{"id":6840,"date":"2025-07-15T17:45:21","date_gmt":"2025-07-15T09:45:21","guid":{"rendered":"https:\/\/topfastpcba.com\/?p=6840"},"modified":"2025-07-15T17:45:32","modified_gmt":"2025-07-15T09:45:32","slug":"what-are-the-stamp-holes-on-a-pcb","status":"publish","type":"post","link":"https:\/\/topfastpcba.com\/de\/what-are-the-stamp-holes-on-a-pcb\/","title":{"rendered":"Was sind die Stanzl\u00f6cher auf einer Leiterplatte?"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_75 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Inhalts\u00fcbersicht<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/topfastpcba.com\/de\/what-are-the-stamp-holes-on-a-pcb\/#Core_Definition_and_Functions_of_Stamp_Holes\" >Kerndefinition und Funktionen von Stempell\u00f6chern<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/topfastpcba.com\/de\/what-are-the-stamp-holes-on-a-pcb\/#Technical_Parameters_of_Stamp_Holes\" >Technische Parameter von Stempell\u00f6chern<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/topfastpcba.com\/de\/what-are-the-stamp-holes-on-a-pcb\/#Comparative_Analysis_with_V-CUT_Technology\" >Vergleichende Analyse mit V-CUT Technologie<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/topfastpcba.com\/de\/what-are-the-stamp-holes-on-a-pcb\/#V-CUT_Characteristics\" >V-CUT Merkmale<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/topfastpcba.com\/de\/what-are-the-stamp-holes-on-a-pcb\/#Key_Benefits_of_Stamp_Holes\" >Die wichtigsten Vorteile von Stempell\u00f6chern<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/topfastpcba.com\/de\/what-are-the-stamp-holes-on-a-pcb\/#IPC-Compliant_Design_Standards\" >IPC-konforme Konstruktionsstandards<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/topfastpcba.com\/de\/what-are-the-stamp-holes-on-a-pcb\/#Preferred_Design_IPC-7351_Class_A\" >Bevorzugte Ausf\u00fchrung (IPC-7351 Klasse A)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/topfastpcba.com\/de\/what-are-the-stamp-holes-on-a-pcb\/#High-Risk_Designs_Class_C\" >Hochrisikomuster (Klasse C)<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/topfastpcba.com\/de\/what-are-the-stamp-holes-on-a-pcb\/#Critical_Engineering_Practices\" >Kritische Ingenieurspraktiken<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/topfastpcba.com\/de\/what-are-the-stamp-holes-on-a-pcb\/#Typical_Application_Scenarios\" >Typische Anwendungsszenarien<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Core_Definition_and_Functions_of_Stamp_Holes\"><\/span>Kerndefinition und Funktionen von Stempell\u00f6chern<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>PCB-Stanzl\u00f6cher (auch als Breakaway Tabs oder Panelization Holes bekannt) sind Anordnungen von kleinen Durchgangsl\u00f6chern entlang von Leiterplattenkanten oder Panelverbindungen, die aufgrund ihrer \u00c4hnlichkeit mit perforierten Stempelkanten benannt wurden. Diese Struktur spielt in der Elektronikfertigung eine entscheidende Rolle:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Mechanische Verbindung und Trennbarkeit<\/strong><\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Verwendet Mikro-Durchgangsloch-Arrays (typischerweise 0,5 mm Durchmesser, gruppiert in S\u00e4tzen von 5-8) f\u00fcr tempor\u00e4re PCB-Verbindungen<\/li>\n\n\n\n<li>Erm\u00f6glicht die Trennung nach der Produktion durch mechanisches Brechen ohne spezielle Fr\u00e4sger\u00e4te<\/li>\n\n\n\n<li>Besonders geeignet f\u00fcr unregelm\u00e4\u00dfig geformte Leiterplatten (z. B. runde, nicht lineare Umrisse)<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Elektrische Konnektivit\u00e4t<\/strong><\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Dient als Leistungs-\/Signal\u00fcbertragungskanal