{"id":1517,"date":"2025-04-19T09:28:00","date_gmt":"2025-04-19T01:28:00","guid":{"rendered":"https:\/\/topfastpcba.com\/?p=1517"},"modified":"2025-04-18T17:33:01","modified_gmt":"2025-04-18T09:33:01","slug":"pcb-pcba-common-technical-terms","status":"publish","type":"post","link":"https:\/\/topfastpcba.com\/es\/pcb-pcba-common-technical-terms\/","title":{"rendered":"T\u00e9rminos t\u00e9cnicos comunes de PCB\/PCBA"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_75 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">\u00cdndice<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/topfastpcba.com\/es\/pcb-pcba-common-technical-terms\/#Here_are_the_translations_of_the_8_PCB_professional_terms\" >He aqu\u00ed las traducciones de los 8 t\u00e9rminos profesionales del PCB:<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/topfastpcba.com\/es\/pcb-pcba-common-technical-terms\/#PCBA_Processing_%E2%80%93_30_Key_Terms\" >PCBA Processing \u2013 30 Key Terms<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Here_are_the_translations_of_the_8_PCB_professional_terms\"><\/span>He aqu\u00ed las traducciones de los 8 t\u00e9rminos profesionales del PCB:<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>01 <strong>Panel (matriz)<\/strong><br>Algunos fabricantes de placas de circuito impreso denominan a las matrices &#8220;Paneles.&#8221; Los paneles se dividen en <strong>paneles de env\u00edo<\/strong> and <strong>paneles de trabajo<\/strong>. A <strong>panel de env\u00edo<\/strong> se refiere a las placas de circuito impreso dispuestas para su env\u00edo, normalmente dise\u00f1adas para cumplir los requisitos de producci\u00f3n de PCBA, y a veces se denomina &#8220;conjunto.&#8221; A <strong>panel de trabajo<\/strong> se refiere a la matriz de producci\u00f3n, que contiene m\u00faltiples paneles de env\u00edo. Las placas de circuito impreso se fabrican como paneles de trabajo y posteriormente se separan en paneles de env\u00edo.<br>02 <strong>\u00d3xido negro \/ \u00d3xido marr\u00f3n<\/strong><br>Se trata de un proceso qu\u00edmico que forma una capa uniforme y difusa en la superficie del cobre. Esta capa aumenta el \u00e1rea de contacto entre el cobre y el preimpregnado (PP), mejorando la adherencia.<br>La finalidad del \u00f3xido negro y del \u00f3xido marr\u00f3n es la misma, pero difieren en la longitud de la pelusa, el coste qu\u00edmico y la dificultad del proceso.El \u00f3xido negro proporciona una mayor adherencia que el \u00f3xido marr\u00f3n, pero es m\u00e1s caro y dif\u00edcil de manejar. Adem\u00e1s, el \u00f3xido negro es m\u00e1s propenso a los defectos de &#8220;pink ring&#8221;. En la actualidad, la mayor\u00eda de los fabricantes utilizan el proceso de \u00f3xido marr\u00f3n.<br>03 <strong>Laminaci\u00f3n<\/strong><br>Los PCB multicapa requieren el apilamiento de varios n\u00facleos, capas de PP y l\u00e1minas de cobre, que luego se unen entre s\u00ed a alta temperatura y presi\u00f3n.Con el calor, el PP se vuelve viscoso y fluye bajo presi\u00f3n, rellenando los huecos grabados en las capas interiores de cobre.<br>04 <strong>Varios tipos de agujeros<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>PTH (agujero pasante chapado)<\/strong>: Un agujero metalizado y revestido de cobre.<\/li>\n\n\n\n<li><strong>NPTH (Agujero pasante no plateado)<\/strong>: Orificio no cobreado ni metalizado.<\/li>\n\n\n\n<li><strong>Via<\/strong>Peque\u00f1o orificio revestido de cobre que sirve \u00fanicamente para la conducci\u00f3n el\u00e9ctrica.<\/li>\n\n\n\n<li><strong>Agujero ciego<\/strong>: Agujero que parte de la capa superior o inferior pero que no atraviesa toda la placa (visible por un lado).<\/li>\n\n\n\n<li><strong>Enterrado V\u00eda<\/strong>: Orificio que conecta las capas internas de la placa de circuito impreso sin llegar a las capas externas de cobre (invisible desde el exterior).<\/li>\n\n\n\n<li><strong>Agujero HDI (interconexi\u00f3n de alta densidad)<\/strong>: Microagujeros ciegos formados mediante perforaci\u00f3n l\u00e1ser.<br>05 <strong>Deposici\u00f3n qu\u00edmica de cobre (Cobreado qu\u00edmico)<\/strong><br>Tambi\u00e9n conocido como cobreado qu\u00edmico, este proceso implica una reacci\u00f3n de oxidaci\u00f3n-reducci\u00f3n en la superficie del sustrato para formar una fina capa de cobre que permite las conexiones el\u00e9ctricas entre capas y facilita el posterior cobreado.<br>06 <strong>M\u00e1scara de soldadura<\/strong><br>La m\u00e1scara de soldadura, tambi\u00e9n llamada resistencia a la soldadura, es una capa de tinta que se aplica a la superficie de la placa de circuito impreso para evitar cortocircuitos por soldadura.