{"id":6715,"date":"2025-05-26T14:31:07","date_gmt":"2025-05-26T06:31:07","guid":{"rendered":"https:\/\/topfastpcba.com\/?p=6715"},"modified":"2025-10-22T17:08:22","modified_gmt":"2025-10-22T09:08:22","slug":"what-is-pcb-relay","status":"publish","type":"post","link":"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/","title":{"rendered":"What is PCB Relay\uff1f"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_75 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">\u00cdndice<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#What_is_a_PCB_relay\" >\u00bfQu\u00e9 es un rel\u00e9 PCB?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#Core_Advantages\" >Principales ventajas<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#1_Compact_Integration\" >1. Integraci\u00f3n compacta<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#2_Electrical_Safety\" >2.Seguridad el\u00e9ctrica<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#3_Flexible_Adaptation\" >3.Adaptaci\u00f3n flexible<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#PCB_Relay_Characteristics\" >Caracter\u00edsticas de los rel\u00e9s PCB<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#1_High_voltagecurrent_carrying_capacity\" >1. Alta capacidad de transporte de tensi\u00f3n\/corriente<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#2_Semiconductor_Technology_Solid_State_RelaySSR\" >2.Tecnolog\u00eda de semiconductores (rel\u00e9 de estado s\u00f3lido\/SSR)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#3_Delay_trigger_function\" >3.Funci\u00f3n de disparo retardado<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#4_Temperature_protection_thermal_relay\" >4.Protecci\u00f3n de temperatura (rel\u00e9 t\u00e9rmico)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#5_Frequency_protection_AC_system_specific\" >5.Protecci\u00f3n de frecuencia (espec\u00edfica del sistema de CA)<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#Core_Structure_Composition\" >Composici\u00f3n de la estructura central<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#How_does_a_PCB_relay_work\" >\u00bfC\u00f3mo funciona un rel\u00e9 PCB?<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#1_Excitation_Stage\" >1. Etapa de excitaci\u00f3n<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#2_Contact_action\" >2.Acci\u00f3n de contacto<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#3_Reset_stage\" >3.Etapa de reinicio<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#Relay_PCB_Types\" >Tipos de rel\u00e9s PCB<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#1_Single_Pole_Single_Throw_SPST_Single_Pole_Single_Throw\" >1. Un solo polo, un solo tirador (SPST, Single Pole Single Throw)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#2_Single_Pole_Double_Throw_SPDT_Single_Pole_Double_Throw\" >2.Unipolar de doble efecto (SPDT, Single Pole Double Throw)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#3_Double_Pole_Single_Throw_DPST_Double_Pole_Single_Throw\" >3.Doble polo y simple efecto (DPST, Double Pole Single Throw)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#4_Double_Pole_Double_Throw_DPDT_Double_Pole_Double_Throw\" >4.Doble polo doble tiro (DPDT, Double Pole Double Throw)<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#Basic_Design_Requirements_for_PCB_Relays\" >Requisitos b\u00e1sicos de dise\u00f1o para rel\u00e9s PCB<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-23\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#1_PCB_Material_and_Thickness\" >1. Material y grosor de la placa de circuito impreso<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-24\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#2_Conductor_Copper_Foil_Thickness\" >2.Espesor del conductor (l\u00e1mina de cobre)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-25\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#3_Layout_and_Spacing_Specifications\" >3.Especificaciones de disposici\u00f3n y espaciado<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-26\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#4_Mounting_and_Mechanical_Protection\" >4.Montaje y protecci\u00f3n mec\u00e1nica<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-27\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#5_Cleaning_and_Protection\" >5.Limpieza