{"id":8656,"date":"2026-06-10T08:31:00","date_gmt":"2026-06-10T00:31:00","guid":{"rendered":"https:\/\/topfastpcba.com\/?p=8656"},"modified":"2026-06-03T11:01:36","modified_gmt":"2026-06-03T03:01:36","slug":"pcb-via-failure-analysis","status":"publish","type":"post","link":"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/","title":{"rendered":"Fehleranalyse bei Leiterplatten-Durchkontaktierungen: Ursachen, Pr\u00fcfverfahren und Pr\u00e4vention"},"content":{"rendered":"<p class=\"wp-block-paragraph\">In der modernen Elektronik geh\u00f6ren Durchkontaktierungen zu den wichtigsten Strukturen auf einer Leiterplatte.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Ob zur Verbindung von Stromebenen, Signalschichten oder Erdungsnetzen \u2013 Durchkontaktierungen bilden die elektrischen Leitwege, die die Funktionalit\u00e4t mehrschichtiger Leiterplatten erm\u00f6glichen.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Wenn eine Durchkontaktierung ausf\u00e4llt, kann die Ursache schwer zu diagnostizieren sein. Im Gegensatz zu offensichtlichen Bauteilausf\u00e4llen verursachen Defekte an Durchkontaktierungen oft sporadische Probleme, die nur bei Temperaturschwankungen, Vibrationen oder im Langzeitbetrieb auftreten.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Das Verst\u00e4ndnis der Ausfallmechanismen ist f\u00fcr die Verbesserung der Zuverl\u00e4ssigkeit von Leiterplatten von entscheidender Bedeutung, insbesondere in Anwendungen der Automobil-, Industrie-, Luft- und Raumfahrt- sowie der Leistungselektronik.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"339\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2026\/06\/PCB-via.jpg\" alt=\"PCB-Durchkontaktierung\" class=\"wp-image-8657\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2026\/06\/PCB-via.jpg 600w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2026\/06\/PCB-via-300x170.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2026\/06\/PCB-via-18x10.jpg 18w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2026\/06\/PCB-via-150x85.jpg 150w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_75 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Inhalts\u00fcbersicht<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#What_Is_a_PCB_Via\" >Was ist eine Durchkontaktierung auf einer Leiterplatte?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Why_Via_Reliability_Matters\" >Warum die Zuverl\u00e4ssigkeit von Via wichtig ist<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Common_PCB_Via_Failure_Mechanisms\" >H\u00e4ufige Ursachen f\u00fcr Ausf\u00e4lle von Leiterplatten-Durchkontaktierungen<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Barrel_Cracking\" >Fassspalten<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Corner_Cracking\" >Eckenrisse<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Via_Separation\" >\u00dcber die Trennung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Plating_Voids\" >Beschichtungsfehler<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Microvia_Failure\" >Ausfall von Microvias<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Root_Causes_of_PCB_Via_Failures\" >Grundursachen f\u00fcr Ausf\u00e4lle von PCB-Durchkontaktierungen<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Thermal_Expansion_Mismatch\" >Unterschiedliche W\u00e4rmeausdehnung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Excessive_Assembly_Temperatures\" >Zu hohe Montagetemperaturen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Insufficient_Copper_Thickness\" >Unzureichende Kupferdicke<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Poor_PCB_Material_Quality\" >Mangelhafte Qualit\u00e4t des Leiterplattenmaterials<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Improper_PCB_Design\" >Fehlerhaftes Leiterplatten-Design<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#How_to_Detect_PCB_Via_Failures\" >So erkennen Sie Fehler an Leiterplatten-Vias<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Cross-Section_Analysis\" >Querschnittsanalyse<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Microsection_Testing\" >Mikroschnittuntersuchung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#X-Ray_Inspection\" >R\u00f6ntgenpr\u00fcfung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Thermal_Stress_Testing\" >Thermische Belastungspr\u00fcfung<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#How_to_Prevent_PCB_Via_Failures\" >So beugen Sie Ausf\u00e4llen bei Leiterplatten-Durchkontaktierungen vor<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Improve_Hole_Wall_Preparation\" >Verbesserung der Bohrlochwandvorbereitung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Increase_Copper_Plating_Quality\" >Verbesserung der Qualit\u00e4t der