{"id":1165,"date":"2025-03-15T15:05:14","date_gmt":"2025-03-15T07:05:14","guid":{"rendered":"https:\/\/topfastpcba.com\/?p=1165"},"modified":"2025-03-21T11:52:18","modified_gmt":"2025-03-21T03:52:18","slug":"what-are-the-pcb-surface-treatment-processes","status":"publish","type":"post","link":"https:\/\/topfastpcba.com\/fr\/what-are-the-pcb-surface-treatment-processes\/","title":{"rendered":"Quels sont les proc\u00e9d\u00e9s de traitement de surface des PCB, ainsi que leurs avantages et inconv\u00e9nients ?"},"content":{"rendered":"<p>Le processus de traitement de surface des PCB fait r\u00e9f\u00e9rence au <a href=\"https:\/\/topfastpcba.com\/fr\/flexible-pcb\/\">Carte PCB<\/a> Le but principal est de s'assurer que le PCB a une bonne soudabilit\u00e9 et de bonnes propri\u00e9t\u00e9s \u00e9lectriques. Les technologies courantes de traitement de surface des PCB comprennent le nivellement \u00e0 l'air chaud (HASL), le proc\u00e9d\u00e9 de rev\u00eatement organique (OSP), le nickelage chimique\/la dorure par immersion (ENIG), le proc\u00e9d\u00e9 d'argenture par immersion, le proc\u00e9d\u00e9 d'\u00e9tain par immersion et d'autres proc\u00e9d\u00e9s de nickelage et de palladium chimique.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-large is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"617\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes1-1024x617.jpg\" alt=\"\" class=\"wp-image-1166\" style=\"width:600px\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes1-1024x617.jpg 1024w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes1-300x181.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes1-768x462.jpg 768w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes1-150x90.jpg 150w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes1.jpg 1058w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n<\/div>\n\n\n<p>1. Le nivellement par brasage \u00e0 l'air chaud (HASL) est une technologie traditionnelle de traitement de surface des circuits imprim\u00e9s, qui consiste \u00e0 recouvrir la surface du circuit imprim\u00e9 d'une couche de brasage fondu et \u00e0 utiliser de l'air chaud pour la rendre plane.Applicable au processus SMT, \u00e0 la soudure sans plomb, au processus mature, au faible co\u00fbt, \u00e0 la facilit\u00e9 d'utilisation, il convient aux exigences g\u00e9n\u00e9rales des produits \u00e9lectroniques, mais les cartes particuli\u00e8rement \u00e9paisses ou fines ont des limites, et ne conviennent pas \u00e0 la conception d'interrupteurs \u00e0 contact.<br>2\u3001Organic coating process (OSP) is a thin layer of organic protective film coated on the surface of the PCB, this film can prevent the oxidation of copper foil, and improve solderability. Suitable for lead-free soldering and SMT, low cost, environmentally friendly, OSP process is environmentally friendly, low cost, suitable for short-term storage and soldering of PCBs, the limitations of the number of reflow soldering, not suitable for crimping technology, wire bonding, and storage conditions require high.<br>3. Le nickelage chimique\/la dorure par immersion (ENIG) est une couche de nickel d\u00e9pos\u00e9e chimiquement sur la surface du circuit imprim\u00e9, suivie d'un traitement \u00e0 la dorure par immersion.Applicable au PTH (Plated Through Hole), surface plate, sans plomb, bonne soudabilit\u00e9 et r\u00e9sistance \u00e0 la corrosion, co\u00fbteux, non retravaillable, longue dur\u00e9e de conservation, adapt\u00e9 aux produits \u00e9lectroniques \u00e0 haute densit\u00e9 et \u00e0 pas fin.<br>4, le proc\u00e9d\u00e9 d'argent par immersion consiste \u00e0 former une couche d'argent sur la surface du circuit imprim\u00e9, avec une bonne conductivit\u00e9 et une bonne soudabilit\u00e9.Haute soudabilit\u00e9, bonne plan\u00e9it\u00e9 de surface, faible co\u00fbt et sans plomb (conforme \u00e0 la directive RoHS), faible r\u00e9sistance de contact, adapt\u00e9 aux circuits \u00e0 haute fr\u00e9quence, exigences \u00e9lev\u00e9es en mati\u00e8re de stockage, l'argent est facile \u00e0 oxyder, facile \u00e0 contaminer, fen\u00eatre d'assemblage courte apr\u00e8s le retrait de l'emballage, affectant la soudabilit\u00e9 et la r\u00e9sistance \u00e0 la corrosion.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"851\" height=\"495\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes.jpg\" alt=\"\" class=\"wp-image-1167\" style=\"width:600px\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes.jpg 851w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes-300x175.