y protecci\u00f3n<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-28\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#Design_Pitfalls_and_Common_Mistakes\" >Escollos de dise\u00f1o y errores comunes<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-29\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#Relay_Selection_Reference_Table\" >Tabla de referencia de selecci\u00f3n de rel\u00e9s<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-30\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#PCB_Relay_Mounting_Techniques\" >T\u00e9cnicas de montaje de rel\u00e9s en placas de circuito impreso<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-31\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#I_Soldering_Process_Specifications\" >I. Especificaciones del proceso de soldadura<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-32\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#II_Installation_Electrical_Connection\" >II.Instalaci\u00f3n y humedad; conexi\u00f3n el\u00e9ctrica<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-33\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#III_Post-Installation_Steps\" >III.Pasos posteriores a la instalaci\u00f3n<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-34\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#IV_Common_Pitfalls_Solutions\" >IV.Errores comunes y soluciones<\/a><\/li><\/ul><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-35\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#Testing_PCB_Relays\" >Prueba de rel\u00e9s PCB<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-36\" href=\"https:\/\/topfastpcba.com\/es\/what-is-pcb-relay\/#Related_reading\" >Lecturas relacionadas<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_is_a_PCB_relay\"><\/span>\u00bfQu\u00e9 es un rel\u00e9 PCB?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>Los rel\u00e9s PCB (Printed Circuit Board Relays) son rel\u00e9s en miniatura que pueden montarse directamente en una placa de circuito impreso para energizar y desenergizar circuitos mediante se\u00f1ales de control de forma inteligente. Su funci\u00f3n principal es controlar de forma segura circuitos de alta tensi\u00f3n utilizando circuitos de baja potencia al tiempo que proporcionan aislamiento de corriente &#8211; una ventaja clave que los interruptores transistorizados no pueden sustituir.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Core_Advantages\"><\/span>Principales ventajas<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Compact_Integration\"><\/span>1. Integraci\u00f3n compacta<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Dise\u00f1ada para placas de circuito impreso, es peque\u00f1a y ligera, admite la instalaci\u00f3n de procesos de taladro pasante y es adecuada para el dise\u00f1o de placas de circuito impreso de alta densidad.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Electrical_Safety\"><\/span>2.Seguridad el\u00e9ctrica<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>El aislamiento f\u00edsico (separaci\u00f3n de contactos y bobinas) protege el lado de control de baja tensi\u00f3n de las interferencias del lado de alta tensi\u00f3n, lo que reduce el riesgo del sistema.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Flexible_Adaptation\"><\/span>3.Adaptaci\u00f3n flexible<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Existen varios tipos (por ejemplo, rel\u00e9s de se\u00f1al, rel\u00e9s de potencia, rel\u00e9s de estado s\u00f3lido, etc.) para adaptarse a los distintos requisitos de tensi\u00f3n\/corriente.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/PCB-Relay.jpg\" alt=\"Rel\u00e9 PCB\" class=\"wp-image-6717\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/PCB-Relay.jpg 600w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/PCB-Relay-300x201.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/PCB-Relay-150x101.jpg 150w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"PCB_Relay_Characteristics\"><\/span>Caracter\u00edsticas de los rel\u00e9s PCB<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_High_voltagecurrent_carrying_capacity\"><\/span>1. Alta capacidad de transporte de tensi\u00f3n\/corriente<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Dise\u00f1ado para aplicaciones de alta tensi\u00f3n (por ejemplo, 220 V CA\/CC en control industrial) y alta corriente (10 A+) para garantizar la conmutaci\u00f3n estable de cargas de potencia.