in modularen Designs<\/li>\n\n\n\n<li>Erfordert \u00dcberlegungen zur Impedanzanpassung f\u00fcr Hochfrequenzanwendungen<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Vorteile bei der Herstellung<\/strong><\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Verbessert die Effizienz der SMT-Best\u00fcckung, da kleine Leiterplatten als Arrays durch die Produktionslinien laufen k\u00f6nnen<\/li>\n\n\n\n<li>Reduziert die Bearbeitungskosten im Vergleich zu V-CUT f\u00fcr komplexe Plattenaufteilung<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technical_Parameters_of_Stamp_Holes\"><\/span>Technische Parameter von Stempell\u00f6chern<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Parameter Kategorie<\/th><th>Standardwert<\/th><th>Toleranz<\/th><th>Wichtige \u00dcberlegungen<\/th><\/tr><\/thead><tbody><tr><td>Loch-Durchmesser<\/td><td>0,5 mm<\/td><td>\u00b10.05mm<\/td><td>Muss mehr als 1\/3 der Plattendicke betragen<\/td><\/tr><tr><td>Loch Teilung<\/td><td>0,76 mm<\/td><td>\u22650.3mm<\/td><td>Kurzschlussschutz<\/td><\/tr><tr><td>Abstand zwischen den Reihen<\/td><td>3,3 mm<\/td><td>&#8211;<\/td><td>Mechanische Festigkeitsbilanz<\/td><\/tr><tr><td>Randstreifen<\/td><td>1,0 mm<\/td><td>\u22650.5mm<\/td><td>Pr\u00e4vention von Graten<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p><strong>Besondere Gestaltungsregeln<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Hochfrequenzschaltungen: Erfordert abgeschirmte Erdungsl\u00f6cher<\/li>\n\n\n\n<li>Platten mit hoher Dichte:Empfiehlt gestaffelte zweireihige Anordnungen<\/li>\n\n\n\n<li>Starrflexible Platten:Erfordert verst\u00e4rkte Zonen<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/07\/PCB-shelf-life-1.jpg\" alt=\"Stanzl\u00f6cher auf PCBs\" class=\"wp-image-6841\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/07\/PCB-shelf-life-1.jpg 600w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/07\/PCB-shelf-life-1-300x201.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/07\/PCB-shelf-life-1-150x101.jpg 150w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Comparative_Analysis_with_V-CUT_Technology\"><\/span>Vergleichende Analyse mit V-CUT Technologie<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"V-CUT_Characteristics\"><\/span>V-CUT Merkmale<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Anwendungen<\/strong>:Geradlinige Trennung der Leiterplatten, rechteckige Standardleiterplatten<\/li>\n\n\n\n<li><strong>Vorteile<\/strong>:<\/li>\n\n\n\n<li>~30% Kostenreduzierung (eliminiert zus\u00e4tzliche Bohrschritte)<\/li>\n\n\n\n<li>Post-separation edge flatness within \u00b10.1mm<\/li>\n\n\n\n<li>Ideal f\u00fcr standardisierte Gro\u00dfserienproduktion<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Key_Benefits_of_Stamp_Holes\"><\/span>Die wichtigsten Vorteile von Stempell\u00f6chern<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Geometrische Anpassungsf\u00e4higkeit<\/strong>: Geeignet f\u00fcr gekr\u00fcmmte Trennstrecken<\/li>\n\n\n\n<li><strong>Mechanische Leistung<\/strong>:<\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>40% h\u00f6here Biegefestigkeit als V-CUT<\/li>\n\n\n\n<li>Erm\u00f6glicht kleinere Abst\u00e4nde zwischen den Platinen (mindestens 1,5 mm)<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Montage-Komfort<\/strong>:<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Bietet eine 25 % gr\u00f6\u00dfere Klebefl\u00e4che<\/li>\n\n\n\n<li>Unterst\u00fctzt modulare Demontage\/Rekonfiguration<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"IPC-Compliant_Design_Standards\"><\/span>IPC-konforme Konstruktionsstandards<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Preferred_Design_IPC-7351_Class_A\"><\/span>Bevorzugte