise conception de l'ouverture du pochoir<\/li>\n\n\n\n<li>Humidit\u00e9 \u00e9lev\u00e9e<\/li>\n<\/ul>\n\n\n\n<p><strong>Solutions<\/strong>:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>R\u00e9duire la taille de l'ouverture du pochoir (par exemple, pas de 10 % vers l'int\u00e9rieur)<\/li>\n\n\n\n<li>Adjust preheat ramp rate to 1\u20133\u00b0C\/sec<\/li>\n\n\n\n<li>Utiliser des ouvertures trap\u00e9zo\u00efdales ou en forme de maison<\/li>\n\n\n\n<li>Maintain workshop humidity at 40\u201360% RH<\/li>\n<\/ol>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Issue_4_How_to_troubleshoot_BGA_voiding\"><\/span>Question 4 : Comment r\u00e9soudre les probl\u00e8mes de vide dans les BGA ?<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Causes possibles<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Mauvaise coplanarit\u00e9 des billes de soudure<\/li>\n\n\n\n<li>Humidit\u00e9 dans les PCB\/BGA<\/li>\n\n\n\n<li>Profil de temp\u00e9rature inadapt\u00e9<\/li>\n\n\n\n<li>D\u00e9formation du circuit imprim\u00e9<\/li>\n<\/ul>\n\n\n\n<p><strong>Solutions<\/strong>:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>V\u00e9rifier la fusion du joint de soudure \u00e0 l'aide d'un appareil \u00e0 rayons X<\/li>\n\n\n\n<li>Bake moisture-sensitive components (125\u00b0C, 12\u201324 hrs)<\/li>\n\n\n\n<li>Prolonger le temps au-dessus du liquidus dans le profil de refusion<\/li>\n\n\n\n<li>Ajouter des points d'appui pour minimiser le gauchissement des circuits imprim\u00e9s<\/li>\n<\/ol>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Issue_5_How_to_reduce_QFN_soldering_defects\"><\/span>Question 5 : Comment r\u00e9duire les d\u00e9fauts de soudure des QFN ?<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Causes possibles<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Insuffisance de soudure sur la semelle thermique<\/li>\n\n\n\n<li>Ponts sur les tampons p\u00e9rim\u00e9triques<\/li>\n\n\n\n<li>D\u00e9salignement<\/li>\n<\/ul>\n\n\n\n<p><strong>Solutions<\/strong>:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Set stencil aperture ratio at 60\u201370% for the center pad<\/li>\n\n\n\n<li>Utilisez le motif en croix pour les tampons p\u00e9rim\u00e9triques.<\/li>\n\n\n\n<li>Ajouter des contr\u00f4les d'alignement optique<\/li>\n\n\n\n<li>Augmenter l\u00e9g\u00e8rement l'\u00e9paisseur du pochoir (par exemple, 0,15 mm)<\/li>\n<\/ol>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Advanced_Tips_Industry_Trends\"><\/span>Conseils avanc\u00e9s et tendances de l'industrie<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Handling_Special_Components\"><\/span>Manipulation de composants sp\u00e9ciaux<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p><strong>Composants ultra-petits (01005 ou moins)<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Utiliser des pochoirs \u00e9lectroform\u00e9s de haute pr\u00e9cision<\/li>\n\n\n\n<li>Reduce squeegee angle (45\u201355\u00b0)<\/li>\n\n\n\n<li>Augmenter la fr\u00e9quence des inspections apr\u00e8s le placement<\/li>\n<\/ul>\n\n\n\n<p><strong>Composants de forme irr\u00e9guli\u00e8re<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Buses sur mesure<\/li>\n\n\n\n<li>Param\u00e8tres de vision d\u00e9di\u00e9s<\/li>\n\n\n\n<li>Processus de refusion secondaire possible<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Lead-Free_Process_Considerations\"><\/span>Consid\u00e9rations sur les proc\u00e9d\u00e9s sans plomb<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Avec la mont\u00e9e en puissance des r\u00e9glementations environnementales, le brasage sans plomb devient la norme :<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Higher melting point (217\u00b0C vs. 183\u00b0C for leaded)<\/li>\n\n\n\n<li>Poorer wetting\u2014optimize stencil design<\/li>\n\n\n\n<li>Narrower process window\u2014tighter temperature control<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Smart_Manufacturing_in_SMT\"><\/span>Fabrication intelligente en SMT<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Les tendances les plus r\u00e9centes sont les suivantes<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Retour d'information 3D SPI (Inspection de la p\u00e2te \u00e0 braser) en temps r\u00e9el<\/li>\n\n\n\n<li>Simulation de jumeaux num\u00e9riques pour l'optimisation<\/li>\n\n\n\n<li>Reconnaissance des d\u00e9fauts par l'IA<\/li>\n\n\n\n<li>Maintenance pr\u00e9dictive des \u00e9quipements<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt-2.jpg\" alt=\"Technologie de placement SMT\" class=\"wp-image-6761\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt-2.jpg 600w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt-2-300x201.