{"id":1517,"date":"2025-04-19T09:28:00","date_gmt":"2025-04-19T01:28:00","guid":{"rendered":"https:\/\/topfastpcba.com\/?p=1517"},"modified":"2025-04-18T17:33:01","modified_gmt":"2025-04-18T09:33:01","slug":"pcb-pcba-common-technical-terms","status":"publish","type":"post","link":"https:\/\/topfastpcba.com\/fr\/pcb-pcba-common-technical-terms\/","title":{"rendered":"Termes techniques communs aux PCB\/PCBA"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_75 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table des mati\u00e8res<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-pcba-common-technical-terms\/#Here_are_the_translations_of_the_8_PCB_professional_terms\" >Voici les traductions des 8 termes professionnels de la PCB :<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-pcba-common-technical-terms\/#PCBA_Processing_%E2%80%93_30_Key_Terms\" >PCBA Processing \u2013 30 Key Terms<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Here_are_the_translations_of_the_8_PCB_professional_terms\"><\/span>Voici les traductions des 8 termes professionnels de la PCB :<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>01 <strong>Panneau (Array)<\/strong><br>Certains fabricants de circuits imprim\u00e9s d\u00e9signent les tableaux sous le nom de \"panneaux\". <strong>panneaux d'exp\u00e9dition<\/strong> and <strong>panneaux de travail<\/strong>. A <strong>panneau d'exp\u00e9dition<\/strong> d\u00e9signe l'ensemble des cartes de circuits imprim\u00e9s destin\u00e9es \u00e0 \u00eatre exp\u00e9di\u00e9es, g\u00e9n\u00e9ralement con\u00e7ues pour r\u00e9pondre aux exigences de la production de PCBA, et parfois appel\u00e9es \"set\". <strong>groupe de travail<\/strong> se r\u00e9f\u00e8re \u00e0 la matrice de production, qui contient plusieurs panneaux d'exp\u00e9dition. Les circuits imprim\u00e9s sont fabriqu\u00e9s sous forme de panneaux de travail, puis s\u00e9par\u00e9s en panneaux d'exp\u00e9dition.<br>02 <strong>Oxyde noir \/ Oxyde brun<\/strong><br>Il s'agit d'un processus chimique qui forme une couche uniforme et floue sur la surface du cuivre. Cette couche augmente la surface de contact entre le cuivre et le pr\u00e9-impr\u00e9gn\u00e9 (PP), ce qui am\u00e9liore l'adh\u00e9rence.<br>L'objectif de l'oxyde noir et de l'oxyde brun est le m\u00eame, mais ils diff\u00e8rent par la longueur du duvet, le co\u00fbt des produits chimiques et la difficult\u00e9 du processus.L'oxyde noir offre une adh\u00e9rence plus forte que l'oxyde brun, mais il est plus cher et plus difficile \u00e0 g\u00e9rer. En outre, l'oxyde noir est plus susceptible de pr\u00e9senter des d\u00e9fauts de type \"pink ring\" (anneau rose). Actuellement, la plupart des fabricants utilisent le proc\u00e9d\u00e9 d'oxyde brun.<br>03 <strong>Lamination<\/strong><br>Les circuits imprim\u00e9s multicouches n\u00e9cessitent l'empilage de plusieurs noyaux, couches de PP et feuilles de cuivre, qui sont ensuite coll\u00e9s ensemble \u00e0 haute temp\u00e9rature et sous pression.Sous l'effet de la chaleur, le PP devient visqueux et s'\u00e9coule sous l'effet de la pression, remplissant les espaces grav\u00e9s dans les couches de cuivre internes.<br>04 <strong>Diff\u00e9rents types de trous<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>PTH (Plated Through Hole)<\/strong>: Un trou cuivr\u00e9, m\u00e9tallis\u00e9.<\/li>\n\n\n\n<li><strong>NPTH (trou traversant non plaqu\u00e9)<\/strong>: Trou non cuivr\u00e9, non m\u00e9tallis\u00e9.