{"id":1543,"date":"2025-04-22T14:39:11","date_gmt":"2025-04-22T06:39:11","guid":{"rendered":"https:\/\/topfastpcba.com\/?p=1543"},"modified":"2025-04-22T14:40:23","modified_gmt":"2025-04-22T06:40:23","slug":"pcb-electroplating-process","status":"publish","type":"post","link":"https:\/\/topfastpcba.com\/de\/pcb-electroplating-process\/","title":{"rendered":"PCB-Galvanisierungsprozess"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_75 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Inhalts\u00fcbersicht<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/topfastpcba.com\/de\/pcb-electroplating-process\/#Classification_of_Electroplating_Processes\" >Klassifizierung von Galvanisierungsverfahren<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/topfastpcba.com\/de\/pcb-electroplating-process\/#Process_Flow\" >Prozessablauf<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/topfastpcba.com\/de\/pcb-electroplating-process\/#1_Acid_Dipping\" >1. Eintauchen in S\u00e4ure<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/topfastpcba.com\/de\/pcb-electroplating-process\/#2_Panel_Plating_Primary_Copper_Plating\" >2.Paneelbeschichtung (Prim\u00e4rverkupferung)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/topfastpcba.com\/de\/pcb-electroplating-process\/#3_Acid_Cleaning\" >3.S\u00e4urereinigung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/topfastpcba.com\/de\/pcb-electroplating-process\/#4_Microetching\" >4.Mikro\u00e4tzung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/topfastpcba.com\/de\/pcb-electroplating-process\/#5_Pattern_Copper_Plating\" >5.Muster Verkupferung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/topfastpcba.com\/de\/pcb-electroplating-process\/#6_Tin_Plating\" >6.Verzinnen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/topfastpcba.com\/de\/pcb-electroplating-process\/#7_Gold_Plating\" >7.Vergoldung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/topfastpcba.com\/de\/pcb-electroplating-process\/#8_Nickel_Plating\" >8.Vernickeln<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/topfastpcba.com\/de\/pcb-electroplating-process\/#Critical_Notes\" >Kritische Anmerkungen<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Classification_of_Electroplating_Processes\"><\/span><strong>Klassifizierung von Galvanisierungsverfahren<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>Sauer gl\u00e4nzende Verkupferung, Vernickelung, Vergoldung, Verzinnung<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Process_Flow\"><\/span><strong>Prozessablauf<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Acid Dip \u2192<\/li>\n\n\n\n<li>Panel Plating (Copper) \u2192<\/li>\n\n\n\n<li>Pattern Transfer \u2192<\/li>\n\n\n\n<li>Acid Cleaning \u2192<\/li>\n\n\n\n<li>Two-Stage Countercurrent Rinsing \u2192<\/li>\n\n\n\n<li>Microetching \u2192<\/li>\n\n\n\n<li>Two-Stage Countercurrent Rinsing \u2192<\/li>\n\n\n\n<li>Acid Dip \u2192<\/li>\n\n\n\n<li>Tin Plating \u2192<\/li>\n\n\n\n<li>Two-Stage Countercurrent Rinsing \u2192<\/li>\n\n\n\n<li>Acid Dip \u2192<\/li>\n\n\n\n<li>Pattern Copper Plating \u2192<\/li>\n\n\n\n<li>Two-Stage Countercurrent Rinsing \u2192<\/li>\n\n\n\n<li>Nickel Plating \u2192<\/li>\n\n\n\n<li>Two-Stage Water Rinsing \u2192<\/li>\n\n\n\n<li>Citric Acid Dip \u2192<\/li>\n\n\n\n<li>Gold Plating \u2192<\/li>\n\n\n\n<li>Recovery Rinse \u2192<\/li>\n\n\n\n<li>2-3 Stage DI Water Rinsing \u2192<\/li>\n\n\n\n<li>Trocknen<\/li>\n<\/ol>\n\n\n\n<p><em>(Hinweis: Gegenstromsp\u00fclung ist eine wassersparende Sp\u00fclmethode, bei der das Frischwasser entgegen der Bewegung des Werkst\u00fccks flie\u00dft).<\/em><\/p>\n\n\n\n<h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Acid_Dipping\"><\/span><strong>1. Eintauchen in S\u00e4ure<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Zweck<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Oberfl\u00e4chenoxide entfernen und die Platte aktivieren<\/li>\n\n\n\n<li>Schwefels\u00e4urekonzentration: 5%-10% (verhindert verd\u00fcnnungsinduzierte Instabilit\u00e4t)<\/li>\n<\/ul>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Schl\u00fcsselkontrollen<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Zeit: Vermeiden Sie \u00fcberm\u00e4\u00dfiges Eintauchen, um Oxidation zu vermeiden.