{"id":6675,"date":"2025-05-20T08:43:00","date_gmt":"2025-05-20T00:43:00","guid":{"rendered":"https:\/\/topfastpcba.com\/?p=6675"},"modified":"2025-05-19T17:19:53","modified_gmt":"2025-05-19T09:19:53","slug":"common-requirements-for-pcb-boards-in-pcba-processing","status":"publish","type":"post","link":"https:\/\/topfastpcba.com\/de\/common-requirements-for-pcb-boards-in-pcba-processing\/","title":{"rendered":"Gemeinsame Anforderungen f\u00fcr Leiterplatten in der PCBA-Verarbeitung"},"content":{"rendered":"<p>Im Bereich der Elektronikfertigung h\u00e4ngen Qualit\u00e4t und Effizienz der PCBA-Verarbeitung weitgehend von den Design- und Fertigungsstandards der Leiterplatten ab. Als <a href=\"https:\/\/topfastpcba.com\/de\/\">PCBA aus einer Hand<\/a> Als Anbieter intelligenter Fertigungsverfahren wissen wir, wie wichtig es ist, die besten Verfahren der Branche f\u00fcr die Produktqualit\u00e4t einzuhalten. In diesem Artikel werden sechs Kernanforderungen f\u00fcr Leiterplatten in der PCBA-Verarbeitung beschrieben, die Ihnen helfen, Produktionsprozesse zu optimieren und die Produktzuverl\u00e4ssigkeit zu verbessern.<\/p>\n\n\n\n<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_75 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Inhalts\u00fcbersicht<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/topfastpcba.com\/de\/common-requirements-for-pcb-boards-in-pcba-processing\/#PCB_Material_Selection\" >PCB-Materialauswahl<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/topfastpcba.com\/de\/common-requirements-for-pcb-boards-in-pcba-processing\/#Dimensional_Tolerance_Control\" >Kontrolle der Ma\u00dftoleranz<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/topfastpcba.com\/de\/common-requirements-for-pcb-boards-in-pcba-processing\/#Pad_Design_Specifications\" >Pad Design Spezifikationen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/topfastpcba.com\/de\/common-requirements-for-pcb-boards-in-pcba-processing\/#Trace_Design_Standards\" >Standards f\u00fcr das Spurendesign<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/topfastpcba.com\/de\/common-requirements-for-pcb-boards-in-pcba-processing\/#Via_Design_Optimization\" >\u00dcber Design-Optimierung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/topfastpcba.com\/de\/common-requirements-for-pcb-boards-in-pcba-processing\/#Surface_Finish_Technologies\" >Technologien zur Oberfl\u00e4chenbehandlung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/topfastpcba.com\/de\/common-requirements-for-pcb-boards-in-pcba-processing\/#Common_Issues_and_Solutions\" >Allgemeine Probleme und L\u00f6sungen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/topfastpcba.com\/de\/common-requirements-for-pcb-boards-in-pcba-processing\/#Conclusion_Optimizing_PCB_Design_Enhances_Overall_Value\" >Schlussfolgerung: Die Optimierung des PCB-Designs erh\u00f6ht den Gesamtwert<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"PCB_Material_Selection\"><\/span>PCB-Materialauswahl<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>Materialeigenschaften bestimmen die Anwendungsszenarien<\/strong><br>Das Material des Leiterplattensubstrats ist ein grundlegender Faktor f\u00fcr die Leistungsf\u00e4higkeit von Schaltungen. FR-4 Glasfaser-Epoxid-Laminat ist die bevorzugte Wahl f\u00fcr die meisten elektronischen Produkte aufgrund seines hervorragenden Preis-Leistungs-Verh\u00e4ltnisses, mit:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Gute mechanische Festigkeit<\/li>\n\n\n\n<li>M\u00e4\u00dfige Dielektrizit\u00e4tskonstante<\/li>\n\n\n\n<li>Hohe Kosteneffizienz<\/li>\n<\/ul>\n\n\n\n<p><strong>Besondere Anwendungsanforderungen<\/strong><br>F\u00fcr Hochfrequenzschaltungen oder Ger\u00e4te mit hoher Leistung empfehlen wir:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Keramische Substrate<\/strong>: Excellent high-temperature resistance (withstands above 300\u00b0C)<\/li>\n\n\n\n<li><strong>Aluminium-Substrate<\/strong>: Hervorragende W\u00e4rmeableitung (W\u00e4rmeleitf\u00e4higkeit bis zu 2-4W\/4W\/mK)<\/li>\n<\/ol>\n\n\n\n<p><strong>Dicke Normen<\/strong><br>The industry standard thickness is 1.6mm \u00b110%. Boards thinner than 1.0mm are prone to deformation during processing, affecting SMT placement accuracy.