<\/li>\n\n\n\n<li><strong>Via<\/strong>Un petit trou plaqu\u00e9 de cuivre utilis\u00e9 uniquement pour la conduction \u00e9lectrique.<\/li>\n\n\n\n<li><strong>Trou borgne<\/strong>: Trou qui part de la couche sup\u00e9rieure ou inf\u00e9rieure mais qui ne traverse pas toute la planche (visible d'un c\u00f4t\u00e9).<\/li>\n\n\n\n<li><strong>Enterr\u00e9 Via<\/strong>: Trou reliant les couches internes du circuit imprim\u00e9 sans atteindre les couches externes de cuivre (invisible de l'ext\u00e9rieur).<\/li>\n\n\n\n<li><strong>Trou HDI (High-Density Interconnect)<\/strong>: Micro-trous aveugles form\u00e9s par forage laser.<br>05 <strong>D\u00e9p\u00f4t chimique de cuivre (Chemical Copper Plating)<\/strong><br>\u00c9galement connu sous le nom de cuivrage chimique, ce processus implique une r\u00e9action d'oxydation-r\u00e9duction \u00e0 la surface du substrat pour former une fine couche de cuivre, permettant les connexions \u00e9lectriques entre les couches et facilitant le cuivrage ult\u00e9rieur.<br>06 <strong>Masque de soudure<\/strong><br>Le masque de soudure, \u00e9galement appel\u00e9 r\u00e9serve de soudure, est une couche d'encre appliqu\u00e9e \u00e0 la surface du circuit imprim\u00e9 pour \u00e9viter les courts-circuits de soudure.<br>L'encre des masques de soudure est tr\u00e8s r\u00e9pandue dans les circuits imprim\u00e9s, et environ 90 % d'entre eux sont verts. Toutefois, d'autres couleurs sont \u00e9galement disponibles, telles que le rouge, le bleu, le noir, le blanc et le jaune.<br>Les fonctions du masque de soudure sont les suivantes :<\/li>\n\n\n\n<li>Pr\u00e9venir les soudures incorrectes des composants.<\/li>\n\n\n\n<li>Pr\u00e9vention des ponts de soudure.<\/li>\n\n\n\n<li>Protection (la couche de polym\u00e8re recouvre les traces m\u00e9talliques, offrant ainsi une r\u00e9sistance au brouillard salin, \u00e0 l'humidit\u00e9, etc.)<br>07 <strong>Finition de la surface<\/strong><br>Le cuivre nu pr\u00e9sente une bonne soudabilit\u00e9 mais a tendance \u00e0 s'oxyder lorsqu'il est expos\u00e9 \u00e0 l'air pendant de longues p\u00e9riodes. C'est pourquoi un traitement de surface est appliqu\u00e9 pour garantir une bonne soudabilit\u00e9 ou de bonnes performances \u00e9lectriques.<br>Les finitions de surface les plus courantes sont les suivantes :<\/li>\n\n\n\n<li>HASL (Hot Air Solder Leveling)<\/li>\n\n\n\n<li>ENIG (nickel chimique, immersion dans l'or)<\/li>\n\n\n\n<li>OSP (conservateur de soudabilit\u00e9 organique)<\/li>\n\n\n\n<li>\u00c9tain d'immersion<\/li>\n\n\n\n<li>Argent d'immersion<\/li>\n\n\n\n<li>Or \u00e9lectrolytique<\/li>\n\n\n\n<li>Doigts en or galvanis\u00e9<br>08 <strong>V-CUT<\/strong><br>Le d\u00e9coupage en V est une m\u00e9thode courante pour s\u00e9parer les PCB en unit\u00e9s individuelles et \u00e9liminer les bords r\u00e9siduels. Les <strong>\u00e9paisseur restante<\/strong> after V-CUT refers to the thickness left after the upper and lower blades cut the PCB. This thickness must be neither too thick nor too thin\u2014if too thick, separation is difficult and causes high stress; if too thin, the board lacks support and may break during production. Common V-CUT angles are 30\u00b0, 45\u00b0, and 60\u00b0.<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"800\" height=\"800\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Medical-Equipment-PCBA.jpg\" alt=\"\" class=\"wp-image-1518\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Medical-Equipment-PCBA.jpg 800w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Medical-Equipment-PCBA-300x300.