Verkupferung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-23\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Optimize_PCB_Stackup_Design\" >Optimierung des Leiterplatten-Schichtaufbaus<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-24\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Select_Appropriate_Materials\" >W\u00e4hlen Sie geeignete Materialien aus<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-25\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Conduct_Reliability_Testing\" >Zuverl\u00e4ssigkeitspr\u00fcfungen durchf\u00fchren<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-26\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Industries_Most_Affected_by_Via_Failures\" >Branchen, die am st\u00e4rksten von Durchkontaktierungsfehlern betroffen sind<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-27\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Automotive_Electronics\" >Kfz-Elektronik<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-28\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Telecommunications_Equipment\" >Telekommunikationsger\u00e4te<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-29\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Power_Electronics\" >Leistungselektronik<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-30\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Aerospace_and_Defense\" >Luft- und Raumfahrt und Verteidigung<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-31\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#FAQ\" >FAQ<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-32\" href=\"https:\/\/topfastpcba.com\/de\/pcb-via-failure-analysis\/#Conclusion\" >Schlussfolgerung<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_Is_a_PCB_Via\"><\/span>Was ist eine Durchkontaktierung auf einer Leiterplatte?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Eine Durchkontaktierung ist ein metallisiertes Loch, das verschiedene Schichten einer Leiterplatte elektrisch miteinander verbindet.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Zu den g\u00e4ngigen Arten von Durchf\u00fchrungen geh\u00f6ren:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Durchkontaktierungen<\/li>\n\n\n\n<li>Blinde Durchkontaktierungen<\/li>\n\n\n\n<li>Vergrabene Durchkontaktierungen<\/li>\n\n\n\n<li>Mikrobohrungen<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Diese Strukturen erm\u00f6glichen die \u00dcbertragung von Signalen und Strom zwischen den Schichten und erm\u00f6glichen gleichzeitig immer komplexere Leiterplattenkonstruktionen.<\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p class=\"wp-block-paragraph\">Weiterf\u00fchrende Literatur: <a href=\"https:\/\/topfastpcba.com\/de\/hdi-pcb\/\">Leitfaden zur HDI-Leiterplattentechnologie<\/a><\/p>\n<\/blockquote>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Why_Via_Reliability_Matters\"><\/span>Warum die Zuverl\u00e4ssigkeit von Via wichtig ist<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Moderne elektronische Systeme k\u00f6nnen Tausende von Durchkontaktierungen enthalten.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Ein einziges defektes Durchkontaktierungsloch kann folgende Probleme verursachen:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Offene Stromkreise<\/li>\n\n\n\n<li>L\u00fcckenhafte elektrische Verbindungen<\/li>\n\n\n\n<li>Kommunikationsst\u00f6rungen<\/li>\n\n\n\n<li>Stromausf\u00e4lle<\/li>\n\n\n\n<li>Vollst\u00e4ndiger Ausfall des Produkts<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Mit zunehmender Schichtenanzahl wird die Zuverl\u00e4ssigkeit der Durchkontaktierungen zu einem der wichtigsten Faktoren, die die Lebensdauer von Leiterplatten beeinflussen.<\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p class=\"wp-block-paragraph\">Interner Link: <a href=\"https:\/\/topfastpcba.com\/de\/multilayer-pcb-supplier\/\">Anbieter von Mehrschicht-Leiterplatten<\/a><\/p>\n<\/blockquote>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Common_PCB_Via_Failure_Mechanisms\"><\/span>H\u00e4ufige Ursachen f\u00fcr Ausf\u00e4lle von Leiterplatten-Durchkontaktierungen<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Barrel_Cracking\"><\/span>Fassspalten<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Risse im Lauf geh\u00f6ren zu den am h\u00e4ufigsten auftretenden Defekten.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Die Kupferbeschichtung an der Innenwand der Bohrung weist aufgrund mechanischer oder thermischer Beanspruchung Risse auf.