Ausf\u00fchrung (IPC-7351 Klasse A)<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Trace-to-hole clearance \u22651mm<\/li>\n\n\n\n<li>Kupferr\u00fcckhaltequote &gt;80%<\/li>\n\n\n\n<li>Teardrop-Pad-\u00dcberg\u00e4nge<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"High-Risk_Designs_Class_C\"><\/span>Hochrisikomuster (Klasse C)<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Abstand von Spur zu Kante &lt;0,5 mm<\/li>\n\n\n\n<li>Vorhandensein von rechtwinkligen Spur\u00fcberg\u00e4ngen<\/li>\n\n\n\n<li>Fehlende L\u00f6tstopplacke<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Critical_Engineering_Practices\"><\/span>Kritische Ingenieurspraktiken<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Layout-Verbote<\/strong>:<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Keine Stanzl\u00f6cher innerhalb von 3 mm von BGA-Geh\u00e4usen<\/li>\n\n\n\n<li>Vermeiden Sie parallele Hochgeschwindigkeitssignalf\u00fchrung durch Lochanordnungen<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Verbesserungen der Zuverl\u00e4ssigkeit<\/strong>:<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Hinzuf\u00fcgen von 0,3 mm Prozessr\u00e4ndern als Pufferzonen<\/li>\n\n\n\n<li>Verst\u00e4rkung mit Kupfergewebe in stark beanspruchten Bereichen<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Pr\u00fcfungen der Herstellbarkeit<\/strong>:<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Ensure minimum hole diameter \u22651\/3 board thickness<\/li>\n\n\n\n<li>Verify whole wall copper thickness \u226518\u03bcm<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Typical_Application_Scenarios\"><\/span>Typische Anwendungsszenarien<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Tragbare Ger\u00e4te<\/strong>:<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Erm\u00f6glicht starr-flexible Zonen\u00fcberg\u00e4nge \u00fcber Stanzl\u00f6cher<\/li>\n\n\n\n<li>Beispiel: Anschl\u00fcsse des Herzfrequenzmoduls einer Smartwatch<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Industrielle Kontrollsysteme<\/strong>:<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Erm\u00f6glicht die mechanische Ausrichtung und elektrische Verbindung von gestapelten Platinen<\/li>\n\n\n\n<li>Spannungsentlastungsstrukturen in schwingungsfesten Konstruktionen<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Kfz-Elektronik<\/strong>:<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Modulare Serviceschnittstellen f\u00fcr Steuerger\u00e4te-Kontrollkarten<\/li>\n\n\n\n<li>Redundante Verbindungsl\u00f6sungen f\u00fcr vibrationsintensive Umgebungen<\/li>\n\n\n\n<li><\/li>\n<\/ul>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Beim Stanzen von Leiterplatten ist es wichtig, Ma\u00dfe wie Durchmesser und Abst\u00e4nde im Auge zu behalten. Wir vergleichen die Vorteile der Stanztechnologie und der V-CUT-Technologie. Au\u00dferdem schlagen wir ein dreistufiges Design auf der Grundlage der IPC-7351-Norm vor.<\/p>","protected":false},"author":2,"featured_media":6813,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[],"class_list":["post-6840","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.6 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>What are the stamp holes on a PCB? - Topfastpcba<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/topfastpcba.com\/de\/what-are-the-stamp-holes-on-a-pcb\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"What are the stamp holes on a PCB? - Topfastpcba\" \/>\n<meta property=\"og:description\" content=\"When it comes to PCB punching, it&#039;s key to keep an eye on measurements like diameter and spacing. 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