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt-2-150x101.jpg 150w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Practical_Advice_Recommended_Resources\"><\/span>Conseils pratiques et ressources recommand\u00e9es<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>Meilleures pratiques en mati\u00e8re de documentation<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Enregistrer les param\u00e8tres optimaux pour chaque produit<\/li>\n\n\n\n<li>Archiver les images de d\u00e9fauts et les solutions<\/li>\n\n\n\n<li>Mettre r\u00e9guli\u00e8rement \u00e0 jour les proc\u00e9dures op\u00e9rationnelles<\/li>\n<\/ul>\n\n\n\n<p><strong>Principaux domaines de formation<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Les bases de l'entretien des \u00e9quipements<\/li>\n\n\n\n<li>Comp\u00e9tences en mati\u00e8re de d\u00e9pannage rapide<\/li>\n\n\n\n<li>Sensibilisation \u00e0 la protection contre les d\u00e9charges \u00e9lectrostatiques<\/li>\n<\/ul>\n\n\n\n<p><strong>Outils recommand\u00e9s<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Magnifier\/microscope (30\u2013100x)<\/li>\n\n\n\n<li>Profileur de temp\u00e9rature<\/li>\n\n\n\n<li>Viscosim\u00e8tre pour p\u00e2te \u00e0 braser<\/li>\n<\/ul>\n\n\n\n<p><strong>Ressources pour l'industrie<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>IPC-A-610 (Acceptabilit\u00e9 des assemblages \u00e9lectroniques)<\/li>\n\n\n\n<li>S\u00e9minaires SMTA (Surface Mount Technology Association)<\/li>\n\n\n\n<li>Notes d'application des principaux fournisseurs d'\u00e9quipement<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Final_Thoughts\"><\/span>R\u00e9flexions finales<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>As the backbone of modern electronics manufacturing, SMT technology\u2019s importance cannot be overstated. Mastering key process points\u2014from solder paste printing to reflow soldering\u2014and understanding root causes of common issues can significantly enhance production quality and efficiency. With components shrinking and process demands rising, continuous learning and hands-on optimization are essential for every SMT engineer.<\/p>\n\n\n\n<p>Rappelez-vous : D'excellents processus SMT = des m\u00e9thodes scientifiques + une discipline rigoureuse + l'exp\u00e9rience accumul\u00e9e. Que ce guide vous serve de r\u00e9f\u00e9rence dans votre travail et n'h\u00e9sitez pas \u00e0 nous faire part de vos id\u00e9es et de vos exp\u00e9riences !<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Related_Articles\"><\/span>Articles connexes<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><a href=\"https:\/\/topfastpcba.com\/fr\/smt-pcb-assembly-process\/\">Processus d'assemblage des circuits imprim\u00e9s SMT<\/a><\/p>\n\n\n\n<p><a href=\"https:\/\/topfastpcba.com\/fr\/smd-pcb-assembly\/\">Assemblage de circuits imprim\u00e9s SMD<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>This in-depth guide details the complete SMT process, covering pre-production prep, solder paste printing, component placement, reflow soldering, and quality inspection. It provides actionable solutions for 5 common production issues, along with specialized component handling tips and industry trends\u2014an indispensable resource for electronics manufacturing professionals.<\/p>","protected":false},"author":2,"featured_media":6762,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[137],"class_list":["post-6758","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry","tag-smt"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.6 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>SMT Placement Technology - Topfastpcba<\/title>\n<meta name=\"description\" content=\"A comprehensive guide to SMT mounting technology workflows, revealing solutions to 5 common issues, and practical tips from solder paste printing to reflow soldering-enhance your electronics manufacturing quality and efficiency.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"SMT Placement Technology - 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Topfastpcba\",\"isPartOf\":{\"@id\":\"https:\/\/topfastpcba.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/topfastpcba.com\/smt-placement-technology\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/topfastpcba.com\/smt-placement-technology\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt.jpg\",\"datePublished\":\"2025-06-02T12:33:19+00:00\",\"dateModified\":\"2025-10-22T09:06:32+00:00\",\"author\":{\"@id\":\"https:\/\/topfastpcba.com\/#\/schema\/person\/3c78a799254faaf83da2317660076c6e\"},\"description\":\"A comprehensive guide to SMT mounting technology workflows, revealing solutions to 5 common issues, and practical tips from solder paste printing to reflow soldering-enhance your electronics manufacturing quality and efficiency.