<br>Aplicaciones t\u00edpicas: control de motores, sistemas de distribuci\u00f3n de energ\u00eda, protecci\u00f3n de armarios el\u00e9ctricos.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Semiconductor_Technology_Solid_State_RelaySSR\"><\/span>2.Tecnolog\u00eda de semiconductores (rel\u00e9 de estado s\u00f3lido\/SSR)<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Dise\u00f1o sin contacto: Conmutaci\u00f3n electr\u00f3nica mediante semiconductores (por ejemplo, MOSFET, tiristores), sin desgaste mec\u00e1nico y mayor vida \u00fatil.<br>Baja interferencia: evita las chispas y el ruido electromagn\u00e9tico de los contactos de rel\u00e9 tradicionales, adecuado para equipos electr\u00f3nicos de precisi\u00f3n.<br>Escenarios aplicables: conmutaci\u00f3n de alta frecuencia (como el control de se\u00f1ales PLC), entorno a prueba de explosiones.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Delay_trigger_function\"><\/span>3.Funci\u00f3n de disparo retardado<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>M\u00f3dulo de rel\u00e9 temporizado incorporado, se puede ajustar el retardo de la acci\u00f3n (p. ej. 0,1s~10s) para controlar la temporizaci\u00f3n o evitar falsos disparos.<br>Ejemplo: arranque suave del motor, protecci\u00f3n tamp\u00f3n de fallo de alimentaci\u00f3n del equipo.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Temperature_protection_thermal_relay\"><\/span>4.Protecci\u00f3n de temperatura (rel\u00e9 t\u00e9rmico)<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Integrated temperature sensor or bimetal to automatically disconnect the circuit when the ambient\/load temperature exceeds the threshold value (e.g. 85\u00b0C).<br>Objetos de protecci\u00f3n: m\u00f3dulos de potencia, transformadores, dispositivos semiconductores de alta potencia.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_Frequency_protection_AC_system_specific\"><\/span>5.Protecci\u00f3n de frecuencia (espec\u00edfica del sistema de CA)<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Monitors AC frequency (e.g. 50\/60Hz) and triggers tripping when abnormal (\u00b15% offset) to prevent equipment damage.<br>Aplicaciones t\u00edpicas: protecci\u00f3n de generadores conectados a la red, supervisi\u00f3n de la salida de inversores.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Core_Structure_Composition\"><\/span>Composici\u00f3n de la estructura central<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>Los rel\u00e9s PCB se componen principalmente de los siguientes componentes clave:<br>Bobina electromagn\u00e9tica: componente del n\u00facleo que genera un campo magn\u00e9tico cuando recibe corriente.<br>Armadura (inducido): pieza de hierro m\u00f3vil accionada por el campo magn\u00e9tico, que controla directamente la apertura y el cierre de los contactos.<br>Contactos: normalmente abiertos (NO), normalmente cerrados (NC) y comunes (COM), utilizados para activar y desactivar el circuito.<br>Mecanismo de resorte\/reinicio: Devuelve la armadura al estado inicial de los contactos cuando se pierde la alimentaci\u00f3n.<br>Yugo:Un marco magn\u00e9ticamente conductor que concentra el campo magn\u00e9tico para aumentar<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"How_does_a_PCB_relay_work\"><\/span>\u00bfC\u00f3mo funciona un rel\u00e9 PCB?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Excitation_Stage\"><\/span>1. Etapa de excitaci\u00f3n<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Cuando el circuito de control aplica una tensi\u00f3n nominal (por ejemplo, 5 V CC\/24 V CC) a la bobina, pasa corriente a trav\u00e9s de ella.<br>La bobina genera un campo electromagn\u00e9tico que magnetiza el yugo y atrae el inducido hacia el n\u00facleo.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Contact_action\"><\/span>2.Acci\u00f3n de contacto<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>El inducido acciona el mecanismo de contacto:<br>Contacto normalmente cerrado (NC): interrumpe la conexi\u00f3n.