<\/li>\n\n\n\n<li>Wartung: Auswechseln, wenn die Tr\u00fcbung oder der Kupfergehalt 20 g\/l \u00fcberschreitet<\/li>\n\n\n\n<li>Chemisch: Schwefels\u00e4ure in CP-Qualit\u00e4t verwenden<\/li>\n<\/ul>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Panel_Plating_Primary_Copper_Plating\"><\/span><strong>2.Paneelbeschichtung (Prim\u00e4rverkupferung)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Zweck<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Sch\u00fctzt d\u00fcnne stromlose Kupferschichten vor Oxidation\/\u00c4tzung<\/li>\n<\/ul>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Prozess-Parameter<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>High-acid, low-copper formula (H\u2082SO\u2084: 180-240g\/L, CuSO\u2084: 75g\/L)<\/li>\n\n\n\n<li>Zusatzstoffe: Chloridionen (Aufhellerhilfe), Kupferaufheller (3-5ml\/L Anfangsdosis)<\/li>\n\n\n\n<li>Current density: 2A\/dm\u00b2 (Calculation: Panel length \u00d7 width \u00d7 2 \u00d7 2A\/dm\u00b2)<\/li>\n\n\n\n<li>Temperature: 22-32\u00b0C (cooling system recommended)<\/li>\n<\/ul>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Wartung<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>T\u00e4glich<\/strong>: Nachf\u00fcllen von Aufhellern (100-150ml\/KAH), Kontrolle der Filterpumpe<\/li>\n\n\n\n<li><strong>W\u00f6chentlich<\/strong>: Composition analysis (CuSO\u2084\/H\u2082SO\u2084\/Cl\u207b), Hull cell testing<\/li>\n\n\n\n<li><strong>Monatlich<\/strong>: Anodenkorbreinigung, Kohlefilterung (6-8 Stunden)<\/li>\n\n\n\n<li><strong>J\u00e4hrlich<\/strong>Kohlenstoffbehandlung (je nach Bedarf)<\/li>\n<\/ul>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Wichtige Behandlungsverfahren<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Anode prep: Micro-etching \u2192 Alkaline\/acid soaking<\/li>\n\n\n\n<li>Bath treatment: H\u2082O\u2082 oxidation \u2192 Carbon adsorption \u2192 Filtration \u2192 Electrolysis<\/li>\n\n\n\n<li>Parameter adjustment: Restore H\u2082SO\u2084\/CuSO\u2084\/Cl\u207b levels<\/li>\n<\/ul>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Acid_Cleaning\"><\/span><strong>3.S\u00e4urereinigung<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Zweck<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Oxide\/R\u00fcckst\u00e4nde entfernen, um die Haftung f\u00fcr die Beschichtung von Mustern zu gew\u00e4hrleisten<\/li>\n\n\n\n<li><strong>sauer (nicht alkalisch)<\/strong>: Verhindert Resistenzsch\u00e4den<\/li>\n<\/ul>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Kontrolliert<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Konzentration: 10%<\/li>\n\n\n\n<li>Time: \u22656 minutes<\/li>\n\n\n\n<li>Bath life: 15m\u00b2\/L working solution<\/li>\n<\/ul>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Microetching\"><\/span><strong>4.Mikro\u00e4tzung<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Zweck<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Aufrauen der Kupferoberfl\u00e4che f\u00fcr eine bessere Bindung<\/li>\n<\/ul>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Parameter<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>\u00c4tzmittel: Natriumpersulfat (60g\/L)<\/li>\n\n\n\n<li>Zeit: 20 Sekunden<\/li>\n\n\n\n<li>Kupfer-Grenzwert: &lt;20g\/L<\/li>\n<\/ul>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_Pattern_Copper_Plating\"><\/span><strong>5.Muster Verkupferung<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Zweck<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Aufbau der Kupferdicke f\u00fcr die Strombelastbarkeit<\/li>\n<\/ul>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Prozess<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Wie bei der