\",\"breadcrumb\":{\"@id\":\"https:\/\/topfastpcba.com\/smt-placement-technology\/#breadcrumb\"},\"inLanguage\":\"fr-FR\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/topfastpcba.com\/smt-placement-technology\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/topfastpcba.com\/smt-placement-technology\/#primaryimage\",\"url\":\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt.jpg\",\"contentUrl\":\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt.jpg\",\"width\":600,\"height\":402,\"caption\":\"SMT placement technology\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/topfastpcba.com\/smt-placement-technology\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/topfastpcba.com\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Industry\",\"item\":\"https:\/\/topfastpcba.com\/category\/industry\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"SMT Placement Technology\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/topfastpcba.com\/#website\",\"url\":\"https:\/\/topfastpcba.com\/\",\"name\":\"Topfastpcba\",\"description\":\"Topfast Prime Choice for Global Electronics Manufacturing\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/topfastpcba.com\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"fr-FR\"},{\"@type\":\"Person\",\"@id\":\"https:\/\/topfastpcba.com\/#\/schema\/person\/3c78a799254faaf83da2317660076c6e\",\"name\":\"topfastpcb\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"SMT Placement Technology - Topfastpcba","description":"A comprehensive guide to SMT mounting technology workflows, revealing solutions to 5 common issues, and practical tips from solder paste printing to reflow soldering-enhance your electronics manufacturing quality and efficiency.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/","og_locale":"fr_FR","og_type":"article","og_title":"SMT Placement Technology - Topfastpcba","og_description":"A comprehensive guide to SMT mounting technology workflows, revealing solutions to 5 common issues, and practical tips from solder paste printing to reflow soldering-enhance your electronics manufacturing quality and efficiency.","og_url":"https:\/\/topfastpcba.com\/fr\/smt-placement-technology\/","og_site_name":"Topfastpcba","article_published_time":"2025-06-02T12:33:19+00:00","article_modified_time":"2025-10-22T09:06:32+00:00","og_image":[{"width":600,"height":402,"url":"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt.jpg","type":"image\/jpeg"}],"author":"topfastpcb","twitter_card":"summary_large_image","twitter_misc":{"\u00c9crit par":"topfastpcb","Dur\u00e9e de lecture estim\u00e9e":"7 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/topfastpcba.com\/smt-placement-technology\/","url":"https:\/\/topfastpcba.com\/smt-placement-technology\/","name":"SMT Placement Technology - Topfastpcba","isPartOf":{"@id":"https:\/\/topfastpcba.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/topfastpcba.com\/smt-placement-technology\/#primaryimage"},"image":{"@id":"https:\/\/topfastpcba.com\/smt-placement-technology\/#primaryimage"},"thumbnailUrl":"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt.jpg","datePublished":"2025-06-02T12:33:19+00:00","dateModified":"2025-10-22T09:06:32+00:00","author":{"@id":"https:\/\/topfastpcba.com\/#\/schema\/person\/3c78a799254faaf83da2317660076c6e"},"description":"A comprehensive guide to SMT mounting technology workflows, revealing solutions to 5 common issues, and practical tips from solder paste printing to reflow soldering-enhance your electronics manufacturing quality and efficiency.","breadcrumb":{"@id":"https:\/\/topfastpcba.com\/smt-placement-technology\/#breadcrumb"},"inLanguage":"fr-FR","potentialAction":[{"@type":"ReadAction","target":["https:\/\/topfastpcba.com\/smt-placement-technology\/"]}]},{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/topfastpcba.com\/smt-placement-technology\/#primaryimage","url":"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt.jpg","contentUrl":"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/06\/smt.jpg","width":600,"height":402,"caption":"SMT placement technology"},{"@type":"BreadcrumbList","@id":"https:\/\/topfastpcba.com\/smt-placement-technology\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/topfastpcba.com\/"},{"@type":"ListItem","position":2,"name":"Industry","item":"https:\/\/topfastpcba.com\/category\/industry\/"},{"@type":"ListItem","position":3,"name":"SMT Placement Technology"}]},{"@type":"WebSite","@id":"https:\/\/topfastpcba.com\/#website","url":"https:\/\/topfastpcba.com\/","name":"Topfastpcba","description":"Topfast Prime Choice for Global Electronics Manufacturing","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/topfastpcba.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"fr-FR"},{"@type":"Person","@id":"https:\/\/topfastpcba.com\/#\/schema\/person\/3c78a799254faaf83da2317660076c6e","name":"topfastpcb"}]}},"_links":{"self":[{"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/posts\/6758","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/comments?post=6758"}],"version-history":[{"count":1,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/posts\/6758\/revisions"}],"predecessor-version":[{"id":6763,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/posts\/6758\/revisions\/6763"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/media\/6762"}],"wp:attachment":[{"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/media?parent=6758"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/categories?post=6758"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/tags?post=6758"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}