<br>Contacto normalmente abierto (NA): conexi\u00f3n cerrada.<br>En este punto, el circuito de carga se conecta o se corta (seg\u00fan la configuraci\u00f3n de los contactos).<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Reset_stage\"><\/span>3.Etapa de reinicio<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Cuando la bobina se desenergiza, el campo magn\u00e9tico desaparece y la fuerza del muelle empuja el inducido a su posici\u00f3n inicial.<br>Los contactos vuelven a su estado inicial (NC cerrado, NO desconectado).<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"655\" height=\"427\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcb-relay-2.jpg\" alt=\"Rel\u00e9 PCB\" class=\"wp-image-6718\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcb-relay-2.jpg 655w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcb-relay-2-300x196.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcb-relay-2-150x98.jpg 150w\" sizes=\"auto, (max-width: 655px) 100vw, 655px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Relay_PCB_Types\"><\/span>Tipos de rel\u00e9s PCB<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>The \u201cPole\u201d and \u201cThrow\u201d of a relay are key parameters describing its contact configuration, which directly affects the circuit control capability. The following are common types and characteristics of PCB relays:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Single_Pole_Single_Throw_SPST_Single_Pole_Single_Throw\"><\/span>1. Un solo polo, un solo tirador (SPST, Single Pole Single Throw)<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Estructura: 1 juego de contactos, s\u00f3lo 1 posici\u00f3n de conducci\u00f3n (normalmente abierto o normalmente cerrado).<br>Funci\u00f3n:La forma m\u00e1s simple de conmutaci\u00f3n, s\u00f3lo un circuito puede ser energizado.<br>S\u00edmbolo:<br>\u250c\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2510<br>\u2502 \u25cb\u2500\u2500\u2500\u2524 (Normally open type)<br>\u2514\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2518<br>Aplicaciones t\u00edpicas: conmutaci\u00f3n de potencia, control de LED y otros escenarios b\u00e1sicos de encendido\/apagado.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Single_Pole_Double_Throw_SPDT_Single_Pole_Double_Throw\"><\/span>2. Unipolar de doble efecto (SPDT, <a href=\"https:\/\/topfastpcba.com\/es\/songle-spdt-miniature-pcb-mount-relay\/\">Unipolar Doble Tiro<\/a>)<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Estructura: 1 juego de contactos, 2 posiciones de conducci\u00f3n (normalmente abierto + normalmente cerrado + borne com\u00fan).<br>Funci\u00f3n:El terminal com\u00fan (COM) puede conmutarse a dos circuitos independientes, realizando dos controles selectivos.<br>S\u00edmbolo:<br>\u250c\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2510<br>\u2502 \u25cb\u2500\u2500\u2500\u2524 (COM\u2192NO)<br>\u2502 \u25cb\u2500\u2500\u2500\u2524 (COM\u2192NC)<br>\u2514\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2518<br>Caracter\u00edsticas:<br>Dos estados: cerrado por defecto (NC) o desconectado por defecto (NO).<br>Existe una breve desconexi\u00f3n al conmutar (Break-before-make).<br>Aplicaciones: conmutaci\u00f3n de se\u00f1ales, control de avance y retroceso de motores.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Double_Pole_Single_Throw_DPST_Double_Pole_Single_Throw\"><\/span>3.Doble polo y simple efecto (DPST, Double Pole Single Throw)<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Estructura: 2 grupos de contactos independientes, cada grupo de 1 posici\u00f3n de conducci\u00f3n (equivalente a dos SPST en paralelo).<br>Funci\u00f3n: Control sincronizado de dos circuitos, pero cada grupo de contactos s\u00f3lo se enciende y apaga una vez.<br>S\u00edmbolo:<br>\u250c\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2510<br>\u2502 \u25cb\u2500\u2500\u2500\u2524 (Contact 1)<br>\u2502 \u25cb\u2500\u2500\u2500\u2524 (Contact 2)<br>\u2514\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2518<br>Aplicaci\u00f3n:Corte simult\u00e1neo de la l\u00ednea de fuego\/cero (por ejemplo, interruptor de seguridad), control de potencia doble.