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes-768x447.jpg 768w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes-390x228.jpg 390w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes-150x87.jpg 150w\" sizes=\"auto, (max-width: 851px) 100vw, 851px\" \/><\/figure>\n<\/div>\n\n\n<p>5, le proc\u00e9d\u00e9 d'\u00e9tain par immersion est recouvert d'une couche d'\u00e9tain sur la surface du circuit imprim\u00e9, convient pour les composants \u00e0 pas fin \/ BGA \/ plus petits, une excellente plan\u00e9it\u00e9 peut \u00eatre obtenue, un co\u00fbt moyen, une bonne soudabilit\u00e9, mais une faible r\u00e9sistance \u00e0 la corrosion, convient pour les occasions qui n\u00e9cessitent une soudabilit\u00e9 \u00e9lev\u00e9e, sensible \u00e0 la manipulation, une courte dur\u00e9e de conservation, \u00e9rosif pour le masque de soudure.<br>6, nickelage chimique &amp;#8211 ; palladium chimique plaqu\u00e9 or par immersion (ENEPIG) : l'agent r\u00e9ducteur (tel que le dihydrog\u00e8ne hypophosphite de sodium) permet aux ions palladium de se transformer en palladium lors de la r\u00e9duction catalytique de la surface ; le palladium nouveau-n\u00e9 peut \u00eatre appel\u00e9 \u00e0 promouvoir la r\u00e9action du catalyseur, ce qui permet d'obtenir une couche plaqu\u00e9e palladium de n'importe quelle \u00e9paisseur, plus respectueuse de l'environnement que l'ENIG, offrant de bonnes propri\u00e9t\u00e9s \u00e9lectriques et une bonne protection, une bonne fiabilit\u00e9 de soudage, une bonne stabilit\u00e9 thermique et une bonne plan\u00e9it\u00e9 de la surface. L'inconv\u00e9nient est que le palladium est un m\u00e9tal pr\u00e9cieux rare et que son co\u00fbt augmente.<br>7, l'or dur (or dur \u00e9lectrolytique) est un conducteur de surface du circuit imprim\u00e9 qui est d'abord recouvert d'une couche de nickel, puis d'une couche d'or. Le nickelage sert principalement \u00e0 emp\u00eacher la diffusion de l'or et du cuivre entre les soudures, ce qui fragilise l'or \u00e9lectrod\u00e9pos\u00e9 et r\u00e9duit sa dur\u00e9e de vie ; il faut donc \u00e9viter de souder sur l'or \u00e9lectrod\u00e9pos\u00e9.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"790\" height=\"524\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes2.jpg\" alt=\"\" class=\"wp-image-1168\" style=\"width:600px\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes2.jpg 790w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes2-300x199.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes2-768x509.jpg 768w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes2-150x99.jpg 150w\" sizes=\"auto, (max-width: 790px) 100vw, 790px\" \/><\/figure>\n<\/div>\n\n\n<p>Le choix du bon processus de traitement de surface des PCB peut am\u00e9liorer de mani\u00e8re significative les performances et la fiabilit\u00e9 des produits \u00e9lectroniques, mais aussi permettre de r\u00e9duire consid\u00e9rablement les co\u00fbts. Topfast PCBA est sp\u00e9cialis\u00e9 dans le traitement de surface de petits et moyens volumes de circuits imprim\u00e9s et de cartes de circuits imprim\u00e9s.<a href=\"https:\/\/topfastpcba.com\/fr\/\">PCBA<\/a> la fabrication \u00e0 guichet unique, la s\u00e9lection de la bonne solution pour votre projet et la fourniture de solutions de fabrication \u00e9lectronique professionnelles et efficaces.<\/p>","protected":false},"excerpt":{"rendered":"<p>Le processus de traitement de surface des PCB fait r\u00e9f\u00e9rence aux composants de la carte PCB, aux connexions \u00e9lectriques sur la formation artificielle d&amp;#8217une couche et aux propri\u00e9t\u00e9s m\u00e9caniques, physiques et chimiques du substrat de la couche de surface, l&amp;#8217objectif principal \u00e9tant de garantir que le PCB pr\u00e9sente une bonne soudabilit\u00e9 et de bonnes propri\u00e9t\u00e9s \u00e9lectriques. <\/p>","protected":false},"author":2,"featured_media":1167,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[53,63],"class_list":["post-1165","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry","tag-pcb-board","tag-surface-treatment-process"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.6 - 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Topfastpcba","description":"PCB surface treatment process, refers to the PCB board components, electrical connections on the artificial formation of a layer and the substrate's mechanical, physical and chemical properties of the surface layer, the core purpose is to ensure that the PCB has a good solderability and electrical properties.