<br>La tinta de la m\u00e1scara de soldadura es muy com\u00fan en las placas de circuito impreso, y alrededor del 90% es verde. Sin embargo, tambi\u00e9n hay otros colores disponibles, como rojo, azul, negro, blanco y amarillo.<br>Las funciones de la m\u00e1scara de soldadura incluyen:<\/li>\n\n\n\n<li>Prevenci\u00f3n de la soldadura incorrecta de componentes.<\/li>\n\n\n\n<li>Prevenci\u00f3n de puentes de soldadura.<\/li>\n\n\n\n<li>Proporcionar protecci\u00f3n (la capa de pol\u00edmero cubre las trazas met\u00e1licas, ofreciendo resistencia a la niebla salina, la humedad, etc.).<br>07 <strong>Acabado superficial<\/strong><br>El cobre desnudo tiene buena soldabilidad, pero tiende a oxidarse cuando se expone al aire durante largos periodos. Por ello, se aplica un tratamiento superficial para garantizar una buena soldabilidad o rendimiento el\u00e9ctrico.<br>Los acabados superficiales m\u00e1s comunes son:<\/li>\n\n\n\n<li>HASL (nivelaci\u00f3n de soldadura por aire caliente)<\/li>\n\n\n\n<li>ENIG (n\u00edquel qu\u00edmico por inmersi\u00f3n en oro)<\/li>\n\n\n\n<li>OSP (Conservante org\u00e1nico de soldabilidad)<\/li>\n\n\n\n<li>Lata de inmersi\u00f3n<\/li>\n\n\n\n<li>Inmersi\u00f3n Plata<\/li>\n\n\n\n<li>Oro galv\u00e1nico<\/li>\n\n\n\n<li>Dedos de oro galvanizado<br>08 <strong>V-CUT<\/strong><br>El corte en V es un m\u00e9todo habitual para separar las placas de circuito impreso en unidades individuales y eliminar los bordes sobrantes. El <strong>espesor restante<\/strong> after V-CUT refers to the thickness left after the upper and lower blades cut the PCB. This thickness must be neither too thick nor too thin\u2014if too thick, separation is difficult and causes high stress; if too thin, the board lacks support and may break during production. Common V-CUT angles are 30\u00b0, 45\u00b0, and 60\u00b0.<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"800\" height=\"800\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Medical-Equipment-PCBA.jpg\" alt=\"\" class=\"wp-image-1518\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Medical-Equipment-PCBA.jpg 800w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Medical-Equipment-PCBA-300x300.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Medical-Equipment-PCBA-150x150.jpg 150w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Medical-Equipment-PCBA-768x768.jpg 768w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/04\/Medical-Equipment-PCBA-400x400.jpg 400w\" sizes=\"auto, (max-width: 800px) 100vw, 800px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"PCBA_Processing_%E2%80%93_30_Key_Terms\"><\/span><strong>PCBA Processing \u2013 30 Key Terms<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>En la fabricaci\u00f3n de productos electr\u00f3nicos, <strong><a href=\"https:\/\/topfastpcba.com\/es\/pcb-assembly\/\">PCBA<\/a> (Montaje de circuitos impresos)<\/strong> es un proceso complejo y preciso en el que intervienen numerosos t\u00e9rminos t\u00e9cnicos y tecnolog\u00edas b\u00e1sicas.<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>PCBA<\/strong> \u2013 Short for <em>Montaje de circuitos impresos<\/em>que se refiere a todo el proceso de fabricaci\u00f3n de placas de circuito impreso, incluyendo <strong>Montaje SMT, inserci\u00f3n de DIP, pruebas funcionales y montaje final<\/strong>.<\/li>\n\n\n\n<li><strong>PCB<\/strong> \u2013 Short for <em>Placa de circuito impreso<\/em>, normalmente se refiere a placas de circuitos, que pueden ser <strong>una cara, doble cara o multicapa<\/strong>fabricados con materiales como <strong>FR-4, resina, fibra de vidrio o sustratos de aluminio<\/strong>.<\/li>\n\n\n\n<li><strong>Archivo Gerber<\/strong> \u2013 A set of files describing PCB images (circuit layers, solder mask, silkscreen, etc.) along with drilling and milling data, required for PCBA quotations.<\/li>\n\n\n\n<li><strong>Lista de materiales<\/strong> \u2013 A list of all components used in PCBA, including quantities and process routes, serving as a key reference for procurement.<\/li>\n\n\n\n<li><strong>SMT (Tecnolog\u00eda de montaje en superficie)<\/strong> \u2013 A process involving <strong>impresi\u00f3n de pasta de soldadura, colocaci\u00f3n de componentes y soldadura por reflujo<\/strong> en PCB.<\/li>\n\n\n\n<li><strong>Impresi\u00f3n de pasta de soldadura<\/strong> \u2013 Depositing solder paste through a stencil onto PCB pads using a squeegee blade.