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Double_Pole_Double_Throw_DPDT_Double_Pole_Double_Throw\"><\/span>4.Doble polo doble tiro (DPDT, Double Pole Double Throw)<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Estructura: 2 grupos de contactos, cada grupo de 2 posiciones de conducci\u00f3n (equivalente a dos SPDT en paralelo).<br>Funci\u00f3n: Conmutaci\u00f3n independiente de dos circuitos bidireccionales para soportar l\u00f3gicas de control complejas.<br>S\u00edmbolo:<br>\u250c\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2510<br>\u2502 \u25cb\u2500\u2500\u2500\u2524 (COM1\u2192NO1)<br>\u2502 \u25cb\u2500\u2500\u2500\u2524 (COM1\u2192NC1)<br>\u2502 \u25cb\u2500\u2500\u2500\u2524 (COM2\u2192NO2)<br>\u2502 \u25cb\u2500\u2500\u2500\u2524 (COM2\u2192NC2)<br>\u2514\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2518<br>Caracter\u00edsticas:<br>Puede controlar dos cargas en sentido de avance\/retroceso al mismo tiempo (por ejemplo, accionamiento de motor de CC con puente en H).<br>Aplicaciones: automatizaci\u00f3n industrial, control de articulaciones rob\u00f3ticas.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Basic_Design_Requirements_for_PCB_Relays\"><\/span><strong>Requisitos b\u00e1sicos de dise\u00f1o para rel\u00e9s PCB<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>Para garantizar la fiabilidad y estabilidad a largo plazo de los rel\u00e9s en placas de circuito impreso, el dise\u00f1o debe tener en cuenta <strong>selecci\u00f3n de materiales, optimizaci\u00f3n del dise\u00f1o, especificaciones del proceso<\/strong>y <strong>protecci\u00f3n del medio ambiente<\/strong>. A continuaci\u00f3n se exponen los principios b\u00e1sicos de dise\u00f1o:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_PCB_Material_and_Thickness\"><\/span><strong>1. Material y grosor de la placa de circuito impreso<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Espesor del sustrato<\/strong>:<\/li>\n\n\n\n<li><strong>Recomendado: 1,6 mm<\/strong> (est\u00e1ndar para montaje pasante) para garantizar la resistencia mec\u00e1nica y minimizar la deformaci\u00f3n de la soldadura.<\/li>\n\n\n\n<li>For high-frequency\/high-density applications, 0.8\u20131.0mm may be used (evaluate bending resistance).<\/li>\n\n\n\n<li><strong>Tipo de sustrato<\/strong>:<\/li>\n\n\n\n<li><strong>FR-4 Vidrio Epoxi<\/strong>: General-purpose, heat-resistant (Tg \u2265 130\u00b0C), cost-effective.<\/li>\n\n\n\n<li><strong>CEM-1\/Papel Epoxi<\/strong>: Bajo coste, adecuado para aplicaciones de bajo consumo.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Conductor_Copper_Foil_Thickness\"><\/span><strong>2.Espesor del conductor (l\u00e1mina de cobre)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Opciones est\u00e1ndar<\/strong>:<\/li>\n\n\n\n<li><strong>35\u03bcm (1oz)<\/strong>: Trazas de se\u00f1al de baja corriente (&lt;2A).<\/li>\n\n\n\n<li><strong>70\u03bcm (2oz)<\/strong>: High-current load paths (e.g., contact circuits, \u22655A) to reduce temperature rise.<\/li>\n\n\n\n<li><strong>Requisitos especiales<\/strong>: For high-current relays (&gt;10A), consider localized copper thickening (e.g., 105\u03bcm).<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Layout_and_Spacing_Specifications\"><\/span><strong>3.Especificaciones de disposici\u00f3n y espaciado<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Protecci\u00f3n contra interferencias electromagn\u00e9ticas (EMI)<\/strong>:<\/li>\n\n\n\n<li>Mantenga las bobinas de rel\u00e9 al menos <strong>5mm de distancia<\/strong> de componentes sensibles (por ejemplo, MCU, chips ADC).<\/li>\n\n\n\n<li>Mantener <strong>\u22652.5mm spacing<\/strong> entre los contactos de alta tensi\u00f3n y las trazas de control de baja tensi\u00f3n (250 V CA).<\/li>\n\n\n\n<li><strong>Gesti\u00f3n t\u00e9rmica<\/strong>:<\/li>\n\n\n\n<li>Evite la colocaci\u00f3n cerca de componentes que generen calor (por ejemplo, circuitos integrados de potencia, transformadores) o a\u00f1ada v\u00edas t\u00e9rmicas.<\/li>\n\n\n\n<li>For high-temperature environments (&gt;85\u00b0C), use heat-resistant relays (e.g., OMRON G5V series).<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Mounting_and_Mechanical_Protection\"><\/span><strong>4.Montaje y protecci\u00f3n mec\u00e1nica<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Proceso de soldadura<\/strong>:<\/li>\n\n\n\n<li><strong>Rel\u00e9s pasantes<\/strong>: Soldadura por ola o manual, garantizando juntas de soldadura completas y sin huecos.