{"id":6489,"date":"2025-04-24T09:42:38","date_gmt":"2025-04-24T01:42:38","guid":{"rendered":"https:\/\/topfastpcba.com\/?p=6489"},"modified":"2025-10-22T17:17:06","modified_gmt":"2025-10-22T09:17:06","slug":"etched-fpc","status":"publish","type":"post","link":"https:\/\/topfastpcba.com\/es\/etched-fpc\/","title":{"rendered":"Grabado FPC"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_75 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">\u00cdndice<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/topfastpcba.com\/es\/etched-fpc\/#What_is_the_meaning_of_circuit_board_etching\" >\u00bfQu\u00e9 significa grabado de circuitos impresos?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/topfastpcba.com\/es\/etched-fpc\/#What_is_circuit_board_etching\" >\u00bfQu\u00e9 es el grabado de circuitos impresos?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/topfastpcba.com\/es\/etched-fpc\/#Circuit_board_etching_principle\" >Principio de grabado de circuitos impresos<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/topfastpcba.com\/es\/etched-fpc\/#1_Basic_Principle_of_Etching\" >1. Principio b\u00e1sico del grabado<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/topfastpcba.com\/es\/etched-fpc\/#2_Classification_of_Etching_Processes\" >2.Clasificaci\u00f3n de los procesos de grabado<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/topfastpcba.com\/es\/etched-fpc\/#3_Process_Flow\" >3.Flujo del proceso<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/topfastpcba.com\/es\/etched-fpc\/#4_Key_Control_Factors\" >4.Factores clave de control<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/topfastpcba.com\/es\/etched-fpc\/#The_influencing_factors_of_etching_are_as_follows\" >Los factores que influyen en el grabado son los siguientes:<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/topfastpcba.com\/es\/etched-fpc\/#Etching_Application_Scope\" >\u00c1mbito de aplicaci\u00f3n del grabado<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_is_the_meaning_of_circuit_board_etching\"><\/span>\u00bfQu\u00e9 significa grabado de circuitos impresos?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>Placas de circuito de la placa para mostrar el proceso de gr\u00e1ficos de circuito es m\u00e1s complejo, la corriente <a href=\"https:\/\/topfastpcba.com\/es\/pcba-production-process\/\">procesamiento de placas de circuito impreso (PCB)<\/a> of the typical process using the \u201cgraphic plating method\u201d, that is, first in the outer layer of the circuit board to be retained on the part of the copper foil, that is, the circuit of the graphic part of a layer of lead and tin pre-plated on the corrosion-resistant layer, and then chemically corroded off the rest of the copper foil, called the Etching.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_is_circuit_board_etching\"><\/span>\u00bfQu\u00e9 es el grabado de circuitos impresos?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>El m\u00e9todo de grabado utiliza la soluci\u00f3n de grabado fuera de las l\u00edneas conductoras del m\u00e9todo de eliminaci\u00f3n de la l\u00e1mina de cobre, el m\u00e9todo de grabado utiliza la m\u00e1quina de grabado fuera de las l\u00edneas conductoras del m\u00e9todo de eliminaci\u00f3n de la l\u00e1mina de cobre; el primero es un m\u00e9todo qu\u00edmico, m\u00e1s com\u00fan, el segundo es un m\u00e9todo f\u00edsico. El m\u00e9todo de grabado de placas de circuitos es un m\u00e9todo de corrosi\u00f3n qu\u00edmica que utiliza \u00e1cido sulf\u00farico concentrado para corroer el revestimiento de cobre no deseado de las placas de circuitos. El m\u00e9todo de grabado utiliza m\u00e9todos f\u00edsicos, con una m\u00e1quina de grabado especializada, y el cabezal de corte graba la placa revestida de cobre para formar un m\u00e9todo de alineaci\u00f3n de circuitos.