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Medical-Equipment-PCBA-150x150.jpg 150w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Medical-Equipment-PCBA-768x768.jpg 768w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Medical-Equipment-PCBA-400x400.jpg 400w\" sizes=\"auto, (max-width: 800px) 100vw, 800px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"PCBA_Processing_%E2%80%93_30_Key_Terms\"><\/span><strong>PCBA Processing \u2013 30 Key Terms<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>Dans la fabrication de produits \u00e9lectroniques, <strong><a href=\"https:\/\/topfastpcba.com\/fr\/pcb-assembly\/\">PCBA<\/a> (Assemblage de circuits imprim\u00e9s)<\/strong> est un processus complexe et pr\u00e9cis qui fait appel \u00e0 de nombreux termes techniques et \u00e0 des technologies de base.<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>PCBA<\/strong> \u2013 Short for <em>Assemblage de circuits imprim\u00e9s<\/em>Il s'agit de l'ensemble du processus de fabrication des circuits imprim\u00e9s, y compris <strong>Assemblage SMT, insertion DIP, tests fonctionnels et assemblage final<\/strong>.<\/li>\n\n\n\n<li><strong>PCB<\/strong> \u2013 Short for <em>Circuit imprim\u00e9<\/em>Le terme \"circuit imprim\u00e9\" d\u00e9signe g\u00e9n\u00e9ralement les cartes de circuits imprim\u00e9s, qui peuvent \u00eatre des cartes \u00e0 puce. <strong>simple face, double face ou multicouche<\/strong>Les produits sont fabriqu\u00e9s \u00e0 partir de mat\u00e9riaux tels que l'aluminium, l'acier, l'acier inoxydable et l'acier inoxydable. <strong>substrats en FR-4, en r\u00e9sine, en fibre de verre ou en aluminium<\/strong>.<\/li>\n\n\n\n<li><strong>Fichier Gerber<\/strong> \u2013 A set of files describing PCB images (circuit layers, solder mask, silkscreen, etc.) along with drilling and milling data, required for PCBA quotations.<\/li>\n\n\n\n<li><strong>Nomenclature (Bill of Materials)<\/strong> \u2013 A list of all components used in PCBA, including quantities and process routes, serving as a key reference for procurement.<\/li>\n\n\n\n<li><strong>SMT (technologie de montage en surface)<\/strong> \u2013 A process involving <strong>l'impression de la p\u00e2te \u00e0 braser, le placement des composants et le brasage par refusion<\/strong> sur les PCB.<\/li>\n\n\n\n<li><strong>Impression de la p\u00e2te \u00e0 braser<\/strong> \u2013 Depositing solder paste through a stencil onto PCB pads using a squeegee blade.<\/li>\n\n\n\n<li><strong>SPI (Inspection de la p\u00e2te \u00e0 braser)<\/strong> \u2013 A machine that checks solder paste thickness and printing quality post-application.<\/li>\n\n\n\n<li><strong>Soudure par refusion<\/strong> \u2013 Heating PCBs in a reflow oven to melt solder paste, forming solid solder joints upon cooling.<\/li>\n\n\n\n<li><strong>AOI (Inspection optique automatis\u00e9e)<\/strong> \u2013 A scanning system that detects soldering defects by comparing PCB images to standards.<\/li>\n\n\n\n<li><strong>DIP (bo\u00eetier double en ligne)<\/strong> \u2013 A process where <strong>composants \u00e0 trous traversants<\/strong> sont ins\u00e9r\u00e9s dans les PCB, suivis par <strong>soudure \u00e0 la vague, d\u00e9coupage des broches, retouches et nettoyage<\/strong>.<\/li>\n\n\n\n<li><strong>Soudure \u00e0 la vague<\/strong> \u2013 Passing PCBs over a molten solder wave to solder through-hole components.<\/li>\n\n\n\n<li><strong>Coupe des goupilles<\/strong> \u2013 Cutting excess component leads after soldering for proper sizing.