<\/li>\n\n\n\n<li><strong>SPI (Inspecci\u00f3n de pasta de soldadura)<\/strong> \u2013 A machine that checks solder paste thickness and printing quality post-application.<\/li>\n\n\n\n<li><strong>Soldadura reflow<\/strong> \u2013 Heating PCBs in a reflow oven to melt solder paste, forming solid solder joints upon cooling.<\/li>\n\n\n\n<li><strong>AOI (inspecci\u00f3n \u00f3ptica automatizada)<\/strong> \u2013 A scanning system that detects soldering defects by comparing PCB images to standards.<\/li>\n\n\n\n<li><strong>DIP (encapsulado doble en l\u00ednea)<\/strong> \u2013 A process where <strong>componentes pasantes<\/strong> se insertan en placas de circuito impreso, seguidas de <strong>soldadura por ola, recorte de patillas, retoque y limpieza<\/strong>.<\/li>\n\n\n\n<li><strong>Soldadura por ola<\/strong> \u2013 Passing PCBs over a molten solder wave to solder through-hole components.<\/li>\n\n\n\n<li><strong>Recorte de pasadores<\/strong> \u2013 Cutting excess component leads after soldering for proper sizing.<\/li>\n\n\n\n<li><strong>Retoques (Rework)<\/strong> \u2013 Repairing incomplete or defective solder joints manually.<\/li>\n\n\n\n<li><strong>Limpieza del tablero<\/strong> \u2013 Removing flux residues and contaminants to meet environmental and cleanliness standards.<\/li>\n\n\n\n<li><strong>Revestimiento conforme<\/strong> \u2013 Applying a protective layer (e.g., acrylic, silicone) to PCBA for <strong>aislamiento, resistencia a la humedad y prevenci\u00f3n de la corrosi\u00f3n<\/strong>.<\/li>\n\n\n\n<li><strong>Pads (Patrones de tierra)<\/strong> \u2013 Exposed copper areas on PCBs for component soldering.<\/li>\n\n\n\n<li><strong>Embalaje de componentes<\/strong> \u2013 The physical form of components, mainly <strong>DIP (agujero pasante) y SMD (montaje en superficie)<\/strong>.<\/li>\n\n\n\n<li><strong>Paso (distancia entre hileras)<\/strong> \u2013 The distance between adjacent component leads\/terminals.<\/li>\n\n\n\n<li><strong>QFP (encapsulado plano cu\u00e1druple)<\/strong> \u2013 A surface-mount IC with gull-wing leads on all four sides.<\/li>\n\n\n\n<li><strong>BGA (matriz de bolas)<\/strong> \u2013 An IC package with solder balls arranged in a grid on its underside.<\/li>\n\n\n\n<li><strong>Garant\u00eda de calidad<\/strong> \u2013 Ensures product quality through inspections and testing.<\/li>\n\n\n\n<li><strong>FCT (Prueba de Circuito Funcional)<\/strong> \u2013 Simulates real-world operation to verify PCBA functionality.<\/li>\n\n\n\n<li><strong>Pruebas de rodaje<\/strong> \u2013 Stress-testing PCBAs under extreme conditions to identify early failures.<\/li>\n\n\n\n<li><strong>Pruebas de vibraci\u00f3n<\/strong> \u2013 Assessing PCBA durability against mechanical vibrations during use\/transport.<\/li>\n\n\n\n<li><strong>IQC (Control de calidad entrante)<\/strong> \u2013 Inspects raw materials\/components upon receipt.<\/li>\n\n\n\n<li><strong>M\u00e1scara de soldadura<\/strong> \u2013 A laser-cut metal sheet for precise solder paste deposition.<\/li>\n\n\n\n<li><strong>Fijaci\u00f3n (plantilla)<\/strong> \u2013 A tool for batch production, including <strong>ensamblaje, pruebas y dispositivos de prueba de PCB<\/strong>.<\/li>\n\n\n\n<li><strong>Agujero pasante chapado (PTH)<\/strong> \u2013 Copper-plated holes for interlayer connections\/signal transmission.<\/li>\n\n\n\n<li><strong>M\u00e1scara de soldadura<\/strong> \u2013 A protective layer over copper traces to prevent shorts\/corrosion.<\/li>\n\n\n\n<li><strong>SMD (dispositivo de montaje superficial)<\/strong> \u2013 Components mounted directly onto PCBs without leads, the dominant assembly method today.<\/li>\n<\/ol>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Here\u2019s the translation of the **30 PCBA (Printed Circuit Board Assembly) processing terms** in the electronics manufacturing industry<\/p>","protected":false},"author":2,"featured_media":1075,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[],"class_list":["post-1517","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.6 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB\/PCBA common technical terms - Topfastpcba<\/title>\n<meta name=\"description\" content=\"Here\u2019s the translation of the **30 PCBA (Printed Circuit Board Assembly) processing terms** in the electronics manufacturing industry\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/topfastpcba.com\/es\/pcb-pcba-common-technical-terms\/\" \/>\n<meta property=\"og:locale\" content=\"es_ES\" \/>\n<meta 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