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcba-1-1.jpg\" alt=\"\" class=\"wp-image-6676\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcba-1-1.jpg 600w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcba-1-1-300x201.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcba-1-1-150x101.jpg 150w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Dimensional_Tolerance_Control\"><\/span>Kontrolle der Ma\u00dftoleranz<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>Normen f\u00fcr die Bearbeitung<\/strong><br>PCB outline dimensional tolerances should be strictly controlled within \u00b10.1mm, which is critical for:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Passgenauigkeit des Geh\u00e4uses<\/li>\n\n\n\n<li>Zuverl\u00e4ssigkeit der Steckerausrichtung<\/li>\n\n\n\n<li>Konsistenz der Chargenproduktion<\/li>\n<\/ul>\n\n\n\n<p><strong>Design-Empfehlungen<\/strong><br>Halten Sie an den Leiterplattenr\u00e4ndern einen Mindestabstand von 3 mm ein, um das Einspannen und Positionieren in automatisierten Produktionslinien zu erleichtern.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Pad_Design_Specifications\"><\/span>Pad Design Spezifikationen<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>Prinzip der Komponentenanpassung<\/strong><br>Das Design der Pads muss genau den Abmessungen der Bauteilstifte entsprechen:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>0603 package: Recommended pad size 0.8mm \u00d7 1.0mm<\/li>\n\n\n\n<li>SOIC-Geh\u00e4use: Pads sollten 0,3-0,5 mm \u00fcber die Pins hinausragen<\/li>\n<\/ul>\n\n\n\n<p><strong>Abstandsanforderungen<\/strong><br>Normen f\u00fcr Mindestabst\u00e4nde:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Standard components: \u22650.2mm<\/li>\n\n\n\n<li>BGA components: \u22650.15mm<\/li>\n<\/ul>\n\n\n\n<p><strong>BGA Design Schl\u00fcsselpunkte<\/strong><br>F\u00fcr BGAs mit einem Pitch von 0,5 mm wird das NSMD-Pad-Design (Non-Solder Mask Defined) empfohlen, das die Zuverl\u00e4ssigkeit beim L\u00f6ten um etwa 30 % erh\u00f6ht.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcba-2-1.jpg\" alt=\"\" class=\"wp-image-6677\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcba-2-1.jpg 600w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcba-2-1-300x201.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcba-2-1-150x101.jpg 150w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Trace_Design_Standards\"><\/span>Standards f\u00fcr das Spurendesign<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>Derzeitige Tragf\u00e4higkeit<\/strong><br>Leiterbahnbreite vs. Stromst\u00e4rke (1oz Kupferdicke):<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Stromst\u00e4rke (A)<\/th><th>Minimale Leiterbahnbreite (mm)<\/th><\/tr><\/thead><tbody><tr><td>1<\/td><td>0.25<\/td><\/tr><tr><td>3<\/td><td>0.75<\/td><\/tr><tr><td>5<\/td><td>1.50<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p><strong>Abstandsspezifikationen<\/strong><br>Gem\u00e4\u00df IPC-2221-Normen:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Low-voltage circuits (\u226430V): \u22650.1mm<\/li>\n\n\n\n<li>Medium-voltage circuits (30-100V): \u22650.6mm<\/li>\n\n\n\n<li>High-voltage circuits (\u2265100V): Calculate as 0.6mm\/kV<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Via_Design_Optimization\"><\/span>\u00dcber