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Circuit_board_etching_principle\"><\/span>Principio de grabado de circuitos impresos<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>El principio del grabado de placas de circuito impreso es la eliminaci\u00f3n selectiva de la l\u00e1mina de cobre no deseada de la capa revestida de cobre mediante m\u00e9todos qu\u00edmicos o f\u00edsicos, preservando el patr\u00f3n del circuito dise\u00f1ado.El n\u00facleo del proceso reside en las reacciones redox.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Basic_Principle_of_Etching\"><\/span>1. <strong>Principio b\u00e1sico del grabado<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>El grabado implica el uso de una soluci\u00f3n qu\u00edmica (grabador) para disolver las \u00e1reas de l\u00e1mina de cobre sin protecci\u00f3n mediante reacciones redox, formando el patr\u00f3n de circuito deseado. Las reacciones clave son:<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"714\" height=\"272\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/\u516c\u5f0f.jpg\" alt=\"\" class=\"wp-image-6493\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/\u516c\u5f0f.jpg 714w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/\u516c\u5f0f-300x114.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/\u516c\u5f0f-150x57.jpg 150w\" sizes=\"auto, (max-width: 714px) 100vw, 714px\" \/><\/figure>\n<\/div>\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Classification_of_Etching_Processes\"><\/span>2. <strong>Clasificaci\u00f3n de los procesos de grabado<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Aguafuerte h\u00famedo<\/strong>: Utiliza soluciones qu\u00edmicas, de tipo \u00e1cido (cloruro de cobre) y alcalino (amon\u00edaco), adecuadas para circuitos de alta precisi\u00f3n.<\/li>\n\n\n\n<li><strong>Grabado en seco<\/strong>: Se basa en el impacto f\u00edsico (por ejemplo, plasma) para eliminar material, se utiliza principalmente en la fabricaci\u00f3n de semiconductores.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Process_Flow\"><\/span>3. <strong>Flujo de procesos<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Transferencia de patrones<\/strong>El dise\u00f1o del circuito se transfiere a la placa revestida de cobre mediante exposici\u00f3n\/desarrollo o serigraf\u00eda, formando una capa de resistencia para proteger el patr\u00f3n deseado.<\/li>\n\n\n\n<li><strong>Grabado<\/strong>La placa se sumerge o se roc\u00eda con agente grabador para eliminar el cobre desprotegido.<\/li>\n\n\n\n<li><strong>Tratamiento posterior<\/strong>El decapado y la limpieza de las resistencias dan como resultado el circuito final.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Key_Control_Factors\"><\/span>4. <strong>Factores clave del control<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Tasa de grabado<\/strong>: Affected by solution concentration, temperature (typically 45\u00b15\u00b0C), and flow rate.<\/li>\n\n\n\n<li><strong>Control de socavones<\/strong>: Un tiempo de grabado excesivo provoca una socavaci\u00f3n; los par\u00e1metros deben optimizarse para mejorar el factor de grabado (relaci\u00f3n entre la profundidad de grabado y la anchura de la socavaci\u00f3n).<\/li>\n\n\n\n<li><strong>Soluci\u00f3n Mantenimiento<\/strong>: La reposici\u00f3n regular de oxidantes (por ejemplo, \u00e1cido clorh\u00eddrico) garantiza la eficacia de la reacci\u00f3n.<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"979\" height=\"641\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Etched-FPC.jpg\" alt=\"\" class=\"wp-image-6491\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Etched-FPC.jpg 979w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Etched-FPC-300x196.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Etched-FPC-768x503.jpg 768w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Etched-FPC-150x98.jpg 150w\" sizes=\"auto, (max-width: 979px) 100vw, 979px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"The_influencing_factors_of_etching_are_as_follows\"><\/span>Los factores que influyen en el grabado son los siguientes:<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>M\u00e9todo de grabado<\/strong><br>El grabado por inmersi\u00f3n y burbuja causar\u00e1 mayor corrosi\u00f3n lateral, el grabado por salpicadura y pulverizaci\u00f3n la corrosi\u00f3n lateral es menor, especialmente el grabado por pulverizaci\u00f3n los mejores resultados.