Plattenbeschichtung<\/li>\n<\/ul>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"6_Tin_Plating\"><\/span><strong>6.Verzinnen<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Zweck<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Dient als \u00c4tzresist f\u00fcr Schaltkreise<\/li>\n<\/ul>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Parameter<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Bath: Stannous sulfate (35g\/L), H\u2082SO\u2084 (10%)<\/li>\n\n\n\n<li>Current density: 1.5A\/dm\u00b2<\/li>\n\n\n\n<li>Temperature: 22-30\u00b0C (cooling required)<\/li>\n<\/ul>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Wartung<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Regelm\u00e4\u00dfige Analyse, Reinigung der Anodenbeutel, Kohlenstoffbehandlung<\/li>\n<\/ul>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"7_Gold_Plating\"><\/span><strong>7.Vergoldung<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Typen &amp; Zweck<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Hartgold<\/strong> (Ni\/Co-Legierung): Abriebfestigkeit<\/li>\n\n\n\n<li><strong>Weiches Gold<\/strong> (rein): L\u00f6tbarkeit<\/li>\n<\/ul>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Parameter<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Citrate-based bath: Au 1g\/L, pH 4.5, 35\u00b0C<\/li>\n\n\n\n<li>Vor-Behandlung:Zitronens\u00e4ure-Tauchbad zur Minimierung der Kontamination<\/li>\n<\/ul>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Kritische Kontrollen<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Anode: Platinbeschichtetes Titan (Edelstahl vermeiden)<\/li>\n\n\n\n<li>Nachbehandlung:Alkalisches Tauchbad zum Schutz vor Oxidation<\/li>\n<\/ul>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"8_Nickel_Plating\"><\/span><strong>8.Vernickeln<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Zweck<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Barriereschicht gegen Cu\/Au-Diffusion; verbessert die mechanische Festigkeit<\/li>\n<\/ul>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Parameter<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Current density: 2A\/dm\u00b2<\/li>\n\n\n\n<li>Temperature: 50\u00b0C (heating required)<\/li>\n<\/ul>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Wartung<\/strong><\/li>\n<\/ol>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Regelm\u00e4\u00dfiger Nachschub an Nickelsulfamat\/Chlorid und Bors\u00e4ure<\/li>\n\n\n\n<li>Anoden-Nickel-Pellets erfordern eine Aufrauhung der Oberfl\u00e4che<\/li>\n<\/ul>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Critical_Notes\"><\/span><strong>Kritische Anmerkungen<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Sicherheit<\/strong>: Incremental H\u2082SO\u2084 addition to avoid thermal runaway<\/li>\n\n\n\n<li><strong>Pr\u00e4zision<\/strong>: Die Chloriddosierung (30-90ppm) erfordert eine genaue Messung<\/li>\n\n\n\n<li><strong>Kontrolle der Kontamination<\/strong>: Kohlenstoffbehandlung + Schwachstromelektrolyse<\/li>\n<\/ol>\n\n\n\n<p>Dieser standardisierte Prozess gew\u00e4hrleistet eine gleichm\u00e4\u00dfige Schichtdicke, Haftung und Zuverl\u00e4ssigkeit.<\/p>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Der Beschichtungsprozess ist zu einem wichtigen Teil des PCB-Herstellungsprozesses geworden. Die Beschichtung erh\u00f6ht nicht nur die Leitf\u00e4higkeit der Leiterplattenoberfl\u00e4che und verbessert die L\u00f6tleistung, sondern sch\u00fctzt die Leiterplatte auch wirksam vor Umwelteinfl\u00fcssen.<\/p>","protected":false},"author":2,"featured_media":1545,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[],"class_list":["post-1543","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.6 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB Electroplating Process - Topfastpcba<\/title>\n<meta name=\"description\" content=\"Plating process has become an important part of the PCB manufacturing process. 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