<\/li>\n\n\n\n<li><strong>Rel\u00e9s SMT<\/strong>: Reflow soldering temperature profile must match relay specifications (typically \u2264260\u00b0C).<\/li>\n\n\n\n<li><strong>Resistencia a las vibraciones<\/strong>:<\/li>\n\n\n\n<li>Orientar los rel\u00e9s de forma que <strong>las fuerzas de vibraci\u00f3n\/choque son perpendiculares al movimiento de la armadura<\/strong> (reduce los falsos disparos).<\/li>\n\n\n\n<li>Para entornos de altas vibraciones (por ejemplo, automoci\u00f3n), utilice rel\u00e9s con adhesivo amortiguador o muelles reforzados.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_Cleaning_and_Protection\"><\/span><strong>5.Limpieza y protecci\u00f3n<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Limpieza posterior a la soldadura<\/strong>:<\/li>\n\n\n\n<li>Utilice pasta de soldar sin limpiar o alcohol isoprop\u00edlico para eliminar los residuos de fundente, evitando la corrosi\u00f3n por contacto.<\/li>\n\n\n\n<li><strong>Revestimiento conforme<\/strong>:<\/li>\n\n\n\n<li>Aplique un revestimiento protector (por ejemplo, poliuretano) en entornos h\u00famedos\/contaminados para cubrir las patillas del rel\u00e9 y las trazas de la placa de circuito impreso.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Design_Pitfalls_and_Common_Mistakes\"><\/span><strong>Escollos de dise\u00f1o y errores comunes<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Error 1<\/strong>: Running high-voltage contacts parallel to signal traces \u2192 causes crosstalk.<br><strong>Soluci\u00f3n<\/strong>: Utiliza enrutamiento ortogonal o a\u00f1ade ranuras de aislamiento.<\/li>\n\n\n\n<li><strong>Error 2<\/strong>: Insufficient coil drive current \u2192 incomplete contact engagement.<br><strong>Soluci\u00f3n<\/strong>: Aseg\u00farese de que el circuito de accionamiento proporciona la tensi\u00f3n\/corriente nominal (por ejemplo, 5V\/20mA).<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Relay_Selection_Reference_Table\"><\/span><strong>Tabla de referencia de selecci\u00f3n de rel\u00e9s<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th><strong>Par\u00e1metro<\/strong><\/th><th><strong>Valor\/M\u00e9todo recomendado<\/strong><\/th><th><strong>Notas<\/strong><\/th><\/tr><\/thead><tbody><tr><td>Espesor de PCB<\/td><td>1,6 mm (agujero pasante)<\/td><td>Aumentar a 2,0 mm para altas vibraciones<\/td><\/tr><tr><td>Espesor del cobre<\/td><td>\u226570\u03bcm for contacts, 35\u03bcm for coil<\/td><td>Espesar las v\u00edas de alta corriente<\/td><\/tr><tr><td>Distancia bobina-contacto<\/td><td>\u22655mm (low voltage) or per rating<\/td><td>\u22652.5mm for 250V AC<\/td><\/tr><tr><td>Temperatura de soldadura<\/td><td>\u2264260\u00b0C (SMT)<\/td><td>Verificar la ficha t\u00e9cnica del rel\u00e9<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/PCB-Relay-2-1.jpg\" alt=\"Rel\u00e9 PCB\" class=\"wp-image-6719\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/PCB-Relay-2-1.jpg 600w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/PCB-Relay-2-1-300x201.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/PCB-Relay-2-1-150x101.jpg 150w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"PCB_Relay_Mounting_Techniques\"><\/span><strong>T\u00e9cnicas de montaje de rel\u00e9s en placas de circuito impreso<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"I_Soldering_Process_Specifications\"><\/span><strong>I. Especificaciones del proceso de soldadura<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>M\u00e9todos de soldadura<\/strong><\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Soldadura manual<\/strong>:\n<ul class=\"wp-block-list\">\n<li>Usa un 30-6<strong>Soldador 0W<\/strong> con una punta limpia.<\/li>\n\n\n\n<li>Mantener la temperatura de la punta a <strong>350\u00b0C max<\/strong> para evitar da\u00f1os t\u00e9rmicos.<\/li>\n\n\n\n<li>Soldar cada pin para <strong>\u22643 seconds<\/strong> para evitar el sobrecalentamiento.<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><strong>Soldadura automatizada<\/strong>:\n<ul class=\"wp-block-list\">\n<li><strong>Soldadura por ola<\/strong>:<\/li>\n\n\n\n<li>Ajuste la altura de la ola de soldadura para evitar el desbordamiento sobre la placa de circuito impreso.