{"id":1165,"date":"2025-03-15T15:05:14","date_gmt":"2025-03-15T07:05:14","guid":{"rendered":"https:\/\/topfastpcba.com\/?p=1165"},"modified":"2025-03-21T11:52:18","modified_gmt":"2025-03-21T03:52:18","slug":"what-are-the-pcb-surface-treatment-processes","status":"publish","type":"post","link":"https:\/\/topfastpcba.com\/de\/what-are-the-pcb-surface-treatment-processes\/","title":{"rendered":"Welche Verfahren zur Oberfl\u00e4chenbehandlung von Leiterplatten gibt es, und welche Vor- und Nachteile haben sie?"},"content":{"rendered":"<p>Der Prozess der PCB-Oberfl\u00e4chenbehandlung bezieht sich auf die <a href=\"https:\/\/topfastpcba.com\/de\/flexible-pcb\/\">PCB-Platine<\/a> Komponenten, elektrische Verbindungen auf die k\u00fcnstliche Bildung einer Schicht, und das Substrat &#8217;s mechanische, physikalische und chemische Eigenschaften der Oberfl\u00e4chenschicht, der Kern Zweck ist es, sicherzustellen, dass die PCB hat eine gute L\u00f6tbarkeit und elektrischen Eigenschaften. G\u00e4ngige Verfahren zur Oberfl\u00e4chenbehandlung von Leiterplatten sind Hei\u00dfluftnivellierung (HASL), organische Beschichtung (OSP), chemische Vernickelung\/Tauchvergoldung (ENIG), Tauchversilberung, Tauchverzinnung und andere Nickel-Gold-Beschichtungen sowie chemische Palladium-Beschichtungsverfahren.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-large is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"617\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes1-1024x617.jpg\" alt=\"\" class=\"wp-image-1166\" style=\"width:600px\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes1-1024x617.jpg 1024w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes1-300x181.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes1-768x462.jpg 768w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes1-150x90.jpg 150w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes1.jpg 1058w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n<\/div>\n\n\n<p>1, Hei\u00dfluftl\u00f6tung Nivellierung (HASL) ist eine traditionelle PCB-Oberfl\u00e4chenbehandlung Technologie, durch die PCB-Oberfl\u00e4che mit einer Schicht aus geschmolzenem Lot beschichtet, und die Verwendung von Hei\u00dfluft, um es flach zu machen.Anwendbar auf SMT-Prozess, bleifreies L\u00f6ten, ausgereifter Prozess, niedrige Kosten, einfach zu bedienen, geeignet f\u00fcr allgemeine Anforderungen von elektronischen Produkten, besonders dicke oder d\u00fcnne Platten haben Einschr\u00e4nkungen, nicht geeignet f\u00fcr Kontaktschalter Design.<br>2\u3001Organic coating process (OSP) is a thin layer of organic protective film coated on the surface of the PCB, this film can prevent the oxidation of copper foil, and improve solderability. Suitable for lead-free soldering and SMT, low cost, environmentally friendly, OSP process is environmentally friendly, low cost, suitable for short-term storage and soldering of PCBs, the limitations of the number of reflow soldering, not suitable for crimping technology, wire bonding, and storage conditions require high.<br>3, chemisches Vernickeln\/Tauchvergoldung (ENIG) ist eine Schicht aus Nickel, die chemisch auf die Oberfl\u00e4che der Leiterplatte aufgebracht wird, und dann eine Tauchvergoldung.Anwendbar auf PTH (plated through-hole), flache Oberfl\u00e4che, bleifrei, gute L\u00f6tbarkeit und Korrosionsbest\u00e4ndigkeit, teuer, nicht nacharbeitbar, lange Haltbarkeit, geeignet f\u00fcr High-Density, Fine-Pitch-Elektronik-Produkte.<br>4, die Immersion Silber Prozess ist die Bildung einer Schicht von Silber auf der Oberfl\u00e4che der Leiterplatte, mit guter Leitf\u00e4higkeit und L\u00f6tbarkeit.Hohe L\u00f6tbarkeit, gute Oberfl\u00e4chenebenheit, niedrige Kosten und bleifrei (RoHS-konform), niedriger \u00dcbergangswiderstand, geeignet f\u00fcr Hochfrequenzschaltungen, hohe Lagerungsanforderungen, Silber ist leicht zu oxidieren, leicht zu verunreinigen, kurzes Montagefenster nach dem Entfernen aus dem Paket, was die L\u00f6tbarkeit und Korrosionsbest\u00e4ndigkeit beeintr\u00e4chtigt.