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Zu den h\u00e4ufigsten Ursachen geh\u00f6ren:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Thermisches Zyklieren<\/li>\n\n\n\n<li>\u00dcberm\u00e4\u00dfige Ausdehnung der Z-Achse<\/li>\n\n\n\n<li>Unzureichende Schichtdicke<\/li>\n\n\n\n<li>Materialinkompatibilit\u00e4t<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Risse im Bohrloch treten h\u00e4ufig erst nach langj\u00e4hrigem Einsatz im Feld auf und nicht unmittelbar nach der F\u00f6rderung.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Corner_Cracking\"><\/span>Eckenrisse<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">An den Stellen, an denen der Durchkontaktierungszylinder auf die inneren Kupferpads trifft, kommt es zu Rissen in den Ecken.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">An diesen Stellen entstehen Spannungskonzentrationen w\u00e4hrend:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Reflow-L\u00f6ten<\/li>\n\n\n\n<li>Thermoschock<\/li>\n\n\n\n<li>Aus- und Wiedereinschalten<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Wiederholtes Ausdehnen und Zusammenziehen f\u00fchrt schlie\u00dflich zu einer Erm\u00fcdung des Kupfers.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Via_Separation\"><\/span>\u00dcber die Trennung<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Eine Via-Trennung tritt auf, wenn das plattierte Kupfer den Kontakt zum Pad der inneren Schicht verliert.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">M\u00f6gliche Ursachen sind:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Mangelhafte Bohrqualit\u00e4t<\/li>\n\n\n\n<li>Fehlerhafte Registrierung<\/li>\n\n\n\n<li>Unzureichende Beschichtung<\/li>\n\n\n\n<li>Laminierungsfehler<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Dieser Fehler f\u00fchrt h\u00e4ufig zu unregelm\u00e4\u00dfigen elektrischen St\u00f6rungen.<\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p class=\"wp-block-paragraph\">Weiterf\u00fchrende Literatur: <a href=\"https:\/\/topfastpcba.com\/de\/pcb-delamination-causes\/\">Ursachen und Vorbeugung von Delamination bei Leiterplatten<\/a><\/p>\n<\/blockquote>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Plating_Voids\"><\/span>Beschichtungsfehler<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Hohlr\u00e4ume entstehen, wenn beim Galvanisieren nicht die gesamte Durchkontaktierungsstruktur vollst\u00e4ndig mit Kupfer beschichtet wird.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Zu den h\u00e4ufigsten Ursachen geh\u00f6ren:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Verunreinigung<\/li>\n\n\n\n<li>Unzureichende Kontrolle der chemischen Zusammensetzung<\/li>\n\n\n\n<li>Schlechte Zirkulation der L\u00f6sung<\/li>\n\n\n\n<li>Unzureichende Prozess\u00fcberwachung<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Selbst kleine Hohlr\u00e4ume k\u00f6nnen die Zuverl\u00e4ssigkeit der Durchkontaktierungen erheblich beeintr\u00e4chtigen.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Microvia_Failure\"><\/span>Ausfall von Microvias<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Auf HDI-Leiterplatten kommen h\u00e4ufig lasergestanzte Mikrovias zum Einsatz.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Zu den h\u00e4ufigsten Fehlern bei Microvias geh\u00f6ren:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Durch Knacken<\/li>\n\n\n\n<li>Unvollst\u00e4ndige Kupferf\u00fcllung<\/li>\n\n\n\n<li>Trennung der Schnittstellen<\/li>\n\n\n\n<li>Erm\u00fcdung durch gestapelte Durchkontaktierungen<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Mit steigenden Betriebstemperaturen gewinnt die Zuverl\u00e4ssigkeit von Microvias zunehmend an Bedeutung.<\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p class=\"wp-block-paragraph\">Interner Link: <a href=\"https:\/\/topfastpcba.com\/de\/hdi-pcb-supplier\/\">Anbieter von HDI-Leiterplatten<\/a><\/p>\n<\/blockquote>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"330\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2026\/06\/PCB-via-1.jpg\" alt=\"PCB-Durchkontaktierung\" class=\"wp-image-8658\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2026\/06\/PCB-via-1.jpg 600w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2026\/06\/PCB-via-1-300x165.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2026\/06\/PCB-via-1-18x10.jpg 18w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2026\/06\/PCB-via-1-150x83.jpg 150w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Root_Causes_of_PCB_Via_Failures\"><\/span>Grundursachen f\u00fcr Ausf\u00e4lle von PCB-Durchkontaktierungen<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Thermal_Expansion_Mismatch\"><\/span>Unterschiedliche W\u00e4rmeausdehnung<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Verschiedene Leiterplattenmaterialien dehnen sich unterschiedlich stark aus.