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/topfastpcba.com\/fr\/what-are-the-pcb-surface-treatment-processes\/","og_locale":"fr_FR","og_type":"article","og_title":"What are the PCB surface treatment processes, as well as the advantages and disadvantages - Topfastpcba","og_description":"PCB surface treatment process, refers to the PCB board components, electrical connections on the artificial formation of a layer and the substrate's mechanical, physical and chemical properties of the surface layer, the core purpose is to ensure that the PCB has a good solderability and electrical properties.","og_url":"https:\/\/topfastpcba.com\/fr\/what-are-the-pcb-surface-treatment-processes\/","og_site_name":"Topfastpcba","article_published_time":"2025-03-15T07:05:14+00:00","article_modified_time":"2025-03-21T03:52:18+00:00","og_image":[{"width":851,"height":495,"url":"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes.jpg","type":"image\/jpeg"}],"author":"topfastpcb","twitter_card":"summary_large_image","twitter_misc":{"\u00c9crit par":"topfastpcb","Dur\u00e9e de lecture estim\u00e9e":"4 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/topfastpcba.com\/what-are-the-pcb-surface-treatment-processes\/","url":"https:\/\/topfastpcba.com\/what-are-the-pcb-surface-treatment-processes\/","name":"What are the PCB surface treatment processes, as well as the advantages and disadvantages - Topfastpcba","isPartOf":{"@id":"https:\/\/topfastpcba.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/topfastpcba.com\/what-are-the-pcb-surface-treatment-processes\/#primaryimage"},"image":{"@id":"https:\/\/topfastpcba.com\/what-are-the-pcb-surface-treatment-processes\/#primaryimage"},"thumbnailUrl":"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes.jpg","datePublished":"2025-03-15T07:05:14+00:00","dateModified":"2025-03-21T03:52:18+00:00","author":{"@id":"https:\/\/topfastpcba.com\/#\/schema\/person\/3c78a799254faaf83da2317660076c6e"},"description":"PCB surface treatment process, refers to the PCB board components, electrical connections on the artificial formation of a layer and the substrate's mechanical, physical and chemical properties of the surface layer, the core purpose is to ensure that the PCB has a good solderability and electrical properties.","breadcrumb":{"@id":"https:\/\/topfastpcba.com\/what-are-the-pcb-surface-treatment-processes\/#breadcrumb"},"inLanguage":"fr-FR","potentialAction":[{"@type":"ReadAction","target":["https:\/\/topfastpcba.com\/what-are-the-pcb-surface-treatment-processes\/"]}]},{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/topfastpcba.com\/what-are-the-pcb-surface-treatment-processes\/#primaryimage","url":"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes.jpg","contentUrl":"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes.jpg","width":851,"height":495},{"@type":"BreadcrumbList","@id":"https:\/\/topfastpcba.com\/what-are-the-pcb-surface-treatment-processes\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/topfastpcba.com\/"},{"@type":"ListItem","position":2,"name":"Industry","item":"https:\/\/topfastpcba.com\/category\/industry\/"},{"@type":"ListItem","position":3,"name":"What are the PCB surface treatment processes, as well as the advantages and disadvantages"}]},{"@type":"WebSite","@id":"https:\/\/topfastpcba.com\/#website","url":"https:\/\/topfastpcba.com\/","name":"Topfastpcba","description":"Topfast Prime Choice for Global Electronics Manufacturing","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/topfastpcba.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"fr-FR"},{"@type":"Person","@id":"https:\/\/topfastpcba.com\/#\/schema\/person\/3c78a799254faaf83da2317660076c6e","name":"topfastpcb"}]}},"_links":{"self":[{"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/posts\/1165","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/comments?post=1165"}],"version-history":[{"count":2,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/posts\/1165\/revisions"}],"predecessor-version":[{"id":1230,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/posts\/1165\/revisions\/1230"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/media\/1167"}],"wp:attachment":[{"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/media?parent=1165"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/categories?post=1165"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/topfastpcba.com\/fr\/wp-json\/wp\/v2\/tags?post=1165"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}