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"851\" height=\"495\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes.jpg\" alt=\"\" class=\"wp-image-1167\" style=\"width:600px\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes.jpg 851w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes-300x175.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes-768x447.jpg 768w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes-390x228.jpg 390w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes-150x87.jpg 150w\" sizes=\"auto, (max-width: 851px) 100vw, 851px\" \/><\/figure>\n<\/div>\n\n\n<p>5, Chemisch Zinn Prozess ist mit einer Schicht aus Zinn auf der Oberfl\u00e4che der Leiterplatte beschichtet, geeignet f\u00fcr Fine Pitch \/ BGA \/ kleinere Komponenten, ausgezeichnete Ebenheit erreicht werden kann, mittlere Kosten, gute L\u00f6tbarkeit, aber schlechte Korrosionsbest\u00e4ndigkeit, geeignet f\u00fcr Gelegenheiten, die hohe L\u00f6tbarkeit erfordern, empfindlich auf die Handhabung, kurze Haltbarkeit, erosive auf die L\u00f6tmaske.<br>6, chemische Vernickelung &#8211; chemische Palladium-Beschichtung Immersion Gold (ENEPIG) ist durch das Reduktionsmittel (z. B. Natriumdihydrogenhypophosphit), so dass Palladium-Ionen in der katalytischen Oberfl\u00e4che Reduktion in Palladium, das neugeborene Palladium kann aufgerufen werden, um die Reaktion des Katalysators zu f\u00f6rdern, und so kann bei jeder Dicke von Palladium-\u00fcberzogene Schicht erhalten werden, umweltfreundlicher als die ENIG, k\u00f6nnen gute elektrische Eigenschaften und Schutz, mit guten Schwei\u00df-Zuverl\u00e4ssigkeit, thermische Stabilit\u00e4t, Oberfl\u00e4che Ebenheit bieten. Der Nachteil ist, dass Palladium ein seltenes Edelmetall ist, wodurch sich die Kosten erh\u00f6hen.<br>7, Hartgold (elektrolytische Hartgold) ist in der PCB-Oberfl\u00e4che Leiter zun\u00e4chst auf einer Schicht aus Nickel beschichtet und dann auf einer Schicht aus Gold, Nickel-Beschichtung ist vor allem auf die Diffusion von Gold und Kupfer zwischen dem Schwei\u00dfen zu verhindern wird dazu f\u00fchren, dass galvanische Gold wird spr\u00f6de, die die Lebensdauer verk\u00fcrzen wird, und daher zu vermeiden, L\u00f6ten auf der galvanischen Gold.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"790\" height=\"524\" src=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes2.jpg\" alt=\"\" class=\"wp-image-1168\" style=\"width:600px\" srcset=\"https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes2.jpg 790w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes2-300x199.jpg 300w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes2-768x509.jpg 768w, https:\/\/topfastpcba.com\/wp-content\/uploads\/2025\/03\/processes2-150x99.jpg 150w\" sizes=\"auto, (max-width: 790px) 100vw, 790px\" \/><\/figure>\n<\/div>\n\n\n<p>Die Wahl des richtigen PCB-Oberfl\u00e4chenbehandlungsverfahrens kann die Leistung und Zuverl\u00e4ssigkeit elektronischer Produkte erheblich verbessern, aber auch Kosten einsparen. Topfast PCBA ist spezialisiert auf kleine und mittlere Volumen von PCB\/<a href=\"https:\/\/topfastpcba.com\/de\/\">PCBA<\/a> One-Stop-Service-Fertigung, Auswahl der richtigen L\u00f6sung f\u00fcr Ihr Projekt und Bereitstellung professioneller und effizienter L\u00f6sungen f\u00fcr die Elektronikfertigung.<\/p>","protected":false},"excerpt":{"rendered":"<p>PCB Oberfl\u00e4chenbehandlung Prozess, bezieht sich auf die Leiterplatte Komponenten, elektrische Verbindungen auf die k\u00fcnstliche Bildung einer Schicht und das Substrat mechanische, physikalische und chemische Eigenschaften der Oberfl\u00e4chenschicht, der Kern Zweck ist es, sicherzustellen, dass die PCB hat eine gute L\u00f6tbarkeit und elektrischen Eigenschaften. <\/p>","protected":false},"author":2,"featured_media":1167,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[10],"tags":[53,63],"class_list":["post-1165","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry","tag-pcb-board","tag-surface-treatment-process"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.6 - 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