<\/li>\n\n\n\n<li><strong>Retouches (Rework)<\/strong> \u2013 Repairing incomplete or defective solder joints manually.<\/li>\n\n\n\n<li><strong>Nettoyage du conseil d'administration<\/strong> \u2013 Removing flux residues and contaminants to meet environmental and cleanliness standards.<\/li>\n\n\n\n<li><strong>Rev\u00eatement conforme<\/strong> \u2013 Applying a protective layer (e.g., acrylic, silicone) to PCBA for <strong>isolation, r\u00e9sistance \u00e0 l'humidit\u00e9 et pr\u00e9vention de la corrosion<\/strong>.<\/li>\n\n\n\n<li><strong>Tampons (motifs terrestres)<\/strong> \u2013 Exposed copper areas on PCBs for component soldering.<\/li>\n\n\n\n<li><strong>Emballage des composants<\/strong> \u2013 The physical form of components, mainly <strong>DIP (trou traversant) et SMD (montage en surface)<\/strong>.<\/li>\n\n\n\n<li><strong>Pas (espacement des fils)<\/strong> \u2013 The distance between adjacent component leads\/terminals.<\/li>\n\n\n\n<li><strong>QFP (Quad Flat Package)<\/strong> \u2013 A surface-mount IC with gull-wing leads on all four sides.<\/li>\n\n\n\n<li><strong>BGA (Ball Grid Array)<\/strong> \u2013 An IC package with solder balls arranged in a grid on its underside.<\/li>\n\n\n\n<li><strong>AQ (Assurance qualit\u00e9)<\/strong> \u2013 Ensures product quality through inspections and testing.<\/li>\n\n\n\n<li><strong>FCT (Functional Circuit Test)<\/strong> \u2013 Simulates real-world operation to verify PCBA functionality.<\/li>\n\n\n\n<li><strong>Essais de rodage<\/strong> \u2013 Stress-testing PCBAs under extreme conditions to identify early failures.<\/li>\n\n\n\n<li><strong>Essais de vibration<\/strong> \u2013 Assessing PCBA durability against mechanical vibrations during use\/transport.<\/li>\n\n\n\n<li><strong>IQC (Incoming Quality Control)<\/strong> \u2013 Inspects raw materials\/components upon receipt.<\/li>\n\n\n\n<li><strong>Pochoir (masque de soudure)<\/strong> \u2013 A laser-cut metal sheet for precise solder paste deposition.<\/li>\n\n\n\n<li><strong>Fixation (gabarit)<\/strong> \u2013 A tool for batch production, including <strong>les montages d'assemblage, d'essai et d'essai de circuits imprim\u00e9s<\/strong>.<\/li>\n\n\n\n<li><strong>Trou de passage plaqu\u00e9 (PTH)<\/strong> \u2013 Copper-plated holes for interlayer connections\/signal transmission.<\/li>\n\n\n\n<li><strong>Masque de soudure<\/strong> \u2013 A protective layer over copper traces to prevent shorts\/corrosion.<\/li>\n\n\n\n<li><strong>SMD (Surface-Mount Device)<\/strong> \u2013 Components mounted directly onto PCBs without leads, the dominant assembly method today.<\/li>\n<\/ol>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Here\u2019s the translation of the **30 PCBA (Printed Circuit Board Assembly) processing terms** in the electronics manufacturing industry<\/p>","protected":false},"author":2,"featured_media":1075,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[],"class_list":["post-1517","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.6 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB\/PCBA common technical terms - Topfastpcba<\/title>\n<meta name=\"description\" content=\"Here\u2019s the translation of the **30 PCBA (Printed Circuit Board Assembly) processing terms** in the electronics manufacturing industry\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/topfastpcba.com\/fr\/pcb-pcba-common-technical-terms\/\" \/>\n<meta property=\"og:locale\" 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