Design-Optimierung<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>Grunds\u00e4tze der Lochgr\u00f6\u00dfengestaltung<\/strong><br>Empfohlene Lochgr\u00f6\u00dfe: 0,2 mm gr\u00f6\u00dfer als die Komponentenstifte:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Standard-Komponenten mit Durchgangsbohrungen: 0,8-1,0 mm Lochgr\u00f6\u00dfe<\/li>\n\n\n\n<li>Designs mit hoher Dichte:Mindestens 0,3 mm (Laserbohren erforderlich)<\/li>\n<\/ul>\n\n\n\n<p><strong>Stromtragende L\u00f6sungen<\/strong><br>F\u00fcr Hochstrompfade:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Mehrere Durchkontaktierungen parallel verwenden<\/li>\n\n\n\n<li>Erh\u00f6hung der Kupferdicke (bis zu 2 Unzen)<\/li>\n\n\n\n<li>Auftragen einer leitf\u00e4higen Epoxidharzf\u00fcllung<\/li>\n<\/ol>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Surface_Finish_Technologies\"><\/span>Technologien zur Oberfl\u00e4chenbehandlung<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>Gemeinsamer Prozessvergleich<\/strong><\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Prozess-Typ<\/th><th>Thickness (\u03bcm)<\/th><th>Vorteile<\/th><th>Anwendungsszenarien<\/th><\/tr><\/thead><tbody><tr><td>HASL<\/td><td>1-25<\/td><td>Geringe Kosten<\/td><td>Unterhaltungselektronik<\/td><\/tr><tr><td>ENIG<\/td><td>Ni3-5\/Au0,05-0,1<\/td><td>Hohe Ebenheit<\/td><td>Pr\u00e4zisions-BGA<\/td><\/tr><tr><td>OSP<\/td><td>0.2-0.5<\/td><td>Umweltfreundlich<\/td><td>Produkte f\u00fcr die kurzfristige Lagerung<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p><strong>Empfehlungen zur Auswahl<\/strong><br>Hochfrequenz-Signalschaltungen sollten ENIG verwenden, was den Signalverlust um etwa 15 % reduziert.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Common_Issues_and_Solutions\"><\/span>Allgemeine Probleme und L\u00f6sungen<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>Produktion Herausforderung Gegenma\u00dfnahmen<\/strong><\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Fehler beim L\u00f6ten<\/strong>: Pad-Design optimieren + Reflow-Profil anpassen<\/li>\n\n\n\n<li><strong>Kurzschl\u00fcsse<\/strong>: Verbesserung der AOI-Inspektion + Erh\u00f6hung der Testabdeckung<\/li>\n\n\n\n<li><strong>Impedanzkontrolle<\/strong>: Verwendung von Hochfrequenzmaterialien + strenge Kontrolle der Leiterbahnbreitentoleranz<\/li>\n<\/ol>\n\n\n\n<p><strong>Qualit\u00e4tssicherungsma\u00dfnahmen<\/strong><br>Wir bieten:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>DFM (Design for Manufacturability) Analyse Dienstleistungen<\/li>\n\n\n\n<li>3D PCB-Simulationspr\u00fcfung<\/li>\n\n\n\n<li>100%ige elektrische Pr\u00fcfung<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Conclusion_Optimizing_PCB_Design_Enhances_Overall_Value\"><\/span>Schlussfolgerung: Die Optimierung des PCB-Designs erh\u00f6ht den Gesamtwert<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>Durch die Einhaltung dieser PCB-Design-Spezifikationen k\u00f6nnen die Kunden ihre Ziele erreichen:<br>\u2713 20-30% improvement in production efficiency<br>\u2713 Defect rates reduced to &lt;500ppm<br>\u2713 Approximately 25% longer product lifespan<\/p>\n\n\n\n<p>Wir empfehlen, Experten f\u00fcr die Herstellung von Leiterplatten bereits in der fr\u00fchen Phase des Produktdesigns einzubeziehen, um kostspielige \u00c4nderungen in einem sp\u00e4ten Stadium durch gemeinsames Design zu vermeiden. Die Optimierung des Leiterplattendesigns verbessert nicht nur die Produktzuverl\u00e4ssigkeit, sondern senkt auch die Gesamtproduktionskosten erheblich und verschafft Ihren Produkten damit einen Wettbewerbsvorteil auf dem Markt.<\/p>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Entdecken Sie die 6 wesentlichen Anforderungen an Leiterplatten f\u00fcr eine optimale PCBA-Verarbeitung, einschlie\u00dflich Materialauswahl, Ma\u00dftoleranzen, Pad-Design und Oberfl\u00e4chenbeschaffenheit.