<\/li>\n\n\n\n<li><strong>El tipo de soluci\u00f3n de grabado<\/strong><br>Diferentes componentes qu\u00edmicos de diferentes soluciones de grabado, sus tasas de grabado es diferente, y el coeficiente de grabado tambi\u00e9n es diferente. Por ejemplo, el coeficiente de grabado de la soluci\u00f3n de grabado de cloruro de cobre \u00e1cido suele ser 3, el coeficiente de grabado de la soluci\u00f3n de grabado de cloruro de cobre alcalino puede llegar a 4. Estudios recientes han demostrado que el sistema de mordentado a base de \u00e1cido n\u00edtrico puede conseguir un mordentado lateral casi nulo para conseguir el mordentado de las paredes laterales de la l\u00ednea cercanas a la vertical.<\/li>\n\n\n\n<li><strong>Velocidad de grabado<\/strong><br>La velocidad de grabado es lenta causar\u00e1 corrosi\u00f3n lateral grave, y la mejora de la calidad de grabado y la velocidad de grabado tienen mucho que ver con la aceleraci\u00f3n. Cuanto m\u00e1s r\u00e1pida sea la velocidad de grabado, la placa permanecer\u00e1 en la soluci\u00f3n de grabado durante menos tiempo, menor ser\u00e1 la cantidad de corrosi\u00f3n lateral y el grabado de los gr\u00e1ficos ser\u00e1 m\u00e1s claro y n\u00edtido.<\/li>\n\n\n\n<li><strong>El valor de pH de la soluci\u00f3n de grabado<\/strong><br>El valor del PH de la soluci\u00f3n de grabado alcalina es m\u00e1s alto y aumenta la corrosi\u00f3n lateral. Para reducir la corrosi\u00f3n lateral, el valor general del PH debe controlarse por debajo de 8,5.<\/li>\n\n\n\n<li><strong>Densidad de la soluci\u00f3n de grabado<\/strong><br>La densidad de la soluci\u00f3n alcalina de grabado es demasiado baja agravar\u00e1 la corrosi\u00f3n lateral; la elecci\u00f3n de una alta concentraci\u00f3n de cobre de la soluci\u00f3n de grabado para reducir la corrosi\u00f3n lateral es favorable.<\/li>\n\n\n\n<li><strong>Espesor de la l\u00e1mina de cobre<\/strong><br>Para conseguir la m\u00ednima corrosi\u00f3n lateral del grabado de alambre fino, lo mejor es utilizar una l\u00e1mina de cobre (super) fina. Cuanto menor sea la anchura del alambre, menor debe ser el grosor de la l\u00e1mina de cobre. Cuanto m\u00e1s fina sea la l\u00e1mina de cobre, menor ser\u00e1 la corrosi\u00f3n lateral.<br>Con la creciente demanda de miniaturizaci\u00f3n y alto rendimiento en los productos electr\u00f3nicos, las placas de circuito impreso multicapa se han convertido en la opci\u00f3n dominante en el mercado en virtud de la mayor integraci\u00f3n, integridad de la se\u00f1al y rendimiento de disipaci\u00f3n t\u00e9rmica que ofrecen.<\/li>\n<\/ol>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Etching_Application_Scope\"><\/span>\u00c1mbito de aplicaci\u00f3n del grabado<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>Aplicaciones: Se utiliza principalmente en la fabricaci\u00f3n de placas de circuito impreso (placas de una capa y de varias capas), dispositivos semiconductores, etc.<br>Reto: Necesidad de equilibrar la precisi\u00f3n y la eficacia del grabado, para evitar el cobre residual o el grabado excesivo causado por los defectos del circuito.<br>A trav\u00e9s de los principios y procesos mencionados, la tecnolog\u00eda de grabado realiza el procesamiento gr\u00e1fico de circuitos de alta precisi\u00f3n de los dispositivos electr\u00f3nicos, que es uno de los procesos centrales de la industria electr\u00f3nica moderna.<\/p>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>el circuito de la parte gr\u00e1fica de una capa de plomo y esta\u00f1o pre-plateado en la capa resistente a la corrosi\u00f3n, y luego corro\u00eddo qu\u00edmicamente fuera del resto de la l\u00e1mina de cobre, llamado el grabado.<\/p>","protected":false},"author":2,"featured_media":6490,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[71],"class_list":["post-6489","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry","tag-fpc"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.6 - 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