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Zu den wichtigsten Materialien geh\u00f6ren:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Kupfer<\/li>\n\n\n\n<li>Harzsysteme<\/li>\n\n\n\n<li>Glasfaserverst\u00e4rkung<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Wiederholte Ausdehnung und Kontraktion f\u00fchren zu mechanischer Beanspruchung innerhalb der Durchkontaktierungsstruktur.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Excessive_Assembly_Temperatures\"><\/span>Zu hohe Montagetemperaturen<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Bleifreie L\u00f6tverfahren \u00fcberschreiten in der Regel:<\/p>\n\n\n\n<pre class=\"wp-block-code\"><code>245\u00b0C\u2013260\u00b0C<\/code><\/pre>\n\n\n\n<p class=\"wp-block-paragraph\">Wiederholte thermische Belastung beschleunigt die Erm\u00fcdung von Kupfer und den Verschlei\u00df von Durchkontaktierungen.<\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p class=\"wp-block-paragraph\">Interner Link: <a href=\"https:\/\/topfastpcba.com\/de\/pcb-warpage-reflow-deformation\/\">PCB-Verformung und Reflow-Verformung<\/a><\/p>\n<\/blockquote>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Insufficient_Copper_Thickness\"><\/span>Unzureichende Kupferdicke<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Eine d\u00fcnne Beschichtung verringert die Erm\u00fcdungsfestigkeit erheblich.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Branchenstandards schreiben in der Regel eine Mindestbeschichtungsdicke vor, um eine langfristige Zuverl\u00e4ssigkeit zu gew\u00e4hrleisten.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Eine unzureichende Prozesssteuerung kann folgende Folgen haben:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Schwach \u00fcber F\u00e4sser<\/li>\n\n\n\n<li>Verminderte Strombelastbarkeit<\/li>\n\n\n\n<li>Erh\u00f6hte Rissanf\u00e4lligkeit<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Poor_PCB_Material_Quality\"><\/span>Mangelhafte Qualit\u00e4t des Leiterplattenmaterials<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Laminate minderer Qualit\u00e4t weisen h\u00e4ufig folgende Merkmale auf:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Hohe Feuchtigkeitsaufnahme<\/li>\n\n\n\n<li>Erh\u00f6hte Expansionsraten<\/li>\n\n\n\n<li>Verminderte strukturelle Stabilit\u00e4t<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Diese Faktoren verst\u00e4rken sich durch die Anh\u00e4ufung von Stress.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Improper_PCB_Design\"><\/span>Fehlerhaftes Leiterplatten-Design<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Zu den gestalterischen Aspekten geh\u00f6ren:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>\u00dcberm\u00e4\u00dfige Seitenverh\u00e4ltnisse<\/li>\n\n\n\n<li>Zu kleine Ringst\u00fccke<\/li>\n\n\n\n<li>Thermische Zonen mit hoher Dichte<\/li>\n\n\n\n<li>Mangelhafte Stapelplanung<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Die Konstruktionsoptimierung ist oft die kosteng\u00fcnstigste Ma\u00dfnahme zur Verbesserung der Zuverl\u00e4ssigkeit.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"How_to_Detect_PCB_Via_Failures\"><\/span>So erkennen Sie Fehler an Leiterplatten-Vias<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Cross-Section_Analysis\"><\/span>Querschnittsanalyse<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Die Querschnittspr\u00fcfung ist nach wie vor die effektivste Methode zur Fehleranalyse.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Ingenieure k\u00f6nnen Folgendes erkennen:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Risse im Lauf<\/li>\n\n\n\n<li>Hohlr\u00e4ume<\/li>\n\n\n\n<li>Trennungsfehler<\/li>\n\n\n\n<li>Probleme mit der Kupferdicke<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Microsection_Testing\"><\/span>Mikroschnittuntersuchung<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Die Mikroschnittanalyse liefert detaillierte Einblicke in:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Qualit\u00e4t der Lochwand<\/li>\n\n\n\n<li>Kupferverteilung<\/li>\n\n\n\n<li>Ebenenverbindungen<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Diese Methode wird bei Qualifizierungspr\u00fcfungen h\u00e4ufig angewendet.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"X-Ray_Inspection\"><\/span>R\u00f6ntgenpr\u00fcfung<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">R\u00f6ntgensysteme k\u00f6nnen Folgendes aufdecken:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Versteckte Hohlr\u00e4ume<\/li>\n\n\n\n<li>Probleme bei der Registrierung<\/li>\n\n\n\n<li>Strukturelle Anomalien<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">ohne die Platine zu besch\u00e4digen.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Thermal_Stress_Testing\"><\/span>Thermische Belastungspr\u00fcfung<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Thermische Belastungstests beschleunigen Ausfallmechanismen durch wiederholte Temperaturwechsel.