<\/p>","protected":false},"author":2,"featured_media":6678,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[],"class_list":["post-6675","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.6 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Common Requirements for PCB Boards in PCBA Processing - 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Topfastpcba\",\"isPartOf\":{\"@id\":\"https:\/\/topfastpcba.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/topfastpcba.com\/common-requirements-for-pcb-boards-in-pcba-processing\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/topfastpcba.com\/common-requirements-for-pcb-boards-in-pcba-processing\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcba-4-1.jpg\",\"datePublished\":\"2025-05-20T00:43:00+00:00\",\"author\":{\"@id\":\"https:\/\/topfastpcba.com\/#\/schema\/person\/3c78a799254faaf83da2317660076c6e\"},\"description\":\"Discover the 6 essential PCB board requirements for optimal PCBA processing, including material selection, dimensional tolerances, pad design, and surface finishes.\",\"breadcrumb\":{\"@id\":\"https:\/\/topfastpcba.com\/common-requirements-for-pcb-boards-in-pcba-processing\/#breadcrumb\"},\"inLanguage\":\"de\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/topfastpcba.com\/common-requirements-for-pcb-boards-in-pcba-processing\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"de\",\"@id\":\"https:\/\/topfastpcba.com\/common-requirements-for-pcb-boards-in-pcba-processing\/#primaryimage\",\"url\":\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcba-4-1.jpg\",\"contentUrl\":\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcba-4-1.jpg\",\"width\":600,\"height\":402,\"caption\":\"18-Layer PCB\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/topfastpcba.com\/common-requirements-for-pcb-boards-in-pcba-processing\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/topfastpcba.com\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Industry\",\"item\":\"https:\/\/topfastpcba.com\/category\/industry\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"Common Requirements for PCB Boards in PCBA Processing\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/topfastpcba.com\/#website\",\"url\":\"https:\/\/topfastpcba.com\/\",\"name\":\"Topfastpcba\",\"description\":\"Topfast Prime Choice for Global Electronics Manufacturing\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/topfastpcba.com\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"de\"},{\"@type\":\"Person\",\"@id\":\"https:\/\/topfastpcba.com\/#\/schema\/person\/3c78a799254faaf83da2317660076c6e\",\"name\":\"topfastpcb\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Common Requirements for PCB Boards in PCBA Processing - Topfastpcba","description":"Discover the 6 essential PCB board requirements for optimal PCBA processing, including material selection, dimensional tolerances, pad design, and surface finishes.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/topfastpcba.com\/de\/common-requirements-for-pcb-boards-in-pcba-processing\/","og_locale":"de_DE","og_type":"article","og_title":"Common Requirements for PCB Boards in PCBA Processing - Topfastpcba","og_description":"Discover the 6 essential PCB board requirements for optimal PCBA processing, including material selection, dimensional tolerances, pad design, and surface finishes.","og_url":"https:\/\/topfastpcba.com\/de\/common-requirements-for-pcb-boards-in-pcba-processing\/","og_site_name":"Topfastpcba","article_published_time":"2025-05-20T00:43:00+00:00","og_image":[{"width":600,"height":402,"url":"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcba-4-1.jpg","type":"image\/jpeg"}],"author":"topfastpcb","twitter_card":"summary_large_image","twitter_misc":{"Verfasst von":"topfastpcb","Gesch\u00e4tzte Lesezeit":"3\u00a0Minuten"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/topfastpcba.com\/common-requirements-for-pcb-boards-in-pcba-processing\/","url":"https:\/\/topfastpcba.com\/common-requirements-for-pcb-boards-in-pcba-processing\/","name":"Common Requirements for PCB Boards in PCBA Processing - Topfastpcba","isPartOf":{"@id":"https:\/\/topfastpcba.