<\/li>\n\n\n\n<li>Perfil est\u00e1ndar: <strong>260\u00b0C (\u00b15\u00b0C) for 6 seconds<\/strong>.<\/li>\n\n\n\n<li><strong>Soldadura por reflujo (SMT)<\/strong>:<\/li>\n\n\n\n<li>Siga las curvas de temperatura espec\u00edficas del rel\u00e9 (normalmente pico <strong>\u2264260\u00b0C<\/strong>).<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Notas cr\u00edticas<\/strong><\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Placas de circuito impreso multicapa<\/strong>: Una mayor masa t\u00e9rmica puede requerir un precalentamiento prolongado para garantizar la correcta formaci\u00f3n de la uni\u00f3n soldada.<\/li>\n\n\n\n<li><strong>Aplicaci\u00f3n de fundentes<\/strong>: Utilice fundente no-clean para minimizar los residuos post-soldadura.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"II_Installation_Electrical_Connection\"><\/span><strong>II.Instalaci\u00f3n y humedad; conexi\u00f3n el\u00e9ctrica<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Tipos de montaje<\/strong><\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Agujero pasante (THT)<\/strong>:\n<ul class=\"wp-block-list\">\n<li>Las clavijas se insertan en los orificios taladrados y se sueldan en el lado opuesto.<\/li>\n\n\n\n<li>Proporciona una fuerte uni\u00f3n mec\u00e1nica para entornos de alta vibraci\u00f3n.<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><strong>Montaje en superficie (SMT)<\/strong>:\n<ul class=\"wp-block-list\">\n<li>Soldado por reflujo directamente en las pastillas; ideal para dise\u00f1os compactos.<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Normas de cableado<\/strong><\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Terminales de bobina<\/strong>: Conectar a las se\u00f1ales de control (por ejemplo, MCU GPIO) con resistencias limitadoras de corriente si es necesario.<\/li>\n\n\n\n<li><strong>Terminales de contacto<\/strong>:\n<ul class=\"wp-block-list\">\n<li><strong>NO\/NC\/COM<\/strong> clavijas conectadas en serie con circuitos de carga (motores, l\u00e1mparas).<\/li>\n\n\n\n<li>Aseg\u00farese de que la anchura de la traza soporta la corriente de carga (p. ej, <strong>70\u03bcm Cu for 5A+<\/strong>).<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Requisitos de aislamiento<\/strong><\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Mantener <strong>\u22652.5mm creepage distance<\/strong> entre la bobina y los contactos de alta tensi\u00f3n (250 V CA).<\/li>\n\n\n\n<li>Verificar la rigidez diel\u00e9ctrica (<strong>1kV+ aislamiento<\/strong>) entre los circuitos de control y de carga.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"III_Post-Installation_Steps\"><\/span><strong>III.Pasos posteriores a la instalaci\u00f3n<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Enfriar &amp; Limpieza<\/strong><\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Deje que la placa de circuito impreso se enfr\u00ede de forma natural; evite el enfriamiento forzado para evitar el estr\u00e9s t\u00e9rmico.<\/li>\n\n\n\n<li>Limpiar los residuos de flux con alcohol isoprop\u00edlico (IPA) si se utiliza flux no-no-clean.<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Inspecci\u00f3n y pruebas<\/strong><\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Control visual<\/strong>: Verifique que las juntas de soldadura est\u00e9n brillantes, c\u00f3ncavas y libres de puentes\/fisuras.<\/li>\n\n\n\n<li><strong>Prueba de continuidad<\/strong>: Utilice un mult\u00edmetro para confirmarlo:\n<ul class=\"wp-block-list\">\n<li>La resistencia de la bobina coincide con los valores de la hoja de datos.<\/li>\n\n\n\n<li>La continuidad de los contactos (estados NA\/NC) conmuta correctamente cuando est\u00e1n bajo tensi\u00f3n.