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Beispiele hierf\u00fcr sind:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Thermoschock<\/li>\n\n\n\n<li>Reflow-Simulation<\/li>\n\n\n\n<li>Pr\u00fcfungen in Klimakammern<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"How_to_Prevent_PCB_Via_Failures\"><\/span>So beugen Sie Ausf\u00e4llen bei Leiterplatten-Durchkontaktierungen vor<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Improve_Hole_Wall_Preparation\"><\/span>Verbesserung der Bohrlochwandvorbereitung<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Vor der Beschichtung sollten Hersteller Folgendes sicherstellen:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Korrektes Desmear<\/li>\n\n\n\n<li>Oberfl\u00e4chen reinigen<\/li>\n\n\n\n<li>Ausreichende Rauheit<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Dadurch wird die Haftung des Kupfers verbessert.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Increase_Copper_Plating_Quality\"><\/span>Verbesserung der Qualit\u00e4t der Verkupferung<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Stabile Galvanisierungsprozesse sollten Folgendes gew\u00e4hrleisten:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Gleichm\u00e4\u00dfige Dicke<\/li>\n\n\n\n<li>Gleichm\u00e4\u00dfige Kornstruktur<\/li>\n\n\n\n<li>Geringe Fehlerquote<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Eine bessere Beschichtung verbessert direkt die Erm\u00fcdungslebensdauer.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Optimize_PCB_Stackup_Design\"><\/span>Optimierung des Leiterplatten-Schichtaufbaus<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Ausgewogene Mehrschichtstrukturen verringern die mechanische Belastung.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Zu den bew\u00e4hrten Verfahren geh\u00f6ren:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Symmetrische Stapel<\/li>\n\n\n\n<li>Kontrollierte Dielektrikumsdicke<\/li>\n\n\n\n<li>Gleichm\u00e4\u00dfige Kupferverteilung<\/li>\n<\/ul>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p class=\"wp-block-paragraph\">Interner Link: <a href=\"https:\/\/topfastpcba.com\/de\/pcb-manufacturing-processes-2\/\">PCB-Herstellungsprozess<\/a><\/p>\n<\/blockquote>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Select_Appropriate_Materials\"><\/span>W\u00e4hlen Sie geeignete Materialien aus<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Anwendungen mit hohen Zuverl\u00e4ssigkeitsanforderungen erfordern h\u00e4ufig:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Laminate mit hoher Glas\u00fcbergangstemperatur<\/li>\n\n\n\n<li>Materialien mit niedrigem CTE<\/li>\n\n\n\n<li>Substrate in Automobilqualit\u00e4t<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Conduct_Reliability_Testing\"><\/span>Zuverl\u00e4ssigkeitspr\u00fcfungen durchf\u00fchren<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Die Qualifizierungspr\u00fcfungen sollten Folgendes umfassen:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Thermisches Zyklieren<\/li>\n\n\n\n<li>IST-Pr\u00fcfung<\/li>\n\n\n\n<li>\u00dcberpr\u00fcfung des Querschnitts<\/li>\n\n\n\n<li>Beschleunigte Lebensdauerpr\u00fcfung<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Diese Methoden tragen dazu bei, versteckte Defekte an den Leitungen vor der Freigabe zur Produktion zu erkennen.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"343\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2026\/06\/PCB-via-2.jpg\" alt=\"PCB-Durchkontaktierung\" class=\"wp-image-8659\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2026\/06\/PCB-via-2.jpg 600w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2026\/06\/PCB-via-2-300x172.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2026\/06\/PCB-via-2-18x10.jpg 18w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2026\/06\/PCB-via-2-150x86.jpg 150w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Industries_Most_Affected_by_Via_Failures\"><\/span>Branchen, die am st\u00e4rksten von Durchkontaktierungsfehlern betroffen sind<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Automotive_Electronics\"><\/span>Kfz-Elektronik<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Erfahrung im Bereich Fahrzeugelektronik:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>St\u00e4ndige Vibration<\/li>\n\n\n\n<li>Thermisches Zyklieren<\/li>\n\n\n\n<li>Anforderungen an eine lange Lebensdauer<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Telecommunications_Equipment\"><\/span>Telekommunikationsger\u00e4te<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Leiterplatten mit hoher Dichte sind f\u00fcr die Signal\u00fcbertragung auf Tausende von Durchkontaktierungen angewiesen.