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/topfastpcba.com\/common-requirements-for-pcb-boards-in-pcba-processing\/#primaryimage"},"image":{"@id":"https:\/\/topfastpcba.com\/common-requirements-for-pcb-boards-in-pcba-processing\/#primaryimage"},"thumbnailUrl":"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcba-4-1.jpg","datePublished":"2025-05-20T00:43:00+00:00","author":{"@id":"https:\/\/topfastpcba.com\/#\/schema\/person\/3c78a799254faaf83da2317660076c6e"},"description":"Discover the 6 essential PCB board requirements for optimal PCBA processing, including material selection, dimensional tolerances, pad design, and surface finishes.","breadcrumb":{"@id":"https:\/\/topfastpcba.com\/common-requirements-for-pcb-boards-in-pcba-processing\/#breadcrumb"},"inLanguage":"de","potentialAction":[{"@type":"ReadAction","target":["https:\/\/topfastpcba.com\/common-requirements-for-pcb-boards-in-pcba-processing\/"]}]},{"@type":"ImageObject","inLanguage":"de","@id":"https:\/\/topfastpcba.com\/common-requirements-for-pcb-boards-in-pcba-processing\/#primaryimage","url":"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcba-4-1.jpg","contentUrl":"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/05\/pcba-4-1.jpg","width":600,"height":402,"caption":"18-Layer PCB"},{"@type":"BreadcrumbList","@id":"https:\/\/topfastpcba.com\/common-requirements-for-pcb-boards-in-pcba-processing\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/topfastpcba.com\/"},{"@type":"ListItem","position":2,"name":"Industry","item":"https:\/\/topfastpcba.com\/category\/industry\/"},{"@type":"ListItem","position":3,"name":"Common Requirements for PCB Boards in PCBA Processing"}]},{"@type":"WebSite","@id":"https:\/\/topfastpcba.com\/#website","url":"https:\/\/topfastpcba.com\/","name":"Topfastpcba","description":"Topfast Prime Choice for Global Electronics Manufacturing","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/topfastpcba.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"de"},{"@type":"Person","@id":"https:\/\/topfastpcba.com\/#\/schema\/person\/3c78a799254faaf83da2317660076c6e","name":"topfastpcb"}]}},"_links":{"self":[{"href":"https:\/\/topfastpcba.com\/de\/wp-json\/wp\/v2\/posts\/6675","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/topfastpcba.com\/de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/topfastpcba.com\/de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/topfastpcba.com\/de\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/topfastpcba.com\/de\/wp-json\/wp\/v2\/comments?post=6675"}],"version-history":[{"count":1,"href":"https:\/\/topfastpcba.com\/de\/wp-json\/wp\/v2\/posts\/6675\/revisions"}],"predecessor-version":[{"id":6679,"href":"https:\/\/topfastpcba.com\/de\/wp-json\/wp\/v2\/posts\/6675\/revisions\/6679"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/topfastpcba.com\/de\/wp-json\/wp\/v2\/media\/6678"}],"wp:attachment":[{"href":"https:\/\/topfastpcba.com\/de\/wp-json\/wp\/v2\/media?parent=6675"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/topfastpcba.com\/de\/wp-json\/wp\/v2\/categories?post=6675"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/topfastpcba.com\/de\/wp-json\/wp\/v2\/tags?post=6675"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}