<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n\n\n\n<h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"IV_Common_Pitfalls_Solutions\"><\/span><strong>IV.Errores comunes y soluciones<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th><strong>Edici\u00f3n<\/strong><\/th><th><strong>Causa<\/strong><\/th><th><strong>Soluci\u00f3n<\/strong><\/th><\/tr><\/thead><tbody><tr><td><strong>Puentes de soldadura<\/strong><\/td><td>Soldadura excesiva o desalineaci\u00f3n<\/td><td>Ajustar el grosor del est\u00e9ncil\/perfil de reflujo<\/td><\/tr><tr><td><strong>Rel\u00e9 sobrecalentado<\/strong><\/td><td>Tiempo de soldadura prolongado<\/td><td>Strictly limit soldering to \u22643s per pin<\/td><\/tr><tr><td><strong>Contacto intermitente<\/strong><\/td><td>Mala uni\u00f3n de soldadura o contaminaci\u00f3n<\/td><td>Reflow\/retrabajo con fundente nuevo<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/PCB-Relay-3.jpg\" alt=\"\" class=\"wp-image-6720\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/PCB-Relay-3.jpg 600w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/PCB-Relay-3-300x201.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/PCB-Relay-3-150x101.jpg 150w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Testing_PCB_Relays\"><\/span>Prueba de rel\u00e9s PCB<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>Cuando un rel\u00e9 no est\u00e1 excitado, NO y NC permanecen abiertos y cerrados, respectivamente. Se requiere un mult\u00edmetro para probar el rel\u00e9. Despu\u00e9s de eso, puede consultar los siguientes pasos para probar el rel\u00e9 PCB:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Tienes que poner el mult\u00edmetro en modo de comprobaci\u00f3n de continuidad.<\/li>\n\n\n\n<li>Tienes que comprobar la continuidad entre los contactos NC y los polos.<\/li>\n\n\n\n<li>Tienes que comprobar la discontinuidad entre los contactos normalmente abiertos y los polos.<\/li>\n\n\n\n<li>A continuaci\u00f3n, active el rel\u00e9 para activar la bobina. Se oir\u00e1 un chasquido. Esto se debe a que los contactos est\u00e1n cambiando de la posici\u00f3n Normalmente Cerrado (NC) a la posici\u00f3n Normalmente Abierto (NO) en respuesta al campo magn\u00e9tico.<\/li>\n\n\n\n<li>Deber\u00e1 comprobar la continuidad entre los contactos normalmente abiertos y los polos.<\/li>\n\n\n\n<li>Prueba de discontinuidad entre el contacto NC y el polo.<\/li>\n\n\n\n<li>Por \u00faltimo, mida la resistencia de la bobina con un mult\u00edmetro. Compruebe que coincide con la resistencia indicada en el rel\u00e9 del fabricante.<\/li>\n<\/ol>\n\n\n\n<p>Los rel\u00e9s PCB pueden utilizarse como sistema de protecci\u00f3n para todo un sistema de circuitos.Aunque de peque\u00f1o tama\u00f1o, son eficaces en la protecci\u00f3n de todo el sistema de los da\u00f1os y operan en el mismo principio que rel\u00e9s de tama\u00f1o est\u00e1ndar.dise\u00f1o de PCB requiere la plena consideraci\u00f3n de todos los aspectos de los rel\u00e9s PCB.<\/p>\n\n\n\n<p>\u00bfNecesita ayuda?P\u00f3ngase en contacto con nosotros en <a href=\"mailto:op@topfastpcb.com\">op@topfastpcb.com<\/a><br>\u00bfNecesita un presupuesto de PCB o PCBA? <a href=\"https:\/\/topfastpcba.com\/es\/contact\/\">Solicitar presupuesto<\/a>!<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Related_reading\"><\/span><strong>Lecturas relacionadas<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>1.<a href=\"https:\/\/topfastpcba.com\/es\/songle-spdt-miniature-pcb-mount-relay\/\">Songle Spdt Rel\u00e9 miniatura para montaje en circuito impreso<\/a><br>2.<a href=\"https:\/\/topfastpcba.com\/es\/12v-spdt-super-miniature-pcb-mount-relay\/\">Rel\u00e9 12v Spdt Super Miniatura para montaje en circuito impreso<\/a><br>3.<a href=\"https:\/\/topfastpcba.com\/es\/songle-spdt-5-pin-miniature-pcb-mount-relay\/\">Songle Spdt 5 Pin Rel\u00e9 miniatura para montaje en PCB<\/a><br>4.<a href=\"https:\/\/topfastpcba.com\/es\/5-pin-relay\/\">Rel\u00e9 de 5 contactos<\/a><br>5.<a href=\"https:\/\/topfastpcba.com\/es\/30-amp-relay\/\">Rel\u00e9 de 30 amperios<\/a><br>6.<a href=\"https:\/\/topfastpcba.com\/es\/voltage-sensing-relay\/\">Rel\u00e9 de detecci\u00f3n de tensi\u00f3n<\/a><\/p>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Aprenda todo sobre los rel\u00e9s PCB &#8211; c\u00f3mo funcionan, tipos (SPST, SPDT, DPST, DPDT), t\u00e9cnicas de montaje y mejores pr\u00e1cticas de dise\u00f1o.<\/p>","protected":false},"author":2,"featured_media":6716,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[52],"class_list":["post-6715","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry","tag-pcb"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.6 - 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