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Power_Electronics\"><\/span>Leistungselektronik<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Anwendungen mit hohen Stromst\u00e4rken verursachen erhebliche thermische Belastungen.<\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p class=\"wp-block-paragraph\">Weiterf\u00fchrende Literatur: <a href=\"https:\/\/topfastpcba.com\/de\/power-electronics-pcb-design-ev\/\">Leistungselektronik-Leiterplattenentwurf f\u00fcr Elektrofahrzeuge<\/a><\/p>\n<\/blockquote>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Aerospace_and_Defense\"><\/span>Luft- und Raumfahrt und Verteidigung<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Aufgrund der rauen Einsatzbedingungen sind die Anforderungen an die Zuverl\u00e4ssigkeit extrem hoch.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"FAQ\"><\/span>FAQ<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1780454785236\"><strong class=\"schema-faq-question\">F: Was ist der h\u00e4ufigste Ausfallgrund bei Leiterplatten-Durchkontaktierungen?<\/strong> <p class=\"schema-faq-answer\">A: Risse im Zylinder geh\u00f6ren zu den am h\u00e4ufigsten auftretenden Ausf\u00e4llen im Zusammenhang mit der Zuverl\u00e4ssigkeit.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1780454796692\"><strong class=\"schema-faq-question\">F: Wie entstehen Durchgangsrisse?<\/strong> <p class=\"schema-faq-answer\">A: Durch Temperaturwechsel kommt es zu wiederholten Ausdehnungen und Kontraktionen, die die Kupferbeschichtung mit der Zeit erm\u00fcden.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1780454809182\"><strong class=\"schema-faq-question\">F: Was ist eine Via-Trennung?<\/strong> <p class=\"schema-faq-answer\">A: Eine Trennstelle entsteht, wenn der plattierte Zylinder die elektrische Verbindung zu einem inneren Leiterpad verliert.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1780454824138\"><strong class=\"schema-faq-question\">F: Wie l\u00e4sst sich die Zuverl\u00e4ssigkeit von Leiterplatten-Durchkontaktierungen verbessern?<\/strong> <p class=\"schema-faq-answer\">A: Die Verwendung hochwertiger Materialien, optimierter Schichtaufbauten, einer sorgf\u00e4ltigen Kontrolle der Beschichtung und Zuverl\u00e4ssigkeitspr\u00fcfungen f\u00fchrt zu einer deutlichen Leistungssteigerung.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1780454839605\"><strong class=\"schema-faq-question\">F: Sind Microvias anf\u00e4lliger f\u00fcr Ausf\u00e4lle?<\/strong> <p class=\"schema-faq-answer\">A: Microvias k\u00f6nnen bei korrekter Konstruktion und Fertigung \u00e4u\u00dferst zuverl\u00e4ssig sein, doch eine mangelhafte Prozesskontrolle erh\u00f6ht das Ausfallrisiko.<\/p> <\/div> <\/div>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span>Schlussfolgerung<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Ausf\u00e4lle von Durchkontaktierungen geh\u00f6ren zu den gr\u00f6\u00dften Zuverl\u00e4ssigkeitsproblemen bei mehrschichtigen Leiterplatten.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Zu den h\u00e4ufigen Ausfallursachen geh\u00f6ren:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Risse im Lauf<\/li>\n\n\n\n<li>Eckenrisse<\/li>\n\n\n\n<li>Durch Trennung<\/li>\n\n\n\n<li>Beschichtungsfehler<\/li>\n\n\n\n<li>Erm\u00fcdung von Microvias<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Durch eine sorgf\u00e4ltige Konstruktion, die richtige Materialauswahl, Prozesskontrolle und Zuverl\u00e4ssigkeitspr\u00fcfungen k\u00f6nnen Hersteller die Leistung erheblich verbessern und die Lebensdauer ihrer Produkte verl\u00e4ngern.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>","protected":false},"excerpt":{"rendered":"<p>Durchkontaktierungen sind entscheidende elektrische Verbindungen in mehrschichtigen Leiterplatten. Defekte an Durchkontaktierungen k\u00f6nnen zu unregelm\u00e4\u00dfigen Verbindungen, Signalverschlechterung und einem vollst\u00e4ndigen Systemausfall f\u00fchren. Dieser Leitfaden erl\u00e4utert die h\u00e4ufigsten Ursachen f\u00fcr Defekte an Leiterplatten-Durchkontaktierungen, Pr\u00fcfverfahren, Methoden zur Zuverl\u00e4ssigkeitspr\u00fcfung sowie bew\u00e4hrte Pr\u00e4ventionsstrategien, die in der modernen Leiterplattenfertigung zum Einsatz kommen.<\/p>","protected":false},"author":2,"featured_media":8660,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[228],"class_list":["post-8656","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry","tag-pcb-via"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.6 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB Via Failure Analysis: Causes, Inspection Methods and Prevention<\/title>\n<meta name=\"description\" content=\"The